Abstract:
A device for electrically connecting the conductors on a first PC board to the conductors on a second PC board includes a housing having a mounting surface for mounting on the first board, an exposed surface opposite the mounting surface, and a pair of opposed side walls. A plurality of channels open through the exposed surface, each having an interior defined between the interior surfaces of the side walls. A compliant contact element, formed as an integral conductive element, is disposed in each channel. The contact element includes an end portion formed as a termination pad on the mounting surface, a lead portion extending from the first end portion along an adjacent side wall toward the exposed surface and then through the adjacent side wall and the interior surface of that wall into the interior of one of the channels, a supporting portion extending within the interior of the channel, and an electrical contact portion flexibly joined to the supporting portion and extending outwardly from the channel beyond the exposed surface so as to establish electrical contact with one of the conductors on the second board when the second board is located adjacent to the first board. In one embodiment, the electrical contact portion is flexibly joined to the support portion along an arcuate bend so as to form an acute angle therewith. In another embodiment, the electrical contact portion is a finger-shaped element flexibly joined on each side to a cantilevered supporting portion.