Elwin Myron Beaty

US Patent:

6862365, Mar 1, 2005

Filed:

Jul 13, 1999

Appl. No.:

09/351892

Inventors:

Elwin M. Beaty - Minnetonka MN, US
David P. Mork - Plymouth MN, US

Assignee:

Elwin Beaty & Elaine Beaty - Tempe AZ

International Classification:

G06K009/00

US Classification:

382145, 382151, 348135, 3562371, 702153

Abstract:

An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.

US Patent:

6915006, Jul 5, 2005

Filed:

Apr 27, 2001

Appl. No.:

09/844232

Inventors:

Elwin M. Beaty - Minnetonka MN, US
David P. Mork - Chandler AZ, US

International Classification:

G06K009/00

US Classification:

382145, 382151, 348 87, 25055923

Abstract:

A three dimensional inspection system for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. An illuminator is located to illuminate at least one ball on the ball array device. A first optical element is positioned to transmit light to the sensor. A second optical element is positioned to direct light from the at least one ball to the sensor, where the sensor, the first optical element and the second optical element cooperate to obtain at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. A processor is coupled to receive the output, where the processor processes the output by using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

US Patent:

6915007, Jul 5, 2005

Filed:

Apr 27, 2001

Appl. No.:

09/844626

Inventors:

Elwin M. Beaty - Minnetonka MN, US
David P. Mork - Chandler AZ, US

International Classification:

G06K009/00

US Classification:

382145, 382154, 348131, 3562371, 702153

Abstract:

A three dimensional inspection method for inspecting ball array devices having a plurality of balls, where the ball array device is positioned in an optical system. The inspection method includes the steps of illuminating at least one ball on the ball array device, and disposing a sensor, a first optical element and a second optical element in relation to the ball array device so that the sensor obtains at least two differing views of the at least one ball, the sensor providing an output representing the at least two differing views. The output is processed using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

US Patent:

60647574, May 16, 2000

Filed:

May 28, 1999

Appl. No.:

9/321805

Inventors:

Elwin M. Beaty - Minnetonka MN
David P. Mork - Plymouth MN

International Classification:

G06K 900

US Classification:

382147

Abstract:

A three dimensional inspection process for ball array devices. The ball array device is positioned in a fixed optical system. The ball array device is illuminated and a first image of the ball array device is taken with a first camera disposed in a fixed focus position relative to the ball array device to obtain a characteristic circular doughnut shape image from a ball. A second image of the ball array device is taken with a second camera disposed in a fixed focus position relative to the ball array device to obtain a top surface image of the ball. The first image and the second image are processed using a triangulation method to calculate a three dimensional position of the ball with reference to a pre-calculated calibration plane.

US Patent:

60647566, May 16, 2000

Filed:

May 28, 1999

Appl. No.:

9/321838

Inventors:

Elwin M. Beaty - Minnetonka MN
David P. Mork - Plymouth MN

International Classification:

G06K 900

US Classification:

382146

Abstract:

A three dimensional inspection apparatus for ball array devices, where the ball array device is positioned in a fixed optical system. An illumination apparatus is positioned for illuminating the ball array device. A first camera is disposed in a fixed focus position relative to the ball array device for taking a first image of the ball array device to obtain a characteristic circular doughnut shape image from a ball. A second camera is disposed in a fixed focus position relative to the ball array device for taking a second image of the ball array device to obtain a top surface image of the ball. A processor applies triangulation calculations on related measurements of the first image and the second image to calculate a three dimensional position of the ball with reference to a pre-calculated calibration plane.

US Patent:

52765466, Jan 4, 1994

Filed:

Sep 16, 1992

Appl. No.:

7/945526

Inventors:

Steven G. Palm - Minneapolis MN
Elwin M. Beaty - Minnetonka MN

International Classification:

G02B 2608

US Classification:

359202

Abstract:

A part scanning and part calibration method for the inspection of printed circuit boards and integrated circuits includes a camera and two rotating mirrors to scan an image of a pattern mask retical upon which a precise pattern has been deposited. Small parts are placed upon the retical to be inspected. The third overhead mirror is provided to view the part under inspection from another perspective. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A precise retical mask is provided with dot patterns which provide an additional set of information needed for calibration. By scanning more than one dot pattern the missing state values can be resolved using an iterative trigonomic solution.

US Patent:

60728981, Jun 6, 2000

Filed:

Jan 16, 1998

Appl. No.:

9/008243

Inventors:

Elwin M. Beaty - Minnetonka MN
David P. Mork - Plymouth MN

International Classification:

G06K 900

US Classification:

382146

Abstract:

A calibration and part inspection method and apparatus for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by the two cameras.

US Patent:

53071492, Apr 26, 1994

Filed:

Aug 14, 1992

Appl. No.:

7/929939

Inventors:

Steven G. Palm - Minneapolis MN
Elwin M. Beaty - Minnetonka MN

International Classification:

G01B 1102

US Classification:

356375

Abstract:

A method for part placement of a semiconductor chip for inspection where the semiconductor chip has a plurality of leads defining a seating plane and a body having a top. The method includes the steps of placing the body on a platform in an up position where the plurality of leads are suspended and probing the top of the body. Next measuring the position of the top of the body with reference to a predetermined coordinate system is done. Then the part is moved until the part is suspended on the plurality of leads on a reference plane. The top of the body is then probed for a second time, and the second position of the top of the body is measured with reference to the predetermined coordinate system. The thickness of the part is then determined as the distance between the top of the part and its seating plane.