Gregory Scott Constable

US Patent:

7926697, Apr 19, 2011

Filed:

Sep 19, 2007

Appl. No.:

11/857441

Inventors:

Linda Shekhawat - Tucson AZ, US
Gregory S. Constable - Chandler AZ, US
Youzhi E. Xu - Gilbert AZ, US
Nisha Ananthakrishan - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23K 31/02
B23K 35/22

US Classification:

22818022, 228207, 228223, 148 22, 524 80, 524919

Abstract:

An underfill formulation includes a solvent (), a plurality of amphiphilic block copolymers () in the solvent, and an adhesion promoter () in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles () in the solvent, with the micelles including a core () and a shell () surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.

US Patent:

8354467, Jan 15, 2013

Filed:

Feb 11, 2011

Appl. No.:

13/025625

Inventors:

Linda A. Shekhawat - Tucson AZ, US
Gregory S. Constable - Chandler AZ, US
Youzhi E. Xu - Gilbert AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

C08G 65/32
C08L 63/00

US Classification:

524500, 525403, 525407, 525523

Abstract:

An underfill formulation includes a solvent (), a plurality of amphiphilic block copolymers () in the solvent, and an adhesion promoter () in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles () in the solvent, with the micelles including a core () and a shell () surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.

US Patent:

20090170247, Jul 2, 2009

Filed:

Dec 28, 2007

Appl. No.:

11/966933

Inventors:

Linda A. SHEKHAWAT - Tucson AZ, US
Gregory S. CONSTABLE - Chandler AZ, US
Youzhi E. XU - Gilbert AZ, US
Nisha ANANTHAKRISHNAN - Chandler AZ, US

International Classification:

H01L 21/50

US Classification:

438127, 257E21499

Abstract:

Electronic devices and methods for fabricating electronic devices are described. One embodiment includes a method comprising providing a first body and a second body, and electrically coupling the first body to the second body using a plurality of solder bumps, wherein a gap remains between the first body and the second body. The method also includes placing an underfill material into the gap between the first body and the second body, the underfill material comprising magnetic particles in a polymer composition. The method also includes curing the underfill material in the gap by applying a magnetic field powered by alternating current, to induce heat in the magnetic particles, wherein the heat in the magnetic particles heats the polymer composition, and the magnetic field is applied for a sufficient time to cure the polymer composition. Other embodiments are described and claimed.

US Patent:

20100078806, Apr 1, 2010

Filed:

Sep 30, 2008

Appl. No.:

12/242398

Inventors:

Nirupama Chakrapani - Gilbert AZ, US
Vijay S. Wakharkar - Paradise Valley AZ, US
Janet Feng - Chandler AZ, US
Nisha Ananthakrishnan - Chandler AZ, US
Gregory S. Constable - Chandler AZ, US

International Classification:

H01L 23/34
H01L 21/00

US Classification:

257712, 438106, 257E23101, 257E21001

Abstract:

A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.

US Patent:

20110159310, Jun 30, 2011

Filed:

Dec 30, 2009

Appl. No.:

12/655407

Inventors:

Deepak V. Kulkarni - Chandler AZ, US
Carl L. Deppisch - Chandler AZ, US
Leonel R. Arana - Phoenix AZ, US
Gregory S. Constable - Chandler AZ, US
Sriram Srinivasan - Chandler AZ, US

International Classification:

B32B 15/04
B23K 31/02
B32B 38/00

US Classification:

428576, 228203, 1563073

Abstract:

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

US Patent:

20120074597, Mar 29, 2012

Filed:

Sep 24, 2010

Appl. No.:

12/890545

Inventors:

Dingying Xu - Maricopa AZ, US
Nisha Ananthakrishnan - Chandler AZ, US
Hong Dong - Perry Hall MD, US
Rahul N. Manepalli - Chandler AZ, US
Nachiket Raravikar - Gilbert AZ, US
Gregory S. Constable - Chandler AZ, US

International Classification:

H01L 23/48
C09D 7/12

US Classification:

257783, 10628714, 257E2301

Abstract:

Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.

US Patent:

20190043778, Feb 7, 2019

Filed:

Dec 26, 2015

Appl. No.:

16/061324

Inventors:

- Santa Clara CA, US
Shinobu KOURAKATA - Tsukuba-shi, JP
Kazuo OGATA - Tsukuba, JP
Paul R. START - Chandler AZ, US
Syadwad JIAN - Chandler AZ, US
William Nicholas LABANOK - Gilbert AZ, US
Wei HU - Chandler AZ, US
Peng LI - Chandler AZ, US
Douglas R. YOUNG - Tempe AZ, US
Gregory S. CONSTABLE - Chandler AZ, US
John J. Beatty - Chandler AZ, US
Pardeep K. BHATTI - Gilbert AZ, US
Luke J. GARNER - Chandler AZ, US
Aravindha R. ANTONISWAMY - Phoenix AZ, US

International Classification:

H01L 23/367
H01L 21/48
H01L 25/065

Abstract:

Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.

US Patent:

20160151850, Jun 2, 2016

Filed:

Feb 5, 2016

Appl. No.:

15/017398

Inventors:

- Santa Clara CA, US
Carl L. Deppisch - Chandler AZ, US
Leonel R. Arana - Phoenix AZ, US
Gregory S. Constable - Chandler AZ, US
Sriram Srinivasan - Chandler AZ, US

International Classification:

B23K 1/00
B23K 1/20
H01L 23/367

Abstract:

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.