Howard D Parks

US Patent:

D3831221, Sep 2, 1997

Filed:

Dec 1, 1995

Appl. No.:

D/047345

Inventors:

Howard Parks - Highland Park IL

International Classification:

1402

US Classification:

D14114

US Patent:

40958671, Jun 20, 1978

Filed:

Oct 10, 1974

Appl. No.:

5/513649

Inventors:

Howard L. Parks - Woodland Hills CA

Assignee:

Bunker Ramo Corporation - Oak Brook IL

International Classification:

H01R 1328

US Classification:

339 92M

Abstract:

The following specification illustrates a stack including one or more interconnect wafer screens and a connector wafer screen having active circuit components detachably secured thereto by means of a component wafer interconnected with the stack through a connector wafer screen and against which pressure is applied by a coupon pressure cap on tightening a bolt extending through the stack. A dual inline package is also shown detachably secured to a printed circuit board by means of a wafer against which pressure is applied to effect connections between the printed circuit board conductive segments and the package terminals.

US Patent:

41847296, Jan 22, 1980

Filed:

Oct 13, 1977

Appl. No.:

5/841917

Inventors:

Howard L. Parks - Woodland Hills CA
John M. Kuronen - Camarillo CA

Assignee:

Bunker Ramo Corporation - Oak Brook IL

International Classification:

H05K 112
H05K 336

US Classification:

339 17F

Abstract:

A flexible connector cable for providing high density and reliable electrical interconnections between printed circuit boards or any other surfaces having conductive paths that need connection to conductive paths on adjacent surfaces. The connector cable comprises a flat flexible laminar structure including an electrically-insulative layer and an electrically-conductive layer. The insulative layer is typically formed on a bonded plastic such as Polyimide and the conductive layer is typically formed of copper. Openings are formed in the insulative layer to expose the conductive layer and raised contacts or buttons are deposited on the conductive layer on both surfaces of the cable. The raised contacts are formed of ductile conductive material which exhibits plastic deformation under pressure to form good electrical connections.

US Patent:

42689562, May 26, 1981

Filed:

Mar 15, 1979

Appl. No.:

6/020714

Inventors:

Howard L. Parks - Woodland Hills CA
John M. Kuronen - Camarillo CA

Assignee:

Bunker Ramo Corporation - Oak Brook IL

International Classification:

H01R 4300

US Classification:

29869

Abstract:

A flexible connector cable for providing high density and reliable electrical interconnections between printed circuit boards or any other surfaces having conductive paths that need connection to conductive paths on adjacent surfaces. The connector cable comprises a flat flexible laminar structure including an electrically-insulative layer and an electrically-conductive layer. The insulative layer is typically formed on a bonded plastic such as Polyimide and the conductive layer is typically formed of copper. Openings are formed in the insulative layer to expose the conductive layer and raised contacts or buttons are deposited on the conductive layer on both surfaces of the cable. The raised contacts are formed of ductile conductive material which exhibits plastic deformation under pressure to form good electrical connections.

US Patent:

42837545, Aug 11, 1981

Filed:

Mar 26, 1979

Appl. No.:

6/023968

Inventors:

Howard L. Parks - Woodland Hills CA

Assignee:

Bunker Ramo Corporation - Oak Brook IL

International Classification:

H05K 720

US Classification:

361382

Abstract:

A high density arrangement for interconnecting integrated circuit devices, of a type which includes a stack of numerous wafers formed primarily of metal, wherein some of the wafers holding integrated circuit chips have overhanging edge portions at one side of the stack that extend beyond other wafers of the stack, and wherein there are cooling fluid tubes clamped against the overhanging edge portions to carry away heat to a cooling fluid flowing through the tube. The wafers are interconnected at numerous locations by button portions of malleable material such as gold, and the stack of wafers are clamped together to slightly deform the button portions to provide a considerable area of contact. The stack clamping device is separate from the cooling fluid tube clamping device, to provide different degrees of pressure and compressive strain.