Eric M Webb

US Patent:

D571973, Jun 24, 2008

Filed:

Nov 2, 2006

Appl. No.:

29/250121

Inventors:

David Burns - West Linn OR, US
Eric J. Webb - Vancouver WA, US
Brent Nasset - Salem OR, US
Walter S. Salmon - Clackamas OR, US
Ty Hargroder - Portland OR, US

Assignee:

Warn Industries, Inc. - Milwaukie OR

International Classification:

1205

US Classification:

D34 33

US Patent:

D573775, Jul 22, 2008

Filed:

Nov 30, 2006

Appl. No.:

29/250772

Inventors:

David Burns - West Linn OR, US
Eric J. Webb - Vancouver WA, US
Brent Nasset - Salem OR, US
Walter S. Salmon - Clackamas OR, US
Ty Hargroder - Portland OR, US

Assignee:

Warn Industries, Inc. - Milwaukie OR

International Classification:

1205

US Classification:

D34 33

US Patent:

D588162, Mar 10, 2009

Filed:

Oct 9, 2006

Appl. No.:

29/249500

Inventors:

Richard J. Geisler - Oregon City OR, US
Darren G. Fretz - Canby OR, US
Eric J. Webb - Vancouver WA, US

Assignee:

Warn Industries, Inc. - Milwaukie OR

International Classification:

1502

US Classification:

D15 9

US Patent:

D590843, Apr 21, 2009

Filed:

Oct 29, 2007

Appl. No.:

29/296788

Inventors:

Bryan M. Averill - Portland OR, US
Steven M. Schile - Portland OR, US
Darren G. Fretz - Canby OR, US
Eric J. Webb - Vancouver WA, US

Assignee:

Warn Industries, Inc. - Milwaukie OR

International Classification:

1502

US Classification:

D15 9

US Patent:

D591923, May 5, 2009

Filed:

Jul 29, 2008

Appl. No.:

29/322089

Inventors:

Joseph Freitas - Vancouver WA, US
Eric J. Webb - Vancouver WA, US

International Classification:

1205

US Classification:

D34 33

US Patent:

D597105, Jul 28, 2009

Filed:

Jan 30, 2009

Appl. No.:

29/331740

Inventors:

Richard J. Geisler - Oregon City OR, US
Darren G. Fretz - Canby OR, US
Eric J. Webb - Vancouver WA, US

Assignee:

Warn Industries, Inc. - Milwaukie OR

International Classification:

1502

US Classification:

D15 9, D34 33

US Patent:

D599524, Sep 1, 2009

Filed:

Nov 12, 2008

Appl. No.:

29/327718

Inventors:

Bryan M. Averill - Portland OR, US
Bryon M. Borntrager - West Linn OR, US
Darren G. Fretz - Canby OR, US
Glenda M. Steele - Milwaukie OR, US
Eric J. Webb - Vancouver WA, US

Assignee:

Warn Industries, Inc. - Milwaukie OR

International Classification:

1205

US Classification:

D34 33

US Patent:

7605082, Oct 20, 2009

Filed:

Oct 13, 2005

Appl. No.:

11/251353

Inventors:

Jonathan D. Reid - Sherwood OR, US
Eric G. Webb - West Linn OR, US
Edmund B. Minshall - Sherwood OR, US
Avishai Kepten - Lake Oswego OR, US
R. Marshall Stowell - Wilsonville OR, US
Steven T. Mayer - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

H01L 21/44

US Classification:

438678, 257E21076, 257E21174

Abstract:

Methods of forming a capping layer on conductive lines in a semiconductor device may be characterized by the following operations: (a) providing a semiconductor substrate comprising a dielectric layer having (i) exposed conductive lines (e. g. , copper lines) disposed therein, and (ii) an exposed barrier layer disposed thereon; and (b) depositing a capping layer material on at least the exposed conductive lines of the semiconductor substrate. In certain embodiments, the method may also involve removing at least a portion of a conductive layer (e. g. , overburden) disposed over the barrier layer and conductive lines to expose the barrier layer.