Weisheng Lei - Portland OR, US Glenn Simenson - Portland OR, US Hisashi Matsumoto - Hillsboro OR, US John Davignon - Hillsboro OR, US
Assignee:
Electro Scientific Industries, Inc. - Portland OR
International Classification:
B23K 26/38
US Classification:
21912171
Abstract:
In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.
Method And Apparatus For Optically Transparent Via Filling
A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.
Method Of Providing Consistent Quality Of Target Material Removal By Lasers Having Different Output Performance Characteristics
Weisheng Lei - Portland OR, US Glenn Simenson - Portland OR, US Jeff Howerton - Portland OR, US Mark Unrath - Portland OR, US
Assignee:
Electro Scientific Industries, Inc. - Portland OR
International Classification:
B23K 26/00
US Classification:
21912171, 2191217, 21912169
Abstract:
Laser pulse energy adjustments are motivated by an understanding of the effect of laser pulse width variations among different lasers on satisfying a quality metric associated with a laser-processed target. In a preferred embodiment, the adjustments normalize this effect among different lasers drilling vias in a target specimen. The number of pulses delivered to the target specimen to form each via can be modified, based on the pulse energy applied to the via location, to control different via quality metrics.
Multiple Laser Wavelength And Pulse Width Process Drilling
Weisheng Lei - Portland OR, US Yunlong Sun - Beaverton OR, US Yasu Osako - Lake Oswego OR, US John Davignon - Hillsboro OR, US Glenn Simenson - Portland OR, US Hisashi Matsumoto - Hillsboro OR, US
Assignee:
Electro Scientific Industries, Inc. - Portland OR
International Classification:
H01S 3/109 H01S 3/10 B23K 26/38
US Classification:
372 22, 21912171, 372 23
Abstract:
Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.
Method And Apparatus For Reliably Laser Marking Articles
Haibin Zhang - Portland OR, US Glenn Simenson - Portland OR, US Patrick Leonard - Ann Arbor MI, US
Assignee:
Electro Scientific Industries, Inc. - Portland OR
International Classification:
H01S 3/10
US Classification:
372 24, 372 1, 372 25, 372 30, 372 34, 372 35
Abstract:
The invention is a method and apparatus for creating marks on an anodized aluminum specimen with selectable color and optical density. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters. The laser marking system is directed to produce laser pulses having laser pulse parameters associated with the desired color and optical density in the presence of a fluid directed to the surface of the anodized aluminum specimen while marking.
Method And Apparatus For Reliably Laser Marking Articles
Haibin Zhang - Portland OR, US Glenn Simenson - Portland OR, US Robert Hainsey - Portland OR, US David Barsic - Portland OR, US Jeffrey Howerton - Portland OR, US Wayne Crowther - Vancouver WA, US Patrick Leonard - Ann Arbor MI, US
Assignee:
Electro Scientific Industries, Inc. - Portland OR
International Classification:
H01S 3/10 H01S 3/13
US Classification:
372 25, 372 29014, 372 30
Abstract:
The invention is a method and apparatus for creating a color and optical density selectable visible mark on an anodized aluminum specimen. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters and a controller with stored laser pulse parameters, selecting the stored laser pulse parameters associated with the desired color and optical density, directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired color and optical density including temporal pulse widths greater than about 1 and less than about 1000 picoseconds to impinge upon said anodized aluminum.
Method For Increasing Throughput Of Solder Mask Removal By Minimizing The Number Of Cleaning Pulses
Weisheng Lei - Portland OR, US Glenn Simenson - Portland OR, US Hisashi Matsumoto - Hillsboro OR, US John Davignon - Hillsboro OR, US
Assignee:
Electro Scientific Industries, Inc. - Portland OR
International Classification:
B23K 26/38
US Classification:
21912169
Abstract:
In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.
Methods For Processing Holes By Moving Precisely Timed Laser Pulses In Circular And Spiral Trajectories
Robert Pailthorp - Portland OR, US Weisheng Lei - Portland OR, US Hisashi Matsumoto - Hillsboro OR, US Glenn Simenson - Portland OR, US David Watt - Beaverton OR, US Mark Unrath - Portland OR, US William Jordens - Beaverton OR, US
Assignee:
Electro Scientific Industries, Inc. - Portland OR
International Classification:
B23K 26/38
US Classification:
219121710
Abstract:
High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.
Portland Oregon
Retired
Esi Aug 1999 - Feb 2013
Process Engineer
Education:
Stanford University 1991 - 1993
Master of Science, Masters, Materials Science
California Polytechnic State University - San Luis Obispo 1986 - 1991
Bachelors, Bachelor of Science, Engineering
Skills:
Metrology Thin Films Optics R&D Characterization Design of Experiments Failure Analysis Spc Process Engineering Engineering Pvd