Abstract:
A process and apparatus is disclosed for removing adhesive tape such as is used in masking PC boards during plating operations, the apparatus including rollers carrying an adhesive band which is brought into pressure contact with the adhesive tape. The PC board is moved past the rollers to pick up the adhesive tape and strip it by wind-up on the roller periphery. Successive windings of the exposed adhesive undersurface of the tape act to enable successive removal cycles. The leading ends of the tape are easily strippable to facilitate removal, as by the use of a release agent, or by providing a localized area at the leading end of the tape which carries a mildly adherent adhesive.