Erik M. Freer - Campbell CA, US John M. de Larios - Palo Alto CA, US Katrina Mikhaylichenko - San Jose CA, US Michael Ravkin - Sunnyvale CA, US Mikhail Korolik - San Jose CA, US Fred C. Redeker - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
C11D 1/02
US Classification:
510175, 134 13
Abstract:
A cleaning compound is provided. The cleaning compound includes about 0. 1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.
Method For Removing Contamination From A Substrate And For Making A Cleaning Solution
Erik M. Freer - Campbell CA, US John M. de Larios - Palo Alto CA, US Katrina Mikhaylichenko - San Jose CA, US Michael Ravkin - Sunnyvale VA, US Mikhail Korolik - San Jose CA, US Fred C. Redeker - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
C11D 7/50
US Classification:
510175, 510417
Abstract:
A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.
Method And System For Using A Two-Phases Substrate Cleaning Compound
Mikhail Korolik - San Jose CA, US Erik M. Freer - Campbell CA, US John M. de Larios - Palo Alto CA, US Katrina Mikhaylichenko - San Jose CA, US Mike Ravkin - Sunnyvale CA, US Fritz Redeker - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B08B 7/00
US Classification:
134 6, 134 26, 134 33, 134137, 134149
Abstract:
Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.
Erik M. Freer - Campbell CA, US John M. de Larios - Palo Alto CA, US Katrina Mikhaylichenko - San Jose CA, US Michael Ravkin - Sunnyvale CA, US Mikhail Korolik - San Jose CA, US Fred C. Redeker - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B08B 3/00
US Classification:
134 34, 134 6
Abstract:
Methods for cleaning using a tri-state body are disclosed. A substrate having a particle deposited thereon is provided. A tri-state body that has a solid portion, liquid portion, and a gas portion is generated. A force is applied over the tri-state body to promulgate an interaction between the solid portion and the particle. The tri-state body is removed along with the particle from the surface of the substrate. The interaction between the solid portion and the particle causing the particle to be removed along with the tri-state body.
Katrina Mikhaylichenko - San Jose CA, US Mike Ravkin - Sunnyvale CA, US Fritz Redeker - Fremont CA, US John M. de Larios - Palo Alto CA, US Erik M. Freer - Campbell CA, US Mikhail Korolik - San Jose CA, US
An apparatus, system and method for preparing a surface of a substrate using a proximity head includes applying a non-Newtonian fluid between the surface of the substrate and a head surface of the proximity head. The non-Newtonian fluid defines a containment wall along one or more sides between the head surface and the surface of the substrate. The one or more sides provided with the non-Newtonian fluid define a treatment region on the substrate between the head surface and the surface of the substrate. A Newtonian fluid is applied to the surface of the substrate through the proximity head, such that the applied Newtonian fluid is substantially contained in the treatment region defined by the containment wall. The contained Newtonian fluid aids in the removal of one or more contaminants from the surface of the substrate. In one example, the non-Newtonian fluid can also be used to create ambient controlled isolated regions, which can assist in controlled processing of surfaces within the regions.
Proximity Head With Angled Vacuum Conduit System, Apparatus And Method
Michael Ravkin - Sunnyvale CA, US John M. de Larios - Palo Alto CA, US Fred C. Redeker - Fremont CA, US Mikhail Korolik - San Jose CA, US Erik M. Freer - Campbell CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B08B 3/00
US Classification:
134 941, 1341042, 134172, 134198
Abstract:
A proximity head including a head surface. The head surface including a first flat region and a plurality of first conduits. Each one of the plurality of first conduits being defined by corresponding one of a plurality of first discrete holes. The plurality of first discrete holes residing in the head surface and extending through the first flat region. The head surface also including a second flat region and a plurality of second conduits. The plurality of second conduits being defined by a corresponding plurality of second discrete holes that reside in the head surface and extend through the second flat region. The head surface also including a third flat region disposed between and adjacent to the first flat region and the second flat region and a plurality of third conduits. The plurality of third conduits being defined by a corresponding plurality of third discrete holes that reside in the head surface and extend through the third flat region. The third conduits being formed at a first angle relative to the third flat region.
Cleaning Compound And Method And System For Using The Cleaning Compound
Erik M. Freer - Campbell CA, US John M. de Larios - Palo Alto CA, US Katrina Mikhaylichenko - San Jose CA, US Michael Ravkin - Sunnyvale CA, US Mikhail Korolik - San Jose CA, US Fred C. Redeker - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
C11D 7/50
US Classification:
134 221, 510417, 510418
Abstract:
A cleaning compound is provided. The cleaning compound includes about 0. 1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.
Mikhail Korolik - San Jose CA, US Erik M. Freer - Campbell CA, US John M. de Larios - Palo Alto CA, US Katrina Mikhaylichenko - San Jose CA, US Mike Ravkin - Sunnyvale CA, US Fritz Redeker - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
C11D 1/04
US Classification:
510175, 510398, 134 13, 134 26
Abstract:
A cleaning compound is disclosed for removing particulate contaminants from a semiconductor substrate surface. The cleaning compound includes a liquid and carboxylic acid solid components dispersed in a substantially uniform manner in the liquid. A concentration of the carboxylic acid solid components in the liquid exceeds a solubility limit of the carboxylic acid solid components in the liquid. In one embodiment, a concentration of the carboxylic acid solid components in the liquid is within a range extending from about 3 percent by weight to about 5 percent by weight. In one embodiment, the carboxylic acid solid components are defined by a carbon number of at least four. The carboxylic acid solid components are defined to interact with the particulate contaminants on the semiconductor substrate surface to remove the particulate contaminants from the semiconductor substrate surface. The cleaning compound is viscous and may be formed as a gel.
Siluria Technologies, Inc. since May 2012
Sr. Process Engineer
Amyris Inc Mar 2011 - May 2012
Project Lead and Functional Group Manager (Process Engineer)
Nanosys Inc. Jan 2008 - Feb 2011
Development Scientist
Lam Research 2005 - 2008
Sr. Process Engineer
IBM Almaden Research Center Aug 2004 - Jul 2005
Post Doctoral Scholar
Education:
University of California, Berkeley 2000 - 2004
Ph.D, Chemical Engineering
Colorado School of Mines 1994 - 2000
B.S., M.S., Chemical and Petroleum Refining Engineering
Skills:
Chemical Engineering Nanotechnology Process Engineering Polymers Semiconductors Materials Design of Experiments Process Simulation Characterization Engineering Product Development Nanomaterials Catalysis Manufacturing Cross Functional Team Leadership Project Management Thin Films Spectroscopy Surface Chemistry Semiconductor Process Formulation Fluid Mechanics Aspen Plus Jmp Research and Development
Interests:
Home Improvement Home Decoration
Languages:
English
Certifications:
Lean Six Sigma Green Belt Certification
Googleplus
Erik Freer
Education:
Parsons The New School for Design - Communication Design, Eugene Lang College The New School for Liberal Arts - Literary Studies