Gene A Robillard

US Patent:

6675600, Jan 13, 2004

Filed:

Dec 5, 2002

Appl. No.:

10/310230

Inventors:

Gene A. Robillard - Stoneham MA
Richard S. Holland - Framingham MA
Robert N. Graney - Northboro MA
John W. Marciniec - Framingham MA
John D. Mullarkey - Salem MA
Paul H. Rourke - Pelham NH

Assignee:

BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH

International Classification:

F25D 2312

US Classification:

622592, 438 73, 25033903, 250352, 165 81

Abstract:

Techniques for minimizing stress induced by temperature changes in an integrated circuit (e. g. , focal plane array or processor) or other such assemblies that include materials having mismatched coefficients of thermal expansion/contraction are disclosed. A thermal interface including a flexible comb-like pattern enables compensation for mismatched coefficients thereby reducing thermal-related stress.

US Patent:

8400539, Mar 19, 2013

Filed:

Dec 3, 2008

Appl. No.:

12/327383

Inventors:

Raymond J. Silva - Saugus MA, US
Dennis Bowler - Sudbury MA, US
Gene Robillard - Stoneham MA, US

Assignee:

BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH

International Classification:

H04N 3/14
H04N 5/335

US Classification:

348294, 348298, 348308

Abstract:

A composite focal plane assembly with an expandable architecture has a multi-layer, double-sided aluminum nitride (AlN) substrate and vertical architecture to achieve the dual function of focal plane and electronics backplane. Imaging dice and other electrical components are mounted and wire bonded to one surface and then direct backplane connectivity is provided on the opposing surface through a matrix of electrical contacts. In one embodiment, a flexible connector is sandwiched between the AlN focal plane and a FR-4 backplane is used to compensate for differences in coefficient of thermal expansion (CTE) between the AlN and commercially available high density circuit card connectors that are commonly manufactured from materials with CTE properties more closely approximating FR-4. In an alternate embodiment, the FR-4 and flexible connectors are eliminated by using high density circuit card connectors that are fabricated out of materials more closely matching the CTE of AlN.

US Patent:

20130182180, Jul 18, 2013

Filed:

Feb 13, 2013

Appl. No.:

13/766443

Inventors:

BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH, US
Dennis P. Bowler - Sudbury MA, US
Gene A. Robillard - Stoneham MA, US

Assignee:

BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH

International Classification:

H01L 25/065
H04N 5/225

US Classification:

348374, 257443

Abstract:

A composite focal plane assembly with an expandable architecture has a multi-layer, double-sided aluminum nitride (AlN) substrate and vertical architecture to achieve the dual function of focal plane and electronics backplane. Imaging dice and other electrical components are mounted and wire bonded to one surface and then direct backplane connectivity is provided on the opposing surface through a matrix of electrical contacts. In one embodiment, a flexible connector is sandwiched between the AlN focal plane and a FR-4 backplane is used to compensate for differences in coefficient of thermal expansion (CTE) between the AlN and commercially available high density circuit card connectors that are commonly manufactured from materials with CTE properties more closely approximating FR-4. In an alternate embodiment, the FR-4 and flexible connectors are eliminated by using high density circuit card connectors that are fabricated out of materials more closely matching the CTE of AlN.

US Patent:

40052885, Jan 25, 1977

Filed:

Sep 19, 1975

Appl. No.:

5/614804

Inventors:

Gene A. Robillard - Stoneham MA

Assignee:

Honeywell Inc. - Minneapolis MN

International Classification:

H01J 502

US Classification:

250239

Abstract:

An improved method for providing electrical connection to a photodetector in a Dewar flask is disclosed. A plurality of conductive paths are formed on the inner flask of the Dewar. Each of the conductive paths extends from the side surface on to the top surface of the inner flask. A photodetector having lead tabs is mounted to the top surface of the inner flask with the lead tabs aligned with the conductive paths. The lead tabs are bonded to the conductive paths to provide electrical connection to the photodetector.

US Patent:

39927741, Nov 23, 1976

Filed:

Sep 19, 1975

Appl. No.:

5/614803

Inventors:

Gordon J. Burrer - Wayland MA
Gene A. Robillard - Stoneham MA

Assignee:

Honeywell Inc. - Minneapolis MN

International Classification:

H01R 4300

US Classification:

29628

Abstract:

An improved method for fabricating lead throughs in a Dewar flask is disclosed. Each lead through is provided with a contact portion which is essentially parallel to the side surface of the inner flask. The contact portion is bonded to a conductive path on the side surface of the inner flask.

US Patent:

40165906, Apr 5, 1977

Filed:

Nov 7, 1975

Appl. No.:

5/629836

Inventors:

Robert F. Baur - Lynn MA
David M. Comey - Concord MA
Gene A. Robillard - Stoneham MA

Assignee:

Honeywell Inc. - Minneapolis MN

International Classification:

H01L 2714

US Classification:

357 30

Abstract:

An electromagnetic radiation detector has a first surface which receives incident electromagnetic radiation. The sides of the detector are sloped such that incident radiation does not initially strike the sides.

US Patent:

40899918, May 16, 1978

Filed:

Apr 7, 1977

Appl. No.:

5/785724

Inventors:

Gene A. Robillard - Stoneham MA

Assignee:

Honeywell Inc. - Minneapolis MN

International Classification:

H01R 4300
H01J 502

US Classification:

427 75

Abstract:

An improved method for providing electrical conductive paths in a Dewar flask is disclosed. A thin metal film is deposited over the side and top of the inner flask of the Dewar. Portions of the metal film are then selectively removed to provide electrical conductive paths which extend from the side on to the top of the inner flask.

US Patent:

41047893, Aug 8, 1978

Filed:

Nov 15, 1976

Appl. No.:

5/741573

Inventors:

Gene A. Robillard - Stoneham MA

Assignee:

Honeywell, Inc. - Minneapolis MN

International Classification:

H01R 4300

US Classification:

29628

Abstract:

An improved method for providing electrical connection to a photodetector in a Dewar flask is disclosed. A plurality of conductive paths are formed on the inner flask of the Dewar. Each of the conductive paths extends from the side surface on to the top surface of the inner flask. A photodetector having lead tabs is mounted to the top surface of the inner flask with the lead tabs aligned with the conductive paths. The lead tabs are bonded to the conductive paths to provide electrical connection to the photodetector.