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Dubravko I Babic

age ~64

from Milpitas, CA

Also known as:
  • Dubravko Ivan Babic
  • Dubravko Te Babic
Phone and address:
1017 Cervantez Ct, Milpitas, CA 95035

Dubravko Babic Phones & Addresses

  • 1017 Cervantez Ct, Milpitas, CA 95035
  • 196 Douglane Ave, Santa Clara, CA 95050 • 408 249-0000
  • Palo Alto, CA
  • San Jose, CA
  • Sunnyvale, CA
  • Sanger, CA

Work

  • Company:
    Eridan communications inc.
    Nov 2013
  • Position:
    Vice president rf devices

Education

  • School / High School:
    Uc Santa Barbara
    Sep 1989 to Sep 1995
  • Specialities:
    Electrical Engineering

Skills

Electronics • Business Development • Semiconductors • Rf • Product Development • Thin Films • R&D • Mems • Optoelectronics • Nanotechnology • Design of Experiments • Physics • Research and Development • Mixed Signal • Manufacturing • Semiconductor Industry • Product Management • Fiber Optics • Characterization • Optics • Engineering Management • Embedded Systems • Cross Functional Team Leadership • Microwave • Radio Frequency • Sensors • Analog • Engineering • Start Ups • Reliability • Photonics • Matlab • Simulations • Signal Processing

Languages

English • Croatian

Industries

Semiconductors
Name / Title
Company / Classification
Phones & Addresses
Dubravko Babic
Vice-President
Group4 Labs, Inc
To Develop And Market Unusual Semiconductor Materials For Use In Various Markets Par Value Is 0.001 · Mfg Misc Industry Machinery
39500 Stevenson Pl, Fremont, CA 94539
1879 Euclid Ave, Berkeley, CA 94709
155 Seaport Blvd, Boston, MA 02210
650 688-5760
Dubravko Babic
CTO
ALVESTA CORPORATION
Mfg Pressed/Blown Glass · Other Pressed and Blown Glass and Glassware Manufacturing
500 Oakmead Prkwy, Sunnyvale, CA 94085
500 Oakmead Pkwy, Sunnyvale, CA 94085
408 331-4800

Us Patents

  • System And Method For The Monolithic Integration Of A Light Emitting Device And A Photodetector Using A Native Oxide Semiconductor Layer

    view source
  • US Patent:
    6483862, Nov 19, 2002
  • Filed:
    Dec 11, 1998
  • Appl. No.:
    09/209528
  • Inventors:
    Lewis B. Aronson - Los Altos CA
    Michael R. T. Tan - Menlo Park CA
    Scott W. Corzine - Sunnyvale CA
    Dubravko I. Babic - Sunnyvale CA
  • Assignee:
    Agilent Technologies, Inc. - Palo Alto CA
  • International Classification:
    H01S 500
  • US Classification:
    372 50, 372 45, 372 96
  • Abstract:
    A light emitting device and photodetector combination having a structure in which the layer of the photodetector that contacts the light emitting device is separated from the light emitting device by a native semiconductor oxide layer that is both insulating and has a refractive index lower than that of the light emitting device and the photodetector. This configuration results in a light emitting device and photodetector structure that minimizes the capture of the spontaneous emission light output from the light emitting device by the photodetector while electrically isolating the light emitting device from the photodetector. The electrical isolation of the light emitting device from the photodetector results in a four terminal device in which the light emitting device and photodetector may be independently biased, and can therefore be operated at a very low bias voltage.
  • Integrated Coupling Modules For High-Bandwidth Fiber-Optic Systems

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  • US Patent:
    6493489, Dec 10, 2002
  • Filed:
    Nov 29, 2000
  • Appl. No.:
    09/726370
  • Inventors:
    Pierre H. Mertz - Sunnyvale CA
    Dubravko Babic - Sunnyvale CA
  • Assignee:
    Alvesta Corporation - Sunnyvale CA
  • International Classification:
    G02B 632
  • US Classification:
    385 52, 385 33, 385 39, 385 91
  • Abstract:
    An integrated and modular coupling module for coupling light between optical devices, such as an optical fiber connector and optoelectronic device, is presented. In this invention, beam-shaping elements and alignment elements are integrated on a single alignment plate in such a way that they maintain a precise physical relationship. The relative physical arrangement between the beam-shaping elements and the alignment elements are configured such that once the alignment elements are engaged with the peripheral devices, accurate optical alignment between the peripheral devices and the coupling module is also attained. The optical coupling module of the present invention enables it to withstand temperatures of 220Â C. or higher while maintaining its integrity and performance. The principle of the present invention can also be extended to constructing coupling modules for coupling other types of electromagnetic radiation.
  • System For Optically Pumping A Long Wavelength Laser Using A Short Wavelength Laser

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  • US Patent:
    6553051, Apr 22, 2003
  • Filed:
    Oct 31, 2000
  • Appl. No.:
    09/703389
  • Inventors:
    Michael R. T. Tan - Menlo Park CA
    Scott W. Corzine - Sunnyvale CA
    Dubravko I. Babic - Sunnyvale CA
    Albert T. Yuen - Los Altos CA
  • Assignee:
    Agilent Technologies, Inc. - Palo Alto CA
  • International Classification:
    H01S 3091
  • US Classification:
    372 70, 372 92
  • Abstract:
    An optical assembly includes an optical subassembly containing a prefabricated long wavelength laser optically coupled to a prefabricated short wavelength laser located in a housing. The optical subassembly may be removably installed in the housing in which the short wavelength laser is contained. The short wavelength laser optically pumps the long wavelength laser resulting in a long wavelength laser output. The optical subassembly allows the independent fabrication, optimization and testing of the short wavelength laser and the long wavelength laser.
  • Flip-Chip Assembly For Optically-Pumped Lasers

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  • US Patent:
    6647050, Nov 11, 2003
  • Filed:
    Sep 18, 2001
  • Appl. No.:
    09/954825
  • Inventors:
    Albert T. Yuen - Los Altos CA
    Michael R. T. Tan - Menlo Park CA
    Dubravko Ivan Babic - Palo Alto CA
    Scott William Corzine - Sunnyvale CA
  • Assignee:
    Agilent Technologies, Inc. - Palo Alto CA
  • International Classification:
    H01S 500
  • US Classification:
    372 96, 372 75
  • Abstract:
    A short-wavelength vertical cavity surface emitting laser (VCSEL) is flip-chip bonded to a long-wavelength VCSEL. The short-wavelength VCSEL is used to optically-pump the long-wavelength VCSEL. Certain embodiments of the invention can serve as optical sources for optical fiber communication systems. Methods also are provided.
  • Embedded Electromagnetic Interference Shield

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  • US Patent:
    6822879, Nov 23, 2004
  • Filed:
    Aug 6, 2002
  • Appl. No.:
    10/213540
  • Inventors:
    Lakshman Rathnam - Mountain View CA
    Herbert Kraus - Orange CA
    Dubravko Babic - Palo Alto CA
  • Assignee:
    Emcore Corporation - Somerset NJ
  • International Classification:
    H05K 900
  • US Classification:
    361818, 361800, 361816, 714 35, 714 51 R, 439939, 439607
  • Abstract:
    An improved electromagnetic interference shield for a module includes springs in which the compression force pushes the springs in a direction that is approximately parallel to the optic axis. The springs allow significantly looser tolerances on the placement of the module on its associated printed circuit board. The shield also includes an opening near its center, the edge of which includes a plurality of teeth. When the shield is placed onto the module, the teeth bend along the negative optic axis direction and prevent the shield from being pulled away from the module. Accidental removal of the shield is thus prevented. The shield splits the enclosure ground from the internal signal ground, decreasing the capacitance between them, in turn decreasing another possible source of electromagnetic radiation. In addition, the shield is more cost efficient to manufacture since it only requires a one step assembly process.
  • Multi-Wavelength Grating-Outcoupled Surface Emitting Laser System

    view source
  • US Patent:
    7113526, Sep 26, 2006
  • Filed:
    Oct 9, 2003
  • Appl. No.:
    10/682334
  • Inventors:
    Gary A. Evans - Plano TX, US
    Dubravko Babic - San Jose CA, US
  • Assignee:
    Photodigm, Inc. - Richardson TX
  • International Classification:
    H01S 3/10
    H01S 5/00
    H01S 3/08
    H01S 3/082
  • US Classification:
    372 23, 372 5011, 372 96, 372 97, 372102
  • Abstract:
    A surface emitting semiconductor laser system having four cavities that couple light from a single aperture. Each of the four cavities overlaps at the outcoupling aperture. Each cavity is fabricated to resonate at a different central wavelength, outputting a different frequency of light, each of which can be independently modulated.
  • Semiconductor Devices Having Gallium Nitride Epilayers On Diamond Substrates

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  • US Patent:
    7595507, Sep 29, 2009
  • Filed:
    Apr 12, 2006
  • Appl. No.:
    11/279553
  • Inventors:
    Daniel Francis - Oakland CA, US
    Felix Ejeckam - San Francisco CA, US
    John Wasserbauer - San Leandro CA, US
    Dubravko Babic - San Jose CA, US
  • Assignee:
    Group4 Labs LLC - Menlo Park CA
  • International Classification:
    H01L 31/0264
    H01L 29/778
    H01L 29/20
  • US Classification:
    257 76, 257194, 257615, 257E29246, 257E29068
  • Abstract:
    Methods for integrating wide-gap semiconductors with synthetic diamond substrates are disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure including at least one layer of gallium nitride, aluminum nitride, silicon carbide, or zinc oxide. The resulting structure is a low stress process compatible with wide-gap semiconductor films, and may be processed into optical or high-power electronic devices. The diamond substrates serve as heat sinks or mechanical substrates.
  • Composite Wafers Having Bulk-Quality Semiconductor Layers And Method Of Manufacturing Thereof

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  • US Patent:
    7943485, May 17, 2011
  • Filed:
    Jan 22, 2008
  • Appl. No.:
    12/018131
  • Inventors:
    Daniel Francis - Oakland CA, US
    Felix Ejeckam - San Francisco CA, US
    John Wasserbauer - San Leandro CA, US
    Firooz Faili - Los Gatos CA, US
    Dubravko Babic - San Jose CA, US
  • Assignee:
    Group4 Labs, LLC - Menlo Park CA
  • International Classification:
    H01L 21/30
    H01L 21/46
  • US Classification:
    438458, 438455, 257E2157, 257E21568
  • Abstract:
    Method for producing composite wafers with thin high-quality semiconductor films atomically attached to synthetic diamond wafers is disclosed. Synthetic diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited on bulk semiconductor wafer which has been prepared to allow separation of the thin semiconductor film from the remaining bulk semiconductor wafer. The remaining semiconductor wafer is available for reuse. The synthetic diamond substrate serves as heat spreader and a mechanical substrate.

Resumes

Dubravko Babic Photo 1

Managing Director

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Location:
1017 Cervantez Ct, Milpitas, CA 95035
Industry:
Semiconductors
Work:
Eridan Communications Inc.
Vice President Rf Devices

Group4Labs Sep 2008 - Apr 2013
Vice President Rf Electronics

Fer/University of Zagreb Sep 2008 - Apr 2013
Associate Professor

Xloom Communications, Ltd. Sep 2006 - Nov 2008
Vice President Us Operations

Clariphy Communications 2003 - 2008
Consultant
Education:
Uc Santa Barbara Sep 1989 - Sep 1995
Uc Santa Barbara 1982 - 1984
Skills:
Electronics
Business Development
Semiconductors
Rf
Product Development
Thin Films
R&D
Mems
Optoelectronics
Nanotechnology
Design of Experiments
Physics
Research and Development
Mixed Signal
Manufacturing
Semiconductor Industry
Product Management
Fiber Optics
Characterization
Optics
Engineering Management
Embedded Systems
Cross Functional Team Leadership
Microwave
Radio Frequency
Sensors
Analog
Engineering
Start Ups
Reliability
Photonics
Matlab
Simulations
Signal Processing
Languages:
English
Croatian

Googleplus

Dubravko Babic Photo 2

Dubravko Babic

Lived:
Zagreb, Croatia
Santa Clara, California, USA
Santa Barbara, California, USA
Work:
Group4 Labs, Inc. - VP RF Electronics (2008)
Avantek - Design Engineer (1985-1989)
Hewlett-Packard - MTS (1995-1999)
Alvesta Corp - CEO/CTO (1999-2003)
Etanvie Technologies - CEO (2003-2008)
Education:
MIOC / Zagreb, ETF / Zagreb - EE, University of California, Santa Barbara - ECE

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Youtube

Dubravko Babi - Od ideje do proizvoda [Scienc...

Profesor Dubravko Babi na treem nastavku ScienceUp programa koji organ...

  • Duration:
    11m 16s

Od Amerike do svemira - Dubravko Babi | podki...

Profesor Dubravko Babi, prvi gost podkista, ispriao nam je sve o svoji...

  • Duration:
    1h 22m 7s

Dubravko Babi - Do Amerike i nazad hrvatsko, ...

IEEE-E25 - odjel za obrazovanje.

  • Duration:
    34m 32s

Dubravko Babi - Do Amerike i nazad hrvatsko, ...

IEEE-E25 - odjel za obrazovanje.

  • Duration:
    47m 33s

to se moe patentirati i kako - Dubravko Babi,...

Profesor Dubravko Babi sa Zavoda za komunikacijske i svemirske tehnolo...

  • Duration:
    3m 51s

Elizabeth Borisyuk, Dubravko Babi i Matea Vas...

  • Duration:
    59s

KOEOE predavanje 1

  • Duration:
    2h 52s

Bavimo se svemirom jer je cool | Dubravko Babi

Cijeli podkist specijal o prednostima profila Komunikacijske i svemirs...

  • Duration:
    11m 52s

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