James Patrick Lacasse

US Patent:

20130137349, May 30, 2013

Filed:

Nov 29, 2011

Appl. No.:

13/306849

Inventors:

Paul Andre Lefevre - Portland OR, US
William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
James P. LaCasse - Portland OR, US

International Classification:

B24D 11/00
B24D 18/00

US Classification:

451526, 51298

Abstract:

Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.

US Patent:

20130137350, May 30, 2013

Filed:

Nov 29, 2011

Appl. No.:

13/306845

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Paul Andre Lefevre - Portland OR, US
James P. LaCasse - Portland OR, US
Alexander William Simpson - Hillsboro OR, US

International Classification:

B24D 7/00
B24D 18/00
B24D 11/00

US Classification:

451539, 451550, 51298, 51296

Abstract:

Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.

US Patent:

20130324020, Dec 5, 2013

Filed:

Jun 4, 2012

Appl. No.:

13/488149

Inventors:

Paul Andre Lefevre - Portland OR, US
William C. Allison - Beaverton OR, US
James P. LaCasse - Portland OR, US
Diane Scott - Portland OR, US
Alexander William Simpson - Hillsboro OR, US
Ping Huang - Beaverton OR, US
Leslie M. Charns - Portland OR, US

International Classification:

B24D 11/00
B24D 18/00

US Classification:

451529, 451527, 51298, 51296

Abstract:

Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.

US Patent:

20120094586, Apr 19, 2012

Filed:

Dec 27, 2010

Appl. No.:

12/979123

Inventors:

Ping Huang - Eden Prairie MN, US
Diane Scott - Portland OR, US
James P. LaCasse - Portland OR, US
William C. Allison - Beaverton OR, US

International Classification:

B24B 37/04
B29C 44/04

US Classification:

451527, 264 451, 264 453

Abstract:

Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.

US Patent:

20150273655, Oct 1, 2015

Filed:

Jun 5, 2015

Appl. No.:

14/732497

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Paul Andre Lefevre - Portland OR, US
James P. LaCasse - Portland OR, US
Alexander William Simpson - Hillsboro OR, US

International Classification:

B24B 37/24
B24D 11/00
B24D 18/00
B24B 37/26

Abstract:

Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.

US Patent:

20150273656, Oct 1, 2015

Filed:

Jun 11, 2015

Appl. No.:

14/736568

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Paul Andre Lefevre - Portland OR, US
James P. LaCasse - Portland OR, US
Alexander William Simpson - Hillsboro OR, US

International Classification:

B24B 37/24
B24B 37/22
B24B 37/26
B24B 37/20

Abstract:

Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.

US Patent:

20150266160, Sep 24, 2015

Filed:

Jun 1, 2015

Appl. No.:

14/727586

Inventors:

Paul Andre Lefevre - Portland OR, US
William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
James P. LaCasse - Portland OR, US

International Classification:

B24B 37/26
B24B 37/22
B24D 18/00
B24B 37/20

Abstract:

Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.

US Patent:

20140167305, Jun 19, 2014

Filed:

Feb 19, 2014

Appl. No.:

14/183894

Inventors:

Ping Huang - Eden Prairie MN, US
Diane Scott - Portland OR, US
James P. LaCasse - Portland OR, US
William C. Allison - Beaverton OR, US

International Classification:

B24B 37/24

US Classification:

264 453, 264 451

Abstract:

Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.