Demick N Mcmullin
age ~53
from Catasauqua, PA
- Also known as:
-
- Demick N Mcmillin
- Mcmullin Demick
- Demick Mc
- Mc Demick
- Neil Mcmullin Demick
- Phone and address:
-
841 Willow St, Catasauqua, PA 18032
610 443-0719
Demick Mcmullin Phones & Addresses
- 841 Willow St, Catasauqua, PA 18032 • 610 443-0719
- 4973 Rawhide Ave, Boise, ID 83709
- Pocatello, ID
- Phoenix, AZ
- 5544 S Missoula Way, Boise, ID 83709
Resumes
Development Engineer At R&D Circuits
view sourcePosition:
Development Engineer at R&D Circuits, No Title at Peak Science Communications, Developer at Sanyu-USA
Location:
Allentown, Pennsylvania Area
Industry:
Electrical/Electronic Manufacturing
Work:
Peak Science Communications - Boise Idaho since Oct 2011
No Title
Sanyu-USA since May 2011
Developer
RD Circuits Aug 2008 - Mar 2010
Process Engineer
Conectl Test /Anestel 2004 - 2007
Process Engineer
Idaho Accelerator Center 2002 - 2006
Operator
No Title
Sanyu-USA since May 2011
Developer
RD Circuits Aug 2008 - Mar 2010
Process Engineer
Conectl Test /Anestel 2004 - 2007
Process Engineer
Idaho Accelerator Center 2002 - 2006
Operator
Education:
Idaho State University 2002 - 2006
Skills:
AutoCad
ESI Laser Operation, Maintenance, and Programming
LPKF Laser Operation, Maintenance, and Programming
Manufacturing
R&D
Testing
Optics
Physics
Electronics
Materials
Product Development
Cross-functional Team Leadership
Strategic Planning
Microsoft Office
Engineering Management
HTML
Team Building
ESI Laser Operation, Maintenance, and Programming
LPKF Laser Operation, Maintenance, and Programming
Manufacturing
R&D
Testing
Optics
Physics
Electronics
Materials
Product Development
Cross-functional Team Leadership
Strategic Planning
Microsoft Office
Engineering Management
HTML
Team Building
Interests:
Writing.
Co-Founder Tvorca Technician
view sourceLocation:
5544 south Missoula Way, Boise, ID 83709
Industry:
Computer Software
Work:
Programming Apps For Ios and Android
Co-Founder Tvorca Technician
Devmountain Student Developers Apr 2017 - May 2017
Ios Private Project Conspiracy Research and Builder
Devmountain Student Developers Apr 2017 - Apr 2017
Ios App Developer: Qwaq
Rd Interconnect Solutions Feb 1, 2012 - Oct 2016
Development Engineer
Sanyu Usa, Inc. May 2011 - Jul 2012
Developer
Co-Founder Tvorca Technician
Devmountain Student Developers Apr 2017 - May 2017
Ios Private Project Conspiracy Research and Builder
Devmountain Student Developers Apr 2017 - Apr 2017
Ios App Developer: Qwaq
Rd Interconnect Solutions Feb 1, 2012 - Oct 2016
Development Engineer
Sanyu Usa, Inc. May 2011 - Jul 2012
Developer
Education:
Idaho State University College of Business 2002 - 2006
Skills:
Autocad
Manufacturing
R&D
Testing
Optics
Physics
Electronics
Materials
Product Development
Cross Functional Team Leadership
Strategic Planning
Microsoft Office
Engineering Management
Team Building
Lean Manufacturing
Engineering
Research and Development
Github
Core Data
Swift
Objective C
Mvc Architecture
Cocoa Touch
App Store
Git
User Interface Design
Debugging
Sketch App
Project Planning
Teamwork
Software Development
Software Architectural Design
Mobile Applications
Object Oriented Programming
Uikit
Ios
Ios Development
Mapkit
Manufacturing
R&D
Testing
Optics
Physics
Electronics
Materials
Product Development
Cross Functional Team Leadership
Strategic Planning
Microsoft Office
Engineering Management
Team Building
Lean Manufacturing
Engineering
Research and Development
Github
Core Data
Swift
Objective C
Mvc Architecture
Cocoa Touch
App Store
Git
User Interface Design
Debugging
Sketch App
Project Planning
Teamwork
Software Development
Software Architectural Design
Mobile Applications
Object Oriented Programming
Uikit
Ios
Ios Development
Mapkit
Interests:
Writing
Us Patents
-
Method And Structure For Conductive Elastomeric Pin Arrays Using Solder Interconnects And A Non-Conductive Medium And Individual Solderable Compression Stops
view source -
US Patent:20150295337, Oct 15, 2015
-
Filed:Nov 5, 2014
-
Appl. No.:14/533406
-
Inventors:- Allentown PA, US
James V. Russell - New Hope PA, US
Thomas P. Warwick - Melbourne PA, US
Demick McMullin - Catasauqua PA, US
William Quick - Belleville NJ, US -
Assignee:R&D Sockets,Inc - Allentown PA
-
International Classification:H01R 13/24
H01R 43/00 -
Abstract:A method and structure is provided for constructing elastomeric pin arrays using solder interconnects and a non-conductive medium. Pin to pin interconnects are constructed using a solder connection through a non-conductive medium. This structure eliminates the need for PCB structures as the medium, reducing manufacturing cost. In another embodiment a non conductive medium has holes therein and serves as a compression stop. One or more first elastomeric column is formed on an upper side of a conductive disc. The conductive disc is fixedly adhered to a pad located on an underside of the non conductive medium aligned so that the one or more first elastomeric column extends through said holes of the non conductive medium. One or more second elastomeric column is formed on an underside or bottom of the conductive medium or disc. A compression stop serves as a compression stop for said underside or bottom elastomeric column
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