Gerald M. Lazarek - Schenectady NY Fred W. Staub - Schenectady NY
Assignee:
Electric Power Research Institute - Palo Alto CA
International Classification:
H01L 2504 H01L 2342 H01L 2344
US Classification:
357 82
Abstract:
A fluid cooled heat sink is provided for use in cooling high power semiconductor devices. The heat sink includes a body formed of thermally conductive material having internal fluid passageways. Cooling fluid from an external source is passed through the heat sink. The preferred heat sink includes a pair of manifolds and means cooperating with the manifolds to allow selective interconnection of the interior passageways of the heat sink.