Haiwei L Lu

US Patent:

20210109284, Apr 15, 2021

Filed:

Oct 14, 2020

Appl. No.:

17/070601

Inventors:

- Santa Clara CA, US
Chong Zhang - San Jose CA, US
Haiwei Lu - San Jose CA, US
Chen Li - San Jose CA, US

International Classification:

G02B 6/122
G02B 6/12

Abstract:

A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.

US Patent:

20140120293, May 1, 2014

Filed:

Dec 22, 2011

Appl. No.:

13/993336

Inventors:

Mohit Gupta - Chandler AZ, US
Haiwei Lu - Chandler AZ, US
Dingying D. Xu - Maricopa AZ, US
Ninad Patel - Chandler AZ, US
Kowtilya Bijjula - Chandler AZ, US
P. Erasenthiran Poonjolai - Chandler AZ, US

International Classification:

H01L 21/683

US Classification:

428 417, 428354

Abstract:

The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be diced into individual microelectronic dice using an adhesive tape which reduces the potential of electrostatic discharge damage by the incorporation or anti-static, and may be compatible with a laser scribing process by the incorporation of ultraviolet light absorbing agents into an adhesive layer of the adhesive tape.