Derrick M Herron

US Patent:

20050092819, May 5, 2005

Filed:

Oct 1, 2004

Appl. No.:

10/954570

Inventors:

Yan Liu - Clinton NY, US
Derrick Herron - Utica NY, US

International Classification:

B23K031/02

US Classification:

228248100

Abstract:

Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.

US Patent:

20120248176, Oct 4, 2012

Filed:

Apr 1, 2011

Appl. No.:

13/078824

Inventors:

DERRICK Matthew HERRON - Canastota NY, US
FENGYING ZHOU - JiangSu, CN

International Classification:

B23K 1/20
B23K 35/24
B23K 35/363

US Classification:

2282481, 148 24

Abstract:

A solder is provided that produces a more impact resistant solder joint that is usable in high-end applications. The solder joint has a strong interconnection that can perform all of the normal functions of a solder joint while being more impact resistant. Furthermore, the solder joint retains its capabilities over the service life of a high-end product such as a computer or a cell phone. The solder meets the requirements of the soldering industry both today and into the future, including but not limited to an ability to be printed or dispensed with standard methods and conformity to health and safety standards.

US Patent:

20160057869, Feb 25, 2016

Filed:

Aug 24, 2015

Appl. No.:

14/833398

Inventors:

- Clinton NY, US
Lei Luo - Shenzhen, CN
Christopher John Nash - Barneveld NY, US
Derrick Matthew Herron - Canastota NY, US

Assignee:

Indium Corporation - Clinton NY

International Classification:

H05K 3/34
H05K 1/18
H05K 1/11
B23K 1/00
H01L 23/495

Abstract:

Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.