James H Tsung

US Patent:

6376807, Apr 23, 2002

Filed:

Jul 9, 1999

Appl. No.:

09/350619

Inventors:

Richard Hong - San Jose CA
James H. Tsung - San Jose CA
Gunnar Vatvedt - Los Gatos CA
Peijun Ding - San Jose CA
Arvind Sundarrajan - Santa Clara CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05B 338

US Classification:

2194441

Abstract:

The present invention generally provides a substrate processing system having a thermally conductive and electrically insulative member coupled to a heated member that provides for heat dissipation from the heated member. In a preferred embodiment, the present invention provides for heat dissipation through thermal conductance of an electrically insulated coil in an IMP reaction chamber.

US Patent:

6580057, Jun 17, 2003

Filed:

Dec 10, 2001

Appl. No.:

10/016350

Inventors:

Richard Hong - San Jose CA
James H. Tsung - San Jose CA
Gunnar Vatvedt - Los Gatos CA
Peijun Ding - San Jose CA
Arvind Sundarrajan - Santa Clara CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05B 368

US Classification:

2194441, 118723 I

Abstract:

The present invention generally provides a substrate processing system having a thermally conductive and electrically insulative member coupled to a heated member that provides for heat dissipation from the heated member. In a preferred embodiment, the present invention provides for heat dissipation through thermal conductance of an electrically insulated coil in an IMP reaction chamber.

US Patent:

6797131, Sep 28, 2004

Filed:

Nov 12, 2002

Appl. No.:

10/293641

Inventors:

Alan Barry Liu - Mountain View CA
James Tsung - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 1434

US Classification:

20419238, 20429811, 20429841, 427446

Abstract:

A method and apparatus for forming a coating on a sputter chamber workpiece. The apparatus generally includes a sputter chamber having at least one workpiece. The at least one workpiece generally includes one or more trenches formed therein, the trenches being configured to define an arc spray coating region. The method generally includes forming one or more trenches in the workpiece, the trenches defining a coating region and applying a metal coating to the coating region by arc spraying.

US Patent:

6841050, Jan 11, 2005

Filed:

May 21, 2002

Appl. No.:

10/152494

Inventors:

Ilyoung Richard Hong - San Jose CA, US
James Tsung - San Jose CA, US
Daniel Clarence Lubben - San Jose CA, US
Peijun Ding - San Jose CA, US
Nirmalya Maity - Los Altos CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 1435

US Classification:

2042982, 20419212

Abstract:

A small magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly passes through the target center, thus allowing full target coverage. A properly chosen ratio of the two rotations about respective axes produces a much slower magnet velocity near the target periphery than at the target center. A geared planetary mechanism includes a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plane supporting a cantilevered magnet assembly on the side of the drive plate facing the target. A belted planetary mechanism includes a fixed center capstan, a follower pulley supporting the magnet assembly, and a belt wrapped around them.

US Patent:

6852202, Feb 8, 2005

Filed:

Apr 17, 2003

Appl. No.:

10/418710

Inventors:

Michael Andrew Miller - Sunnyvale CA, US
James H. Tsung - San Jose CA, US
Daniel C. Lubben - Santa Clara CA, US
Ilyoung Richard Hong - San Jose CA, US
Peijun Ding - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C014/35

US Classification:

20419213, 20419212, 20429803, 2042982, 20429816

Abstract:

A small unbalanced magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly may pass through the target center, thus allowing full target coverage. A geared planetary mechanism may include a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plate supporting a cantilevered magnet assembly on the side of the drive plate facing the target. The erosion profile may be controlled by varying the rotation rate through the rotation cycle or by modulating the target power. A second planetary stage may be added or non-circular gears be used. Auxiliary electromagnetic coils may create a focusing magnetic field.

US Patent:

7169271, Jan 30, 2007

Filed:

Jun 7, 2004

Appl. No.:

10/862257

Inventors:

Ilyoung Richard Hong - San Jose CA, US
James Tsung - San Jose CA, US
Daniel Clarence Lubben - San Jose CA, US
Peijun Ding - San Jose CA, US
Nirmalya Maity - Los Altos CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 14/35

US Classification:

2042982, 20419212

Abstract:

A small magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly passes through the target center, thus allowing full target coverage. A properly chosen ratio of the two rotations about respective axes produces a much slower magnet velocity near the target periphery than at the target center. A geared planetary mechanism includes a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plane supporting a cantilevered magnet assembly on the side of the drive plate facing the target. A belted planetary mechanism includes a fixed center capstan, a follower pulley supporting the magnet assembly, and a belt wrapped around them.

US Patent:

7807030, Oct 5, 2010

Filed:

Dec 14, 2006

Appl. No.:

11/610849

Inventors:

Ilyoung Richard Hong - San Jose CA, US
James Tsung - San Jose CA, US
Daniel Clarence Lubben - Santa Clara CA, US
Peijun Ding - Saratoga CA, US
Nirmalya Maity - Los Altos CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 14/35

US Classification:

2042982

Abstract:

A small magnet assembly having a magnet assembly of area less than 10% of the target area, is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly passes through the target center, thus allowing full target coverage. A properly chosen ratio of the two rotations about respective axes produces a much slower magnet velocity near the target periphery than at the target center. A geared planetary mechanism includes a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plane supporting a cantilevered magnet assembly on the side of the drive plate facing the target.

US Patent:

7867904, Jan 11, 2011

Filed:

Feb 7, 2007

Appl. No.:

11/672478

Inventors:

Tony P Chiang - Campbell CA, US
Richard R Endo - San Carlos CA, US
James Tsung - Milpitas CA, US

Assignee:

Intermolecular, Inc. - San Jose CA

International Classification:

H01L 21/44

US Classification:

438679, 438566

Abstract:

A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.