Gary Lee Estabrook

US Patent:

47499427, Jun 7, 1988

Filed:

Jun 2, 1987

Appl. No.:

7/057723

Inventors:

Emmanuel Sang - Portland OR
Gary L. Estabrook - Vancouver WA

Assignee:

Tektronix, Inc. - Beaverton OR

International Classification:

G01R 3102
G01R 106

US Classification:

324158P

Abstract:

A wafer probe head has a plate-form support member having a tip region and a mounting region. At least one electrically conductive probe tip is carried by the support member at the tip region. A connector is carried by the support member at a location spaced from the tip region, and the probe tip is electrically connected to the connector. The probe head also has a strain gauge for measuring physical distortion of the support member as a result of the probe tip being pressed against a device under test by virtue of relative movement between the mounting region of the support member and the device under test.