James W Mclane

US Patent:

7361913, Apr 22, 2008

Filed:

Sep 30, 2005

Appl. No.:

11/241894

Inventors:

Russell J. Low - Rowley MA, US
Joseph C. Olson - Beverly MA, US
David R. Timberlake - Marblehead MA, US
James R. McLane - Beverly MA, US
Mark D. Saunders - Rockport MA, US
James J. Cummings - Wilmington MA, US
Thomas B. Callahan - Gloucester MA, US
Jonathan England - Broadbridge Heath Horsham, GB

Assignee:

Varian Semiconductor Equipment Associates, Inc. - Gloucester MA

International Classification:

G21K 5/10
H01J 37/08

US Classification:

25049221, 2504923, 250397, 2504921, 25049222, 2504922, 438961, 438514, 438 14, 31511181

Abstract:

An ion implanter includes a source of a stationary, planar ion beam, a set of beamline components that steer the ion beam along a normal beam path as determined by first operating parameter values, an end station that mechanically scans the wafer across the normal beam path, and control circuitry that responds to a glitch in the ion beam during implantation pass to (1) immediately alter an operating parameter of at least one of the beamline components to a second value to direct the ion beam away from the normal beam path and thereby cease implantation at an implantation transition location on the wafer, (2) subsequently move the wafer to an implantation-resuming position in which the implantation transition location on the wafer lies directly on the normal path of the ion beam, and (3) return the operating parameter to its first value to direct the ion beam along the normal beam path and resume ion implantation at the implantation transition location on the wafer. The operating parameter may be an output voltage of an extraction power supply, or other voltages and/or currents of beamline components that affect the path of the ion beam.

US Patent:

20080075563, Mar 27, 2008

Filed:

Sep 27, 2006

Appl. No.:

11/535770

Inventors:

James R. McLane - Beverly MA, US

International Classification:

H01L 21/677

US Classification:

414217

Abstract:

A system and method for handling substrates in a vacuum chamber. The system includes a first robot configured for transferring substrates from a first set of load locks to a preprocessing station, and for transferring substrates from a process platen to the first set of load locks; a second robot configured for transferring substrates from a second set of load locks to the preprocessing station, and for transferring substrates from the process platen to the second set of load locks; and a transfer mechanism for transferring substrates from the preprocessing station to the process platen.

US Patent:

20090319073, Dec 24, 2009

Filed:

Jun 19, 2008

Appl. No.:

12/142438

Inventors:

Han Zhang - Beverly MA, US
James McLane - Beverly MA, US

International Classification:

G06F 17/00

US Classification:

700112

Abstract:

A plurality of autonomous control processes, with each controlling one or more components of the material transport (or processing) system, is used to radically simplify the controller software. Each autonomous control process is responsible for the actions of only a subset of the cluster tool components. For example, in one embodiment, a separate autonomous control process is used to control each automated component in the material handling system. However, other embodiments in which a control process controls a plurality of components are also contemplated.The control processes can also be implemented as rules-based machines, determining the proper action based on a set of fixed or programmable rules. Alternatively, the control processes may also execute traditional software algorithms. The control processes are designed such that, together they achieve the process flow and throughput requirements previously achieved via a single control process.

US Patent:

20200378832, Dec 3, 2020

Filed:

Aug 26, 2019

Appl. No.:

16/551128

Inventors:

- Santa Clara CA, US
Steven Anella - West Newbury MA, US
D. Jeffrey Lischer - Acton MA, US
James McLane - Beverly MA, US
Bradley M. Pomerleau - Beverly MA, US
Dawei Sun - Lynnfield MA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01J 5/00
H01L 21/67

Abstract:

A method may include heating a substrate in a first chamber to a platen temperature, the heating comprising heating the substrate on a platen; measuring the platen temperature in the first chamber using a contact temperature measurement; transferring the substrate to a second chamber after the heating; and measuring a voltage decay after transferring the substrate to the second chamber, using an optical pyrometer to measure pyrometer voltage as a function of time.