Guy R Wagner

US Patent:

D454947, Mar 26, 2002

Filed:

Jun 29, 2000

Appl. No.:

29/125793

Inventors:

Guy R. Wagner - Loveland CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

2304

US Classification:

D23370

US Patent:

6360816, Mar 26, 2002

Filed:

Dec 23, 1999

Appl. No.:

09/471835

Inventors:

Guy R. Wagner - Loveland CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

F24H 306

US Classification:

165122, 165 803, 361697

Abstract:

A cooling system for dissipating heat from a heat source has a heat sink associated with an air moving device. The heat sink has a core member having a first surface adapted to contact at least a portion of the heat source. In addition, the core member has at least one outer peripheral surface. At least one cooling fin device having at least one inner peripheral surface and at least one cooling fin is associated with the core member wherein the inner peripheral surface of the cooling fin device is adjacent the outer peripheral surface of the core member. The air moving device is located opposite the first surface of the core member and forces air past the cooling fins in the general direction of the first surface. During operation of the cooling system, heat transfers from the heat source into the core member via the core member first surface. The core member transfers the heat to the outer peripheral surface where it is then transferred to the cooling fins.

US Patent:

D455407, Apr 9, 2002

Filed:

Sep 28, 2000

Appl. No.:

29/130200

Inventors:

Steven E Hanzlik - Fort Collins CO
Michael A Hansen - Fort Collins CO
Guy R Wagner - Loveland CO
Arlen L Roesner - Fort Collins CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

1303

US Classification:

D13179

US Patent:

6401808, Jun 11, 2002

Filed:

Nov 28, 2000

Appl. No.:

09/723570

Inventors:

Steven E. Hanzlik - Fort Collins CO
Michael A. Hansen - Fort Collins CO
Guy R. Wagner - Loveland CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H05K 720

US Classification:

165121, 165 803, 361697

Abstract:

Disclosed herein is a cooling device primarily for cooling integrated circuits or other electronic devices during operation. The cooling device may include a heat sink portion and a fan, or other air movement device. The outer periphery of the heat sink portion may be formed with outwardly extending lobes, leaving recessed areas between the lobes. The lobes may be sized and located so as to correspond to heat concentration areas on an electronic device package. In this manner, heat sink material may be concentrated adjacent heat concentration areas where more heat removal is required. The overall mass and size of the heat sink portion may, thus, be reduced without significantly impairing the ability of the cooling device to remove heat from an electronic device. The heat sink portion may also be provided with an open space located beneath the base of the fan in order to insulate the motor of the fan from the heat sink base and, thus, reduce the amount of heat which transfers from the heat sink base to the fan motor.

US Patent:

6459578, Oct 1, 2002

Filed:

Apr 24, 2001

Appl. No.:

09/841458

Inventors:

Guy R Wagner - Loveland CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H05K 720

US Classification:

361694, 361688, 361689, 361690, 361695, 174 161, 16510433, 16510434, 454184

Abstract:

A chassis for housing components includes a shell having an intake duct and an exhaust duct. The intake duct is coupled to an intake port for directing cooling air from the intake port into the chassis, and the exhaust duct is coupled to an exhaust port for directing cooling air out of the chassis. The intake duct and the exhaust duct include active and/or passive noise attenuating features for attenuating noise generated within the chassis, which allows the chassis to operate more quietly. The ducts are also dimensioned to attenuate electromagnetic radiation generated within the chassis, which prevents the escape of electromagnetic radiation from the chassis.

US Patent:

6535389, Mar 18, 2003

Filed:

Jun 7, 2001

Appl. No.:

09/877824

Inventors:

Veronica M Rodriguez - Frederick CO
Guy R Wagner - Loveland CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H05K 720

US Classification:

361719, 165 802, 165185, 257718, 257719

Abstract:

A heat sink assembly mounting structure includes a base secured to a chassis wall by deformable retainer members. The retainer members are biased towards the chassis wall by screws, and the retainer members transmit the biasing force of the screws to the base. The base exerts a biasing force on a circuit board, and the screws extend through the circuit board and are screwed into nuts on the chassis wall.

US Patent:

6561261, May 13, 2003

Filed:

Dec 3, 2001

Appl. No.:

10/006412

Inventors:

Guy R. Wagner - Loveland CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H05K 720

US Classification:

165 803, 165121, 361697

Abstract:

A heat sink for removing heat from a heat source. The heat sink has at least one first surface adapted to contact at least a portion of the heat source located on a core member. At least one outer peripheral surface is located on the core member. At least one cooling fin device comprising at least one inner peripheral surface and a plurality of cooling fins are adjacent the outer peripheral surface of the core member.

US Patent:

D476072, Jun 17, 2003

Filed:

Oct 17, 2001

Appl. No.:

29/149813

Inventors:

Guy R. Wagner - Loveland CO

Assignee:

Agilent Technologie,s Inc. - Palo Alto CA

International Classification:

2304

US Classification:

D23370

Author:

Guy Wagner

ISBN #:

2724700066

Author:

Guy Wagner

ISBN #:

2724700368

Author:

Guy Wagner

ISBN #:

2724700503

Author:

Guy Wagner

ISBN #:

2724701437

Author:

Guy Wagner

ISBN #:

3850025020