Dr. Tsai graduated from the University of California, San Diego School of Medicine in 2008. He works in Long Beach, CA and specializes in Family Medicine. Dr. Tsai is affiliated with Miller Childrens & Womens Hospital Long Beach.
Medical School University of Tennessee College of Medicine at Memphis Graduated: 2003
Languages:
English
Description:
Dr. Tsai graduated from the University of Tennessee College of Medicine at Memphis in 2003. He works in Jacksonville, FL and specializes in Emergency Medicine. Dr. Tsai is affiliated with Baptist Medical Center and Flagler Hospital.
Fantasma Toys since Nov 2008
Art Director
Fisher-Price May 2008 - Nov 2008
Freelance Designer
Purple Thum 2005 - Nov 2008
Freelance Illustrator/Designer
Fantasma Toys May 2002 - Nov 2008
Freelance Designer/Illustrator
Toy Island- Li & Fung USA Dec 2007 - Mar 2008
Freelance Designer
Education:
Fashion Institute of Technology 2000 - 2002
Bachelor of Arts (B.A.), Toy Design
Fashion Institute of Technology 1998 - 2000
Associate of Arts (AA), Illustration
The Art Students League of New York 1999 - 2001
Montclair State University 1996 - 1998
Skills:
Concept Development Product Design Sketching Illustration Packaging Illustrator Logo Design Graphic Design Photoshop Rendering Digital Illustration Art Direction Storyboarding Digital Photography
Interests:
Art and design, philosophy, food, cars, motorcycles, audiophile gear, mountain and urban biking, WNYC.org (covers pretty much everything).
Lookit.ai
Founder
Velodyne Lidar, Inc. Sep 2017 - Nov 2018
Director of Manufacturing Quality
Velodyne Lidar, Inc. Aug 2016 - Sep 2017
Director of Quality and Reliability
Data Storage Institute Apr 2014 - Jul 2016
Director of R and D and Principal Scientist
Data Storage Institute Apr 2013 - Apr 2015
Division Manager of Drive Systems and Technologies
Education:
Columbia University In the City of New York 1996 - 1999
Stony Brook University 1987 - 1993
Master of Science, Masters, Bachelors, Bachelor of Science, Materials Science, Engineering
Skills:
Manufacturing Failure Analysis Design of Experiments Semiconductors Characterization Product Development Management Quality Assurance Engineering Management Leadership Materials Science Thin Films Strategic Planning Program Management R&D Big Data Analytics Data Storage Technologies Data Center Competitive Analysis Process Engineering Engineering Testing Project Management Six Sigma Electronics Integration Spc Nanotechnology Metrology Sensors Semiconductor Industry Reliability Cross Functional Team Leadership Simulations Optics Mems Ic Product Engineering Fmea Materials Lean Manufacturing Matlab Process Simulation Cvd Root Cause Analysis Experimentation Afm Analysis Pvd Databases
Languages:
English Mandarin
Certifications:
Export Control Compliance Certification Six Sigma Black Belt Astar Leadership Training Program (A*Star's 5Th Insights Programme) Pi-Cp-105E-1 Response To Fire and Hazmat Emergency Profesional Engineer
Optimal Synthesis Inc.
Research Engineer
Republic of China Air Force Jul 2011 - Jun 2012
Aircraft Maintenance Technician
Tamkang University Jan 2008 - Dec 2010
Research Assistant
Education:
Stanford University 2012 - 2014
Master of Science, Masters
Tamkang University 2007 - 2011
Bachelor of Engineering, Bachelors, Aerospace Engineering
Skills:
Control Theory Aeronautics Guidance Navigation and Control Matlab Simulink Latex Arduino C++ Opencv R Machine Learning Neural Networks Mathematica Solidworks Agilent Ads Ltspice Ansys Mavlink Protocol Ardupilot Mega 2.5 Laser Cutting Adobe Lightroom Linux/Unix Python Javascript Linux Autocad
Interests:
Photography Amateur Photographer Environment Disaster and Humanitarian Relief
Altera Sep 2012 - Dec 2015
Staff Ic Package Engineer
Intel Corporation Sep 2012 - Dec 2015
Packaging R and D Engineer
Appliedmicro 2011 - 2012
Staff Ic Package Engineer
Trident Microsystems 2010 - 2011
Staff Ic Package and System Engineer
Qualcomm 2008 - 2010
Ic Package Engineer
Education:
Rochester Institute of Technology 2000 - 2004
Bachelors, Bachelor of Science In Electrical Engineering, Electrical Engineering
Skills:
Semiconductors Mixed Signal Asic Ic Embedded Systems Soc Engineering Management Simulations Product Development Analog
Robert McKenzie - Longmont CO, US Thao Nguyen - San Jose CA, US Xiaokun Chew - San Jose CA, US Gang Herbert Lin - San Jose CA, US Jack Tsai - Milpitas CA, US Bruce Schardt - Tracy CA, US Steven Marshall - Northboro MA, US
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
G11B 21/02
US Classification:
360 75, 360 7807
Abstract:
A disk drive includes a slider assembly and a controller that directs current to the slider assembly to dynamically adjust the head-to-disk spacing. In one embodiment, the slider assembly includes a write element having a first end, a second end and an intermediate section, a conductor that is connected to the intermediate section. In this embodiment, the controller directs electrical current through the conductor to heat the write element without writing data to a storage disk. The electrical current can be directed through the conductor at any time prior to data transfer or during data transfer. Heating the write element causes a deformation of the slider assembly to decrease the head-to-disk spacing. In another embodiment, the slider assembly includes a separate slider deformer. Electrical current is selectively directed to the slider deformer to cause a deformation of the slider assembly to obtain a desired head-to-disk spacing.
Dynamically Adjustable Head Disk Spacing Slider Using Thermal Expansion
Robert McKenzie - Longmont CO, US Thao Nguyen - San Jose CA, US Xiaokun Chew - San Jose CA, US Gang Herbert Lin - San Jose CA, US Jack Tsai - Milpitas CA, US Bruce Schardt - Tracy CA, US Steven Marshall - Northboro MA, US
Assignee:
Maxtor Corporation - Longmont CO
International Classification:
G11B 21/02
US Classification:
360 75
Abstract:
A disk drive includes a slider assembly and a controller that directs current to the slider assembly to dynamically adjust the head-to-disk spacing. In one embodiment, the slider assembly includes a write element having a first end, a second end and an intermediate section, a conductor that is connected to the intermediate section. In this embodiment, the controller directs electrical current through the conductor to heat the write element without writing data to a storage disk. The electrical current can be directed through the conductor at any time prior to data transfer or during data transfer. Heating the write element causes a deformation of the slider assembly to decrease the head-to-disk spacing. In another embodiment, the slider assembly includes a separate slider deformer. Electrical current is selectively directed to the slider deformer to cause a deformation of the slider assembly to obtain a desired head-to-disk spacing.
JS Realty 1687 Silvertree Dr., San Jose, CA 95131 408 799-5979 (Office), 888 225-1868 (Fax)
Description:
I'm not just a realtor and Real Estate appraiser, also an investor. We have so many qualify buyers (with more than 30% down), would like to purchase your home.Please contact me for more detail information, Thank you! Email to: [email protected] or [email protected]
Its just a difficult situation, said Jack Tsai, a clinical psychologist and dean of the San Antonio campus of the UTHealth School of Public Health. Theres a lot of mental health concerns with social isolation.
Inventec is dedicated to driving innovation in a number of industries by combining AMD CPU and GPU technologies on our platforms, and AMD is a key technology partner for Inventec in the cloud datacenter market, said Jack Tsai, general manager of Inventec EBG. By integrating the new EPYC CPU into