James E Faoro

US Patent:

20090146292, Jun 11, 2009

Filed:

Dec 5, 2007

Appl. No.:

11/950819

Inventors:

Peter J. Drake - Benson AZ, US
Chad E. Boyack - Tucson AZ, US
Kevin Andrew Paulson - Salt Lake City UT, US
James E. Faoro - Tucson AZ, US
Cynthia Robin Nelson Konen - Anoka MN, US
Steven N. Peterson - Tucson AZ, US
George R. Cunnington - Oro Valley AZ, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US

International Classification:

H01L 23/373
H01L 21/02

US Classification:

257712, 438122, 257E2311, 257E21002

Abstract:

A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins the semiconductor device to a thermal heat spreader. The metallic barrier layer may be one or more sputtered layers, and the high thermal conductivity material may be a metallic material, for instance including indium, that is soldered onto the sputtered material. The high thermal conductivity material may form a primary thermal connection in conducting heat away from the semiconductor device. A secondary thermal connection may be made between the heat spreader and a heat sink. The secondary thermal connection may include a compressible solid carbon fiber material. A diaphragm may be used to contain the carbon fiber material, to prevent carbon fibers from coming into contact with the semiconductor device.

US Patent:

20090215297, Aug 27, 2009

Filed:

Feb 27, 2008

Appl. No.:

12/038282

Inventors:

James E. Faoro - Tucson AZ, US
James R. Myers - Tucson AZ, US
W. Howard Poisl - Tucson AZ, US

International Classification:

H01R 13/52

US Classification:

439273

Abstract:

An internally-sealed pass-through electrical connector includes electrical conductors for carrying electrical signals through the electrical connector, a connector body or shell surrounding the connector, and an organic adhesive material within the body or shell that fills space around the conductors and between the conductors and the connector body. The connector body includes a metal portion, such as an aluminum portion, that has a roughened surface to better allow the adhesive to adhere to it. The roughened surface may be a grit blasted surface. The connector body may also include a plastic portion, such as a molded lead organizer, to aid in positioning the leads. The adhesive may have a coefficient of thermal expansion that is matched to that of the metal portion of the connector body or shell. The organic adhesive may be an epoxy material. The electrical connector may have any of a variety of configurations.

US Patent:

20200321265, Oct 8, 2020

Filed:

Apr 3, 2019

Appl. No.:

16/373928

Inventors:

- WALTHAM MA, US
JAMES E. FAORO - TUCSON AZ, US

International Classification:

H01L 23/427
H01L 23/373
F28F 3/04

Abstract:

A heat sink includes a plurality of encapsulated spheres dispersed throughout the heat sink. Each encapsulated sphere includes a solid-to-liquid phase-change material surrounded by a metal shell.

US Patent:

20160169818, Jun 16, 2016

Filed:

Dec 15, 2014

Appl. No.:

14/570581

Inventors:

- Waltham MA, US
Edmundo M. Samaniego - Tucson AZ, US
John O. Crawford - Vail AZ, US
Emmanuel J. Simeus - Tucson AZ, US
James E. Faoro - Tucson AZ, US

International Classification:

G01N 23/223

Abstract:

A method includes selecting one or more analysis algorithms to be used to verify an authenticity of an electronic component. Each analysis algorithm identifies a type of data to be analyzed and/or a manner in which the data is to be collected. Each analysis algorithm also defines how the data is to be analyzed to verify the authenticity of the electronic component. The method also includes obtaining data associated with the electronic component. The method further includes analyzing the data associated with the electronic component using the one or more selected analysis algorithms to determine whether the electronic component is authentic. In addition, the method includes generating an output based on the analysis. One or more characteristics of the electronic component could be compared against one or more characteristics of at least one reference component, or variations in one or more characteristics of multiple electronic components could be identified.