Jan I Ben

US Patent:

20050027766, Feb 3, 2005

Filed:

Jul 29, 2003

Appl. No.:

10/629486

Inventors:

Jan Ben - Lawrenceville NJ, US
Christopher Burges - Bellevue WA, US
Madjid Mousavi - Howell NJ, US
Craig Nohl - Middletown NJ, US

International Classification:

G06F017/10

US Classification:

708300000

Abstract:

The content of a media program is recognized by analyzing its audio content to extract therefrom prescribed features, which are compared to a database of features associated with identified content. The identity of the content within the database that has features that most closely match the features of the media program being played is supplied as the identity of the program being played. The features are extracted from a frequency domain version of the media program by a) filtering the coefficients to reduce their number, e.g., using triangular filters; b) grouping a number of consecutive outputs of triangular filters into segments; and c) selecting those segments that meet prescribed criteria, such as those segments that have the largest minimum segment energy with prescribed constraints that prevent the segments from being too close to each other. The triangular filters may be log-spaced and their output may be normalized.

US Patent:

49002147, Feb 13, 1990

Filed:

May 25, 1988

Appl. No.:

7/198347

Inventors:

Jan I. Ben - Lawrenceville NJ

Assignee:

American Telephone and Telegraph Company - New York NY

International Classification:

B65G 106

US Classification:

414416

Abstract:

An apparatus for releasably engaging a semiconductor wafer (12) comprises a frame (18) adapted for engagement by a robotic arm (26). The frame mounts one end of an elongated arm (30) dimensioned for insertion into a pocket (14) in a wafer-carrying cassette (16). The arm has a first jaw (34) depending from its end distant from the frame for engaging a portion of the edge of the wafer. A second jaw (38) extends through a slot (46) in the arm so as to be opposite the first jaw for engaging a portion of the edge of the wafer diametrically opposed to that engaged by the first jaw. The second jaw is displaced to and from the first jaw by a pneumatic cylinder (48) to enable the wafer to be releasably captured between the jaws without any damage to the surfaces of the wafer.