Edward G Bundga

US Patent:

6425772, Jul 30, 2002

Filed:

Jul 23, 2001

Appl. No.:

09/911270

Inventors:

William E. Bernier - Endwell NY
Edward G. Bundga - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 458

US Classification:

439 91, 174117 A, 428626

Abstract:

Forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces. The resulting bond is preferably between metal contact pads on a dielectric substrate and on an electronic device. The connection is provided by utilizing a conductive adhesive wherein the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i. e. ; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. The polymer preferably is conventional polyimide/siloxane which is a thermoplastic, i. e. upon heating softens and upon cooling sets, and upon reheating will soften and reflow.

US Patent:

63311194, Dec 18, 2001

Filed:

Dec 28, 1999

Appl. No.:

9/474912

Inventors:

William E. Bernier - Endwell NY
Edward G. Bundga - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 458

US Classification:

439 91

Abstract:

A method of forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces thereon and the resulting bond is provided. Preferably, the metal surfaces are the surfaces of metal contact pads on a dielectric substrate and on an electronic device such as an I/C chip or chip carrier. The mechanical bond and electrical connection is provided by utilizing a conductive adhesive, in which adhesive the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon, preferably by electrodeposition. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i. e. ; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. However, the shape of the particle is not significant.

US Patent:

52811506, Jan 25, 1994

Filed:

Jan 5, 1993

Appl. No.:

8/000767

Inventors:

Edward G. Bundga - Endicott NY
Michael D. Dinardo - Owego NY
Jeffrey A. Knight - Endwell NY
Louis J. Konrad - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 2368

US Classification:

439 67

Abstract:

A method and device are provided for connecting a triaxial or coaxial cable to a substrate by surface mount technology wherein the substrate has a plurality of contact pads located on the surface thereof. The connector includes a signal wire connector element connected to the signal wire of the cable and a drain wire connector element connected to each of the drain wires of the cable. The connection also includes resilient connector element, including a flexible circuit having a plurality of spaced electrical conducting lines thereon. One set of lines is for connection to the signal wires of the cable and the other set for connection to the drain wire(s) of the cable. The opposite ends of the signal line and drain line of the flexible circuit element are connected to electrical connection pads on the substrate to provide signal and drain connections between the cable and the substrate. A support element is configured and positioned to mount a plurality of the connectors on the substrate with the resilient element being resiliently urged into contact with the electrical connection pads on the substrate.