Franco Stellari

US Patent:

7239157, Jul 3, 2007

Filed:

Apr 5, 2005

Appl. No.:

11/098850

Inventors:

Franco Stellari - Ho Ho Kus NJ, US
Peilin Song - Lagrangeville NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/302

US Classification:

324752

Abstract:

Optical triggering system and method for synchronizing a test of an integrated circuit chip with its operation. An optical triggering system includes a testing mechanism, such as a PICA testing mechanism, for testing an integrated circuit chip. An optical trigger mechanism generates an optical trigger signal for synchronizing a test of the integrated circuit chip with its operation. The optical trigger mechanism provides an optical trigger signal having reduced jitter and a higher frequency rate than an electrical trigger signal resulting in a more accurate test of the integrated circuit chip.

US Patent:

7355419, Apr 8, 2008

Filed:

Aug 5, 2004

Appl. No.:

10/912493

Inventors:

Chandler Todd McDowell - Austin TX, US
Stanislav Polonsky - Putnam Valley NY, US
Peilin Song - Lagrangeville NY, US
Franco Stellari - Ho Ho Kus NJ, US
Alan J. Weger - Mohegan Lake NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/302

US Classification:

324752, 324765

Abstract:

Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e. g. , picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vdd, to enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.

US Patent:

7378859, May 27, 2008

Filed:

Feb 2, 2005

Appl. No.:

11/049324

Inventors:

Franco Stellari - Ho Ho Kus NJ, US
Alberto Tosi - Invorio, IT
Peilin Song - Lagrangeville NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/00

US Classification:

324752, 324765

Abstract:

Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.

US Patent:

7446550, Nov 4, 2008

Filed:

Dec 3, 2007

Appl. No.:

11/949325

Inventors:

Chandler Todd McDowell - Austin TX, US
Stanislav Polonsky - Putnam Valley NY, US
Peilin Song - Lagrangeville NY, US
Franco Stellari - Ho Ho Kus NJ, US
Alan J. Weger - Mohegan Lake NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/02

US Classification:

324763, 324770, 3241581

Abstract:

Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e. g. , picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vdd, to enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.

US Patent:

7480882, Jan 20, 2009

Filed:

Mar 16, 2008

Appl. No.:

12/049344

Inventors:

Peilin Song - Lagrangeville NY, US
David Heidel - Mahopac NY, US
Franco Motika - Hopewell Junction NY, US
Franco Stellari - Waldwick NJ, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 17/50
G06F 19/00
G06F 11/27
G01R 31/3187
G01R 31/28

US Classification:

716 6, 703 16, 702 59, 702 79, 702125, 714 30, 714 32, 714 41, 714700, 714732, 714733, 714734

Abstract:

This embodiment replaces the use of LBIST to get a pass or no-pass result. A selective signature feature is used to collect the top failing paths, by shmooing the chip over a cycle time. These paths can be stored on-chip or off-chip, for later use. Once the chip is running in the field for a certain time, the same procedure is performed to collect the top failing paths, and this is compared with the stored old paths. If the order of the top paths changes, it indicates that (for example) there is a path (not the slowest path before) that slows more than others, which could be potential reliability concern. Therefore, a potential reliability failure is identified in the field.

US Patent:

7612571, Nov 3, 2009

Filed:

May 6, 2008

Appl. No.:

12/115658

Inventors:

Franco Stellari - Ho Ho Kus NJ, US
Alberto Tosi - Invorio, IT
Peilin Song - Lagrangeville NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/00

US Classification:

324752, 324765

Abstract:

Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.

US Patent:

7635904, Dec 22, 2009

Filed:

Mar 21, 2005

Appl. No.:

11/085734

Inventors:

Alberto Tosi - Invorio, IT
Franco Stellari - Ho Ho Kus NJ, US
Peilin Song - Lagrangeville NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 31/0203

US Classification:

257432, 257433, 257448, 257680

Abstract:

Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

US Patent:

7868606, Jan 11, 2011

Filed:

Feb 15, 2008

Appl. No.:

12/032100

Inventors:

Peilin Song - Lagrangeville NY, US
Franco Stellari - Waldwick NJ, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01N 27/00

US Classification:

324 7611, 438 11, 438 17, 327530, 327534, 324763, 324765

Abstract:

Improved process variation sensors and techniques are disclosed, wherein both global and local variations associated with transistors on an integrated circuit can be monitored. For example, respective circuits for sensing a global process variation, a local process variation between neighboring negative-channel type transistors, and a local process variation between neighboring positive-channel type transistors are disclosed. Further, in one example, a method for sensing a process variation associated with transistors on an integrated circuit includes providing at least one process variation sensor on the integrated circuit, the process variation sensor comprising a sensing portion including one or more transistors and a loading and amplification portion including one or more transistors, and operating the one or more transistors of the sensing portion and the one or more transistors of the loading and amplification portion in a subthreshold region of transistor operation such that when a threshold voltage of at least one of the transistors changes, a process variation is sensed.