Homayoun Talieh - San Jose CA Konstantin Volodarsky - San Francisco CA Jalal Ashjaee - Cupertino CA Douglas W. Young - Sunnyvale CA
Assignee:
Nutool, Inc. - Milpitas CA
International Classification:
B24B 2100
US Classification:
451296, 451312, 451 11
Abstract:
The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i. e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
Polishing Apparatus And Method With A Refreshing Polishing Belt And Loadable Housing
Homayoun Talieh - San Jose CA Konstantin Volodarsky - San Francisco CA Jalal Ashjaee - Cupertino CA Douglas W. Young - Sunnyvale CA
Assignee:
Nutool, Inc. - Milpitas CA
International Classification:
B24B 2100
US Classification:
451296, 451168, 451312
Abstract:
The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.
Method Of And Apparatus For Making Electrical Contact To Wafer Surface For Full-Face Electroplating Or Electropolishing
Jalal Ashjaee - Cupertino CA Boguslaw A. Nagorski - San Jose CA Bulent M. Basol - Manhattan Beach CA Homayoun Talieh - San Jose CA Cyprian Uzoh - Milpitas CA
Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.
Polishing Apparatus And Method With Belt Drive System Adapted To Extend The Lifetime Of A Refreshing Polishing Belt Provided Therein
Homayoun Talieh - San Jose CA Konstantin Volodarsky - San Francisco CA Jalal Ashjaee - Cupertino CA Douglas W. Young - Sunnyvale CA
Assignee:
NuTool, Inc. - Milpitas CA
International Classification:
B24B 2100
US Classification:
451 59, 451296, 451168, 15634512
Abstract:
The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i. e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
Distributed Control System For Semiconductor Manufacturing Equipment
Srinivasan M. Komandur - San Jose CA Jalal Ashjaee - Cupertino CA
Assignee:
NuTool, Inc. - Milpitas CA
International Classification:
H05H 100
US Classification:
15634532, 15634531, 118719, 438689
Abstract:
A semiconductor workpiece processing tool includes process modules having a robot loading window and a manual loading window, and a control system for managing a production route defining movement of the workpiece among a number of the process modules. The control system includes a user interface through which an operator can define the production route and recipes to be performed on the workpiece in each of the process modules, a system controller for controlling execution of the production route, a process module controller associated with each of the process modules for controlling the processing of the workpiece in the process module, and a network connecting the control system components. Advantages of the invention include the ability to continue a production route while manually operating a process module. As a result, the tool may continue in operation while selected process module are tested, maintained or otherwise used to process workpieces.
Jalal Ashjaee - Cupertino CA Rimma Volodarsky - San Francisco CA Cyprian E. Uzoh - Milpitas CA Bulent M. Basol - Manhattan Beach CA Homayoun Talieh - San Jose CA
Assignee:
Nutool, Inc. - Milpitas CA
International Classification:
H01L 21461
US Classification:
438692, 451177
Abstract:
The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, cleaning and drying in upper and lower chambers.
Method And Apparatus For Full Surface Electrotreating Of A Wafer
Jalal Ashjaee - Cupertino CA, US Boguslaw Nagorski - San Jose CA, US Bulent M. Basol - Manhattan Beach CA, US Homayoun Talieh - San Jose CA, US Cyprian Uzoh - San Jose CA, US
Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.
Method Of Sealing Wafer Backside For Full-Face Electrochemical Plating
Jalal Ashjaee - Cupertino CA, US Homayoun Talieh - San Jose CA, US Bulent Basol - Manhatten Beach CA, US Konstantin Volodarsky - San Francisco CA, US
Assignee:
ASM-Nutool, Inc. - Milpitas CA
International Classification:
B24B001/00
US Classification:
451 57, 451 67, 451 41, 451288, 451388, 451398
Abstract:
The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.