Delin Li

US Patent:

6381837, May 7, 2002

Filed:

Sep 4, 1998

Appl. No.:

09/148061

Inventors:

Jay DeAvis Baker - W. Bloomfield MI
Edward McLeskey - Waterford MI
Delin Li - Canton MI
Cuong Van Pham - Belleville MI
Robert Edward Belke - West Bloomfield MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Thomas B Krautheim - Belleville MI
Mohan R. Paruchuri - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI
Jun Ming Hu - Canton MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H05K 334

US Classification:

29840, 29832, 29834, 29831, 29846, 174261

Abstract:

A method for producing an electronic circuit assembly (e. g. , a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

US Patent:

6403893, Jun 11, 2002

Filed:

Mar 20, 2001

Appl. No.:

09/907971

Inventors:

Achyuta Achari - Canton MI
Andrew Zachary Glovatsky - Plymouth MI
Robert Edward Belke - West Bloomfield MI
Brenda Joyce Nation - Troy MI
Delin Li - Canton MI
Lakhi N. Goenka - Ann Arbor MI
Robert Joseph Gordon - Livonia MI
Thomas Bernd Krautheim - Belleville MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H05K 114

US Classification:

174255, 174261, 29847, 216 15, 430311

Abstract:

A method for making a multi-layer electronic circuit board having electroplated apertures which may be selectively and electrically isolated from an electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material.

US Patent:

6467161, Oct 22, 2002

Filed:

Mar 20, 2001

Appl. No.:

09/812989

Inventors:

Achyuta Achari - Canton MI
Brenda Joyce Nation - Troy MI
Delin Li - San Jose CA
Lakhi N. Goenka - Ann Arbor MI
Richard Keith McMillan - Dearborn MI
Vivek A. Jairazbhoy - Farmington Hills MI

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

H05K 320

US Classification:

29831, 29846, 29852, 29830

Abstract:

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically connected to a source of ground potential.

US Patent:

6475703, Nov 5, 2002

Filed:

Dec 1, 1998

Appl. No.:

09/203148

Inventors:

Delin Li - Canton MI
Achyuta Achari - Canton MI
Alice Dawn Zitzmann - Belleville MI
Brenda Joyce Nation - Troy MI
Edward McLeskey - Waterford MI
Mohan R. Paruchuri - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

G03C 556

US Classification:

430313, 430315, 430329, 216 15, 216 16, 216 20, 427404, 427405, 427471, 427532

Abstract:

A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

US Patent:

6499214, Dec 31, 2002

Filed:

Mar 20, 2001

Appl. No.:

09/812449

Inventors:

Delin Li - San Jose CA
Richard Keith McMillan - Dearborn MI
Zhong-You Shi - Ann Arbor MI

Assignee:

Visteon Global Tech, Inc. - Dearborn MI

International Classification:

H05K 320

US Classification:

29831, 29830, 29846, 29852

Abstract:

A method for making multi-layer circuit boards having metallized apertures which may be selectively and electrically grounded and having at least one formed air-bridge.

US Patent:

6584682, Jul 1, 2003

Filed:

Mar 20, 2001

Appl. No.:

09/812345

Inventors:

Robert Edward Belke - West Bloomfield MI
Thomas Bernd Krautheim - Belleville MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Delin Li - San Jose CA

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

H05K 320

US Classification:

29831, 29846, 29852

Abstract:

A method for making multi-layer electronic circuit boards having aperture which may be selectively connected to an electrical ground potential.

US Patent:

6601292, Aug 5, 2003

Filed:

Jun 26, 2001

Appl. No.:

09/891697

Inventors:

Delin Li - Canton MI
Jay DeAvis Baker - W. Bloomfield MI
Achyuta Achari - Canton MI
Brenda Joyce Nation - Troy MI
John Trublowski - Troy MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H05K 300

US Classification:

29829, 2940208, 2940209, 29854, 174254, 174262, 361749, 361778, 361789, 439 60, 439 67, 4399241

Abstract:

A method for making and repairing connections between first and second circuits, such as flex circuits. An article includes: a flexible dielectric substrate having first and second edges and a plurality of conductive circuit traces arranged on or within the substrate, wherein each of the traces extends from proximate the first edge to proximate the second edge Each of the circuit traces includes: a first connection feature disposed proximate the first edge a second connection feature disposed proximate the second edge and at least one third connection feature disposed between the first and second edges Each of the first, second, and third connection features is a plated through hole, a plated blind via, or a mounting pad. This article may be used to connect together the first and second circuits using the first and second connection features such as by soldering. If either of the two circuits needs to be subsequently detached (e. g.

US Patent:

6613239, Sep 2, 2003

Filed:

Apr 17, 2001

Appl. No.:

09/836644

Inventors:

Andrew Z. Glovatsky - Plymouth MI
Robert E. Belke - West Bloomfield MI
Delin Li - San Jose CA
Lakhi N. Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Marc A. Straub - Dearborn Heights MI
Richard K. McMillan - Dearborn MI
Ram S. Raghava - Ann Arbor MI
Thomas B. Krautheim - Belleville MI
Michael A. Howey - Canton MI
Vivek A. Jairazbhoy - Farmington Hills MI

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

B44C 122

US Classification:

216 13, 216 17, 216 41, 174250, 29846

Abstract:

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.