Lewis B. Aronson - Los Altos CA Michael R. T. Tan - Menlo Park CA Scott W. Corzine - Sunnyvale CA Dubravko I. Babic - Sunnyvale CA
Assignee:
Agilent Technologies, Inc. - Palo Alto CA
International Classification:
H01S 500
US Classification:
372 50, 372 45, 372 96
Abstract:
A light emitting device and photodetector combination having a structure in which the layer of the photodetector that contacts the light emitting device is separated from the light emitting device by a native semiconductor oxide layer that is both insulating and has a refractive index lower than that of the light emitting device and the photodetector. This configuration results in a light emitting device and photodetector structure that minimizes the capture of the spontaneous emission light output from the light emitting device by the photodetector while electrically isolating the light emitting device from the photodetector. The electrical isolation of the light emitting device from the photodetector results in a four terminal device in which the light emitting device and photodetector may be independently biased, and can therefore be operated at a very low bias voltage.
Integrated Coupling Modules For High-Bandwidth Fiber-Optic Systems
Pierre H. Mertz - Sunnyvale CA Dubravko Babic - Sunnyvale CA
Assignee:
Alvesta Corporation - Sunnyvale CA
International Classification:
G02B 632
US Classification:
385 52, 385 33, 385 39, 385 91
Abstract:
An integrated and modular coupling module for coupling light between optical devices, such as an optical fiber connector and optoelectronic device, is presented. In this invention, beam-shaping elements and alignment elements are integrated on a single alignment plate in such a way that they maintain a precise physical relationship. The relative physical arrangement between the beam-shaping elements and the alignment elements are configured such that once the alignment elements are engaged with the peripheral devices, accurate optical alignment between the peripheral devices and the coupling module is also attained. The optical coupling module of the present invention enables it to withstand temperatures of 220Â C. or higher while maintaining its integrity and performance. The principle of the present invention can also be extended to constructing coupling modules for coupling other types of electromagnetic radiation.
System For Optically Pumping A Long Wavelength Laser Using A Short Wavelength Laser
Michael R. T. Tan - Menlo Park CA Scott W. Corzine - Sunnyvale CA Dubravko I. Babic - Sunnyvale CA Albert T. Yuen - Los Altos CA
Assignee:
Agilent Technologies, Inc. - Palo Alto CA
International Classification:
H01S 3091
US Classification:
372 70, 372 92
Abstract:
An optical assembly includes an optical subassembly containing a prefabricated long wavelength laser optically coupled to a prefabricated short wavelength laser located in a housing. The optical subassembly may be removably installed in the housing in which the short wavelength laser is contained. The short wavelength laser optically pumps the long wavelength laser resulting in a long wavelength laser output. The optical subassembly allows the independent fabrication, optimization and testing of the short wavelength laser and the long wavelength laser.
Albert T. Yuen - Los Altos CA Michael R. T. Tan - Menlo Park CA Dubravko Ivan Babic - Palo Alto CA Scott William Corzine - Sunnyvale CA
Assignee:
Agilent Technologies, Inc. - Palo Alto CA
International Classification:
H01S 500
US Classification:
372 96, 372 75
Abstract:
A short-wavelength vertical cavity surface emitting laser (VCSEL) is flip-chip bonded to a long-wavelength VCSEL. The short-wavelength VCSEL is used to optically-pump the long-wavelength VCSEL. Certain embodiments of the invention can serve as optical sources for optical fiber communication systems. Methods also are provided.
An improved electromagnetic interference shield for a module includes springs in which the compression force pushes the springs in a direction that is approximately parallel to the optic axis. The springs allow significantly looser tolerances on the placement of the module on its associated printed circuit board. The shield also includes an opening near its center, the edge of which includes a plurality of teeth. When the shield is placed onto the module, the teeth bend along the negative optic axis direction and prevent the shield from being pulled away from the module. Accidental removal of the shield is thus prevented. The shield splits the enclosure ground from the internal signal ground, decreasing the capacitance between them, in turn decreasing another possible source of electromagnetic radiation. In addition, the shield is more cost efficient to manufacture since it only requires a one step assembly process.
Multi-Wavelength Grating-Outcoupled Surface Emitting Laser System
Gary A. Evans - Plano TX, US Dubravko Babic - San Jose CA, US
Assignee:
Photodigm, Inc. - Richardson TX
International Classification:
H01S 3/10 H01S 5/00 H01S 3/08 H01S 3/082
US Classification:
372 23, 372 5011, 372 96, 372 97, 372102
Abstract:
A surface emitting semiconductor laser system having four cavities that couple light from a single aperture. Each of the four cavities overlaps at the outcoupling aperture. Each cavity is fabricated to resonate at a different central wavelength, outputting a different frequency of light, each of which can be independently modulated.
Semiconductor Devices Having Gallium Nitride Epilayers On Diamond Substrates
Daniel Francis - Oakland CA, US Felix Ejeckam - San Francisco CA, US John Wasserbauer - San Leandro CA, US Dubravko Babic - San Jose CA, US
Assignee:
Group4 Labs LLC - Menlo Park CA
International Classification:
H01L 31/0264 H01L 29/778 H01L 29/20
US Classification:
257 76, 257194, 257615, 257E29246, 257E29068
Abstract:
Methods for integrating wide-gap semiconductors with synthetic diamond substrates are disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure including at least one layer of gallium nitride, aluminum nitride, silicon carbide, or zinc oxide. The resulting structure is a low stress process compatible with wide-gap semiconductor films, and may be processed into optical or high-power electronic devices. The diamond substrates serve as heat sinks or mechanical substrates.
Composite Wafers Having Bulk-Quality Semiconductor Layers And Method Of Manufacturing Thereof
Daniel Francis - Oakland CA, US Felix Ejeckam - San Francisco CA, US John Wasserbauer - San Leandro CA, US Firooz Faili - Los Gatos CA, US Dubravko Babic - San Jose CA, US
Assignee:
Group4 Labs, LLC - Menlo Park CA
International Classification:
H01L 21/30 H01L 21/46
US Classification:
438458, 438455, 257E2157, 257E21568
Abstract:
Method for producing composite wafers with thin high-quality semiconductor films atomically attached to synthetic diamond wafers is disclosed. Synthetic diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited on bulk semiconductor wafer which has been prepared to allow separation of the thin semiconductor film from the remaining bulk semiconductor wafer. The remaining semiconductor wafer is available for reuse. The synthetic diamond substrate serves as heat spreader and a mechanical substrate.
Eridan Communications Inc.
Vice President Rf Devices
Group4Labs Sep 2008 - Apr 2013
Vice President Rf Electronics
Fer/University of Zagreb Sep 2008 - Apr 2013
Associate Professor
Xloom Communications, Ltd. Sep 2006 - Nov 2008
Vice President Us Operations
Clariphy Communications 2003 - 2008
Consultant
Education:
Uc Santa Barbara Sep 1989 - Sep 1995
Uc Santa Barbara 1982 - 1984
Skills:
Electronics Business Development Semiconductors Rf Product Development Thin Films R&D Mems Optoelectronics Nanotechnology Design of Experiments Physics Research and Development Mixed Signal Manufacturing Semiconductor Industry Product Management Fiber Optics Characterization Optics Engineering Management Embedded Systems Cross Functional Team Leadership Microwave Radio Frequency Sensors Analog Engineering Start Ups Reliability Photonics Matlab Simulations Signal Processing
Languages:
English Croatian
Googleplus
Dubravko Babic
Lived:
Zagreb, Croatia Santa Clara, California, USA Santa Barbara, California, USA