Hyong S Lee

US Patent:

20110297329, Dec 8, 2011

Filed:

Oct 5, 2010

Appl. No.:

12/898623

Inventors:

Steve Canale - Simi Valley CA, US
David J. Zapp - Simi Valley CA, US
Daniel E. Sanchez - Camarillo CA, US
Hung V. Phan - Simi Valley CA, US
Hyong Y. Lee - Thousand Oaks CA, US

Assignee:

SKYWORKS SOLUTIONS, INC. - Woburn MA

International Classification:

H01L 21/687

US Classification:

156756, 156761

Abstract:

Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

US Patent:

20170125275, May 4, 2017

Filed:

Jan 9, 2017

Appl. No.:

15/401344

Inventors:

- Woburn MA, US
Daniel Kwadwo Amponsah Berkoh - West Hills CA, US
David James Zapp - Deceased, US
Steve Canale - Simi Valley CA, US
Hyong Yong Lee - Thousand Oaks CA, US
Daniel Eduardo Sanchez - Camarillo CA, US
Hung V. Phan - Simi Valley CA, US

International Classification:

H01L 21/683
B32B 43/00

Abstract:

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

US Patent:

20140262053, Sep 18, 2014

Filed:

May 27, 2014

Appl. No.:

14/287660

Inventors:

- Woburn MA, US
David J. Zapp - Simi Valley CA, US
Daniel Eduardo Sanchez - Camarillo CA, US
Hung V. Phan - Simi Valley CA, US
Hyong Yong Lee - Thousand Oaks CA, US

Assignee:

Skyworks Solutions, Inc. - Woburn MA

International Classification:

B32B 43/00
H01L 21/67

US Classification:

156707, 156758

Abstract:

Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.