Donald Lee Mullen

Author:

Donald C. Mullen

ISBN #:

0534133266

Author:

Donald C. Mullen

ISBN #:

0534133290

US Patent:

6621373, Sep 16, 2003

Filed:

May 26, 2000

Appl. No.:

09/579776

Inventors:

Donald R. Mullen - Mountain View CA
Donald V. Perino - Los Altos CA
Haw-Jyh Liaw - Fremont CA

Assignee:

Rambus Inc. - Los Altos CA

International Classification:

H01P 123

US Classification:

333 81A, 333 12

Abstract:

An electronic device includes a standard dielectric material and a lossy material integrated with the standard dielectric material to selectively control the distributed resistance of the standard dielectric material. The lossy material may be inserted into the standard dielectric material. The inserted material may be resistive particles, carbon particles, open cell conductive foam, carbon impregnated open cell conductive foam, and the like. The lossy material may also be a loss inducing physical structure attached to the standard dielectric material. The loss inducing physical structure may be a planar resistive layer attached to the standard dielectric material. The planar resistive layer may have an extended surface to attenuate high frequency signals.

US Patent:

6853557, Feb 8, 2005

Filed:

Sep 20, 2000

Appl. No.:

09/665920

Inventors:

Belgacem Haba - Cupertino CA, US
Sayeh Khalili - San Jose CA, US
Donald R. Mullen - Mountain View CA, US
Nader Gamini - Monte Sereno CA, US

Assignee:

Rambus, Inc. - Los Altos CA

International Classification:

H05K007/02

US Classification:

361760, 361777, 174261

Abstract:

A memory architecture includes a first substrate containing multiple memory devices and a first channel portion extending across the first substrate. The architecture further includes a second substrate containing multiple memory devices and a second channel portion extending across the second substrate. A connector couples the first channel portion to the second channel portion to form a single channel. The connector includes a first slot that receives an edge of the first substrate and a second slot that receives an edge of the second substrate. Another connector has a pair of slots that receive opposite edges of the first and second substrates. The channel portions extend across the substrates in a substantially linear path. Each channel portion includes multiple conductors having lengths that are approximately equal.

US Patent:

6870246, Mar 22, 2005

Filed:

Aug 31, 2001

Appl. No.:

09/944545

Inventors:

Donald R. Mullen - Mountain View CA, US
Belgacem Haba - Cupertino CA, US
Ming Li - Fremont CA, US

Assignee:

Rambus Inc. - Los Altos CA

International Classification:

H01L023/02

US Classification:

257678, 257713

Abstract:

An integrated circuit cover incorporating a spring portion is described. The spring portion may include any structure that allows displacement between a plate portion of the integrated circuit cover and an attachment portion of the integrated circuit cover and that provides a substantially equalizing effect of pressure on the plate portion. The spring portion is preferably more flexible than the plate portion. The integrated circuit cover accommodates variations in the mounted height of integrated circuits over which the integrated circuit cover is installed The integrated circuit cover may be formed as a unitary structure or may be constructed as an assembly of multiple components.

US Patent:

7538424, May 26, 2009

Filed:

Jul 8, 2004

Appl. No.:

10/888907

Inventors:

Donald R. Mullen - Mountain View CA, US
Ming Li - Fremont CA, US

Assignee:

Rambus Inc. - Los Altos CA

International Classification:

H01L 23/34

US Classification:

257712, 257774

Abstract:

The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.

US Patent:

7705445, Apr 27, 2010

Filed:

Feb 11, 2005

Appl. No.:

11/056535

Inventors:

Ming Li - Fremont CA, US
Sayeh Khalili - San Jose CA, US
Donald R. Mullen - Mountain View CA, US

Assignee:

Rambus Inc. - Los Altos CA

International Classification:

H01L 23/14

US Classification:

257700, 257774, 257E23067

Abstract:

The semiconductor package includes two electrical contacts and a semiconductor device coupled to opposing sides of a substrate. The substrate defines at least one via extending at least partially there through. The semiconductor device includes a semiconductor low-speed interface electrically coupled to one of the electrical contacts through the via, and a semiconductor high-speed interface electrically coupled to flexible tape. The flexible tape is also electrically coupled to the other one of the electrical contacts.

US Patent:

8039952, Oct 18, 2011

Filed:

May 26, 2009

Appl. No.:

12/472340

Inventors:

Donald R. Mullen - Mountain View CA, US
Ming Li - Fremont CA, US

Assignee:

Rambus Inc. - Sunnyvale CA

International Classification:

H05K 7/20

US Classification:

257712, 257720, 257774

Abstract:

The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.

US Patent:

8193573, Jun 5, 2012

Filed:

Sep 4, 2008

Appl. No.:

12/676594

Inventors:

Gary B. Bronner - Los Altos CA, US
Ming Li - Fremont CA, US
Donald R. Mullen - Mountain View CA, US
Frederick Ware - Los Altos Hills CA, US
Kevin S. Donnelly - Los Altos CA, US

Assignee:

Rambus Inc. - Sunnyvale CA

International Classification:

H01L 29/76
H01L 21/8238

US Classification:

257314, 257E27084, 257E27102, 257E27104, 257E21209, 257E21646, 257E21662, 257E21665, 257E2168, 257E29129, 438201

Abstract:

A method of repairing a nonvolatile semiconductor memory device to eliminate defects includes monitoring a memory endurance indicator for a nonvolatile semiconductor memory device contained in a semiconductor package. It is determined whether that the memory endurance indicator exceeds a predefined limit. Finally, in response to determining that the memory endurance indicator exceeds the predefined limit, the device is annealed.

US Patent:

8415788, Apr 9, 2013

Filed:

Aug 20, 2010

Appl. No.:

12/860811

Inventors:

Ming Li - Fremont CA, US
Donald R. Mullen - Mountain View CA, US

Assignee:

Rambus Inc. - Sunnyvale CA

International Classification:

H05K 7/20

US Classification:

257723, 257712, 257720, 257774, 361709, 361717

Abstract:

A system includes a circuit board, a multi-die package, and a heat dissipator. The circuit board has substantially planar opposing first and second sides. The multi-die package includes a substrate and a first set of one or more semiconductor devices on a first substrate side and a second set of one or more semiconductor devices on a second substrate side. The multi-die package is located at the first circuit board side. The heat dissipator is located at the second circuit board side, and thermally coupled to the second set of semiconductor devices. One or more portions of the circuit board are removed between the first circuit board side and the second circuit board side so as to define one or more holes through the circuit board and to facilitate thermal coupling between the second set of semiconductor devices and the heat dissipator through the one or more holes.