Fred Goins

US Patent:

60149930, Jan 18, 2000

Filed:

Mar 27, 1998

Appl. No.:

9/049763

Inventors:

Fred A. Goins - Boise ID

Assignee:

MCMS, Inc. - Nampa ID

International Classification:

B21F 4500

US Classification:

140105

Abstract:

A method and apparatus for bending a plurality of leads of a component, in order to straighten and/or repair damaged or misaligned leads, is disclosed. The apparatus includes: a securing structure for receiving and holding the component; a first member for engaging the plurality of leads of the component; and a second member for engaging the plurality of leads of the component, wherein the first and second dowels cooperate with one another so as to form the plurality of leads into a desired configuration. The method includes: securing the component to a platform such that the component remains stable during a lead bending process; positioning a first member under the plurality of leads at a first bottom position; positioning a second member above the plurality of leads at a first top position; moving the second member so as to engage a top surface of each lead, thereby exerting a downward force on the plurality of leads, wherein the plurality of leads are caused to bend around the first member located at the first bottom position; moving a plurality of alignment members between spaces between adjacent leads of the plurality of leads so as to align the adjacent leads in a desired orientation with respect to each other; and moving the first member so as to engage a bottom surface of each lead, thereby exerting an upward force on the plurality of leads and forcing the plurality of leads to bend around the second member located at a second top position.

US Patent:

58743235, Feb 23, 1999

Filed:

Aug 28, 1997

Appl. No.:

8/919536

Inventors:

Fred A. Goins - Boise ID

Assignee:

MCMS, Inc. - Nampa ID

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438121

Abstract:

A method of providing electrical contact between an external contact element and an electrical lead of a component includes the act of inserting the electrical component into a carrier socket having a housing and a cavity within the housing for receiving the electrical component. The method further includes electrically connecting the electrical lead and a first electrically conductive member, wherein the first conductive member includes a portion which extends into the cavity so as to make electrical contact with the electrical lead; securing the electrical component within the cavity; and electrically connecting the first conductive member to a second electrically conductive member, wherein the second conductive member includes a portion which extends outwardly from the housing so as to make electrical contact with the external contact element.

US Patent:

59275910, Jul 27, 1999

Filed:

Dec 31, 1996

Appl. No.:

8/775644

Inventors:

Fred A. Goins - Boise ID
David Clark - Mountain Home ID
Thomas Hansford - Emmett ID

Assignee:

MCMS, Inc. - Nampa ID

International Classification:

B23K 1018

US Classification:

228264

Abstract:

A salvage device facilitates detaching a plurality of components soldered to a plurality of modules used in printed circuit board assemblies. In one embodiment, a salvage device has a component receptacle with a component receiver that is adapted to hold a plurality of detached components. The salvage device also has a module holder attached to the component receptacle. In operation, the module holder suspends a plurality of modules over the component receiver to space the components attached to the modules apart from the component receiver. The salvage device is then placed in an oven to melt the solder contacts that bond the components to the modules. After the solder contacts reach a molten state, the components are preferably separated from the module by vibrating the components and the modules to break the surface tension of the molten solder. The components then fall into the component receiver and are removed from the oven.

US Patent:

56670770, Sep 16, 1997

Filed:

Apr 26, 1996

Appl. No.:

8/639354

Inventors:

Fred Goins - Boise ID

Assignee:

Micron Electronics, Inc. - Nampa ID

International Classification:

B07C 5344

US Classification:

209573

Abstract:

An apparatus and method for the rapid switchover between different height modules in an automatic module testing and handling machine. The multi-chip module (MCM) handling apparatus comprises a bottom rail and a guide rail which has an upwardly extending wall and an outwardly extending flange which form a channel. This channel provides a passageway through which a MCM of a first thickness can pass laterally such that the first MCM is in contact with the top surface which positions contact nodes provided on the first MCM at a predetermined vertical position with respect to the top surface. This handling apparatus further comprises a removable justifying plate (RJP) which is removably attached within the first channel, thereby forming a second channel. This second channel provides a passage way through which a MCM of a second thickness, which is less than the first thickness of the first MCM, can pass laterally. Thus, the second MCM is in contact with the upper surface of the RJP, thereby positioning contact nodes provided on the second MCM at substantially the same predetermined position with respect to the top surface, as the first MCM.

US Patent:

59100249, Jun 8, 1999

Filed:

Aug 28, 1997

Appl. No.:

8/919626

Inventors:

Fred A. Goins - Boise ID

Assignee:

MCMS, Inc. - Nampa ID

International Classification:

H01R 909

US Classification:

439 71

Abstract:

A carrier socket for receiving a component having a lead portion extending outwardly from the component, wherein the lead portion is a section of a lead remaining after another portion of the lead has been removed, the socket including: a housing having a cavity for receiving the component therein; a contact wheel positioned within the cavity so as to make electrical contact with the lead portion of the component when the component is inserted into the cavity; and a foot portion, extending outwardly from a surface of the housing so as to make electrical contact with an external contact, wherein the foot portion is electrically coupled to the contact wheel when the component is inserted into the cavity.

US Patent:

59313110, Aug 3, 1999

Filed:

Jul 14, 1997

Appl. No.:

8/891954

Inventors:

Fred Goins - Boise ID

Assignee:

MCMS, Inc. - Nampa ID

International Classification:

B07R 1305

US Classification:

209573

Abstract:

An apparatus and method for the rapid switchover between different height modules in an automatic module testing and handling machine. The multi-chip module (MCM) handling apparatus comprises a bottom rail and a guide rail which has an upwardly extending wall and an outwardly extending flange which form a channel. This channel provides a passageway through which a MCM of a first thickness can pass laterally such that the first MCM is in contact with the top surface which positions contact nodes provided on the first MCM at a predetermined vertical position with respect to the top surface. This handling apparatus further comprises a removable justifying plate (RJP) which is removably attached within the first channel, thereby forming a second channel. This second channel provides a passage way through which a MCM of a second thickness, which is less than the first thickness of the first MCM, can pass laterally. Thus, the second MCM is in contact with the upper surface of the RJP, thereby positioning contact nodes provided on the second MCM at substantially the same predetermined position with respect to the top surface, as the first MCM.