Gregory D Winterton
age ~62
from Flower Mound, TX
- Also known as:
-
- Gregory Dean Winterton
- Gregory F Winterton
- Gregory R Winterton
- Gregory D Downs
- Greg Winterton
- Darrell G Dalton
- Darrel L Dalton
- Phone and address:
-
3132 Almond Dr, Lewisville, TX 75028
972 724-4978
Gregory Winterton Phones & Addresses
- 3132 Almond Dr, Flower Mound, TX 75028 • 972 724-4978
- Lewisville, TX
- 9050 Markville Dr, Dallas, TX 75243 • 214 575-0585
- Grand Prairie, TX
- 5600 Belle Chasse Ln, Frisco, TX 75035 • 469 287-1794 • 972 335-0637
- Garland, TX
- Streetsboro, OH
- 14222 Dallas Pkwy APT 1008, Dallas, TX 75254 • 972 841-5992
Work
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Company:Texans credit union
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Address:12500 T I Blvd, Dallas, TX 75243
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Phones:972 348-2700
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Position:Manager
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Industries:Semiconductors and Related Devices
Us Patents
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Method And System For Filling Voids In Electromechanical Systems
view source -
US Patent:20090067025, Mar 12, 2009
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Filed:Sep 10, 2007
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Appl. No.:11/852629
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Inventors:Earl Vedere Atnip - Plano TX, US
Mark Andrew Franklin - Plano TX, US
Gregory Dean Winterton - Flower Mound TX, US -
Assignee:Texas Instruments Incorporated - Dallas TX
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International Classification:G02B 26/08
B05D 5/06 -
US Classification:359224, 427162
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Abstract:In accordance with one embodiment of the present disclosure, a method for filling a void of an electromechanical system includes forming a void within a support layer. A conductive layer is formed outwardly from the support layer such that a portion of the conductive layer partially fills the void. A remainder of the void is filled with an inorganic material. A mirror is formed outwardly from the inorganic material and the conductive layer.
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Double Wafer Carrier Process For Creating Integrated Circuit Die With Through-Silicon Vias And Micro-Electro-Mechanical Systems Protected By A Hermetic Cavity Created At The Wafer Level
view source -
US Patent:20090280602, Nov 12, 2009
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Filed:May 11, 2009
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Appl. No.:12/463830
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Inventors:Thomas Dyer BONIFIELD - Dallas TX, US
Thomas W. WINTER - McKinney TX, US
William R. MORRISON - Dallas TX, US
Gregory D. WINTERTON - Flower Mound TX, US
Asad M. HAIDER - Plano TX, US -
Assignee:TEXAS INSTRUMENTS INCORPORATED - Dallas TX
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International Classification:H01L 21/50
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US Classification:438118, 257E21499
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Abstract:A TSV-MEMS packaging process is provided. The process includes forming TSVs in the front side of the product wafer, and attaching a first carrier to the front side of the product wafer, subsequent to forming TSVs. The process further includes thinning the back side of the product wafer to expose TSV tips, detaching the first carrier from the front side of the product wafer, and transferring the thinned wafer to a second carrier with back side adhered to the second wafer carrier. Semiconductor components are added to the front side of the product wafer, followed by forming a hermetic cavity over the added semiconductor components, and detaching the second carrier from the back side of the product wafer. Wafer level processing continues after detaching the second carrier.
Isbn (Books And Publications)
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The Dream Of Gerontius
view source -
Author:Gregory Winterton
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ISBN #:0818909072
Name / Title
Company / Classification
Phones & Addresses
Manager
Texans Credit Union
Semiconductors and Related Devices
Semiconductors and Related Devices
12500 T I Blvd, Dallas, TX 75243
Manager
Texans Credit Union
Semiconductors and Related Devices
Semiconductors and Related Devices
12500 T I Blvd #8, Dallas, TX 75243
972 348-2700
972 348-2700
Resumes
Gregory Winterton
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