Harold T O'Rourke

US Patent:

44012535, Aug 30, 1983

Filed:

Oct 12, 1977

Appl. No.:

5/951052

Inventors:

Harold T. O'Rourke - Milford NH

Assignee:

Cooper Industries, Inc. - Houston TX

International Classification:

H05K 334

US Classification:

228125

Abstract:

A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

US Patent:

RE329827, Jul 11, 1989

Filed:

Oct 10, 1986

Appl. No.:

6/918288

Inventors:

Harold T. O'Rourke - Milford NH

Assignee:

Hollis Automation, Inc. - Nashua NH

International Classification:

H05K 334

US Classification:

2281801

Abstract:

A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

US Patent:

44101260, Oct 18, 1983

Filed:

Aug 20, 1982

Appl. No.:

6/409849

Inventors:

Harold T. O'Rourke - Milford NH

Assignee:

Cooper Industries, Inc. - Houston TX

International Classification:

B23K 102
H05K 334

US Classification:

228180R

Abstract:

A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

US Patent:

44024487, Sep 6, 1983

Filed:

Oct 30, 1981

Appl. No.:

6/316971

Inventors:

Harold T. O'Rourke - Milford NH

Assignee:

Cooper Industries, Inc. - Houston TX

International Classification:

H05K 334
B23K 102

US Classification:

228125

Abstract:

A soldering system is described in which a freshly soldered board is heated substantially immediately following deposition of molten solder onto the board so as to maintain the freshly applied solder in molten condition, and a fluid stream is then directed onto the molten solder. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

US Patent:

42080029, Jun 17, 1980

Filed:

Aug 18, 1978

Appl. No.:

5/934803

Inventors:

Matthias F. Comerford - New Highlands MA
Thomas N. Munroe - Hudson NH
Harold T. O'Rourke - Milford NH

Assignee:

Hollis Engineering, Inc. - Nashua NH

International Classification:

B23K 306

US Classification:

228 37

Abstract:

A mass wave soldering apparatus is described. The apparatus comprises a sump having upwardly diagonally extending front and rear walls, and a pair of vertical end walls which cooperate to form an upwardly extending open ended nozzle chamber of increasing plan area. A Z-shaped baffle screen is positioned within the nozzle chamber and distributes the molten solder pumped upwardly in the sump as a wide, smooth substantially unidirectional solder wave ideally contoured for high-speed production soldering.

US Patent:

41801997, Dec 25, 1979

Filed:

Feb 27, 1978

Appl. No.:

5/881435

Inventors:

Harold T. O'Rourke - Milford NH
Warren G. Abbott - Londonberry NH

Assignee:

Hollis Engineering, Inc. - Nashua NH

International Classification:

H05K 334
B23K 300

US Classification:

228102

Abstract:

A system for measuring time/temperature profiles of a mass soldering operation is described. In accordance with the invention a data probe and miniature transmitter is carried through the soldering operation on top of the circuit board being soldered. A plurality of probes are attached to various components, component leads and selected board areas and provide electrical signals in response to the temperature and dwell time the components and board are subjected to during preheating and soldering. The temperature of the solder at the point the solder contacts the board may also be detected. The electrical signals are wireless transmitted, e. g. by means of low frequency electromagnetic transmission, to a remote stationary receiver for integration and display.