David P Surdock
age ~53
from Kalispell, MT
- Also known as:
-
- Dave P Surdock
- David P Surock
- David P Sundeck
- Phone and address:
-
1468 Memory Ln, Kalispell, MT 59901
406 260-5082
David Surdock Phones & Addresses
- 1468 Memory Ln, Kalispell, MT 59901 • 406 260-5082
- 720 6Th St, Kalispell, MT 59901 • 406 257-3592
- 515 Liberty St, Kalispell, MT 59901 • 406 257-3592
- 1030 Birch St, Helena, MT 59601 • 406 442-7603
- Marion, MT
- Tempe, AZ
Work
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Company:Applied materialsJan 2010
-
Position:Process engineer
Skills
Manufacturing
Industries
Semiconductors
Us Patents
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Methods And Apparatus For Removing Abrasive Particles
view source -
US Patent:20200306931, Oct 1, 2020
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Filed:Mar 25, 2019
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Appl. No.:16/363009
-
Inventors:- Santa Clara CA, US
PENG SUO - SINGAPORE, SG
SHIH-CHAO HUNG - SINGAPORE, SG
PIN GIAN GAN - SINGAPORE, SG
CHUN YU TO - SINGAPORE, SG
PERIYA GOPALAN - SAN JOSE CA, US
KOK SEONG TEO - SINGAPORE, SG
LIT PING LAM - SINGAPORE, SG
ANDY LOO - SINGAPORE, SG
PANGYEN ONG - SINGAPORE, SG
DAVID P. SURDOCK - KALISPELL MT, US
KEITH YPMA - Kalispell MT, US
BRIAN WILLIAMS - Kalispell MT, US
SCOTT OSTERMAN - Whitefish MT, US
MARVIN L. BERNT - KALISPELL MT, US
MUHAMMAD NORHAZWAN - SINGAPORE, SG
SAMUEL GOPINATH - SINGAPORE, SG
MUHAMMAD AZIM - SINGAPORE, SG
GUAN HUEI SEE - SINGAPORE, SG
QI JIE PENG - SINGAPORE, SG
SRISKANTHARAJAH THIRUNAVUKARASU - SINGAPORE, SG
ARVIND SUNDARRAJAN - SINGAPORE, SG -
International Classification:B24B 57/00
H01L 21/02
B24B 37/34 -
Abstract:Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle mounted to the manifold and configured to spray the atomized fluid in a divergent spray pattern such that the substrate surface is cleansed when impinged by spray from the at least one spray nozzle, wherein the at least one spray nozzle sprays the atomized fluid at a pressure of approximately 30 psi to approximately 2500 psi.
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Wafer Profiling For Etching System
view source -
US Patent:20170323806, Nov 9, 2017
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Filed:May 5, 2017
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Appl. No.:15/587840
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Inventors:Jeffrey Chi Cheung - Hayward CA, US
John Ghekiere - Marion MT, US
Jerry D. Leonhard - Kalispell MT, US
David P. Surdock - Kalispell MT, US
Benjamin Shafer - Hungry Horse MT, US
Ray Young - Kalispell MT, US -
International Classification:H01L 21/67
H01L 21/67
H01L 21/67
H01L 21/66
H01L 21/67 -
Abstract:A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.
Resumes
Process Engineer
view sourceLocation:
Kalispell, MT
Industry:
Semiconductors
Work:
Applied Materials
Process Engineer
Process Engineer
Skills:
Manufacturing
Vehicle Records
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David Surdock
view source -
Address:1468 Memory Ln, Kalispell, MT 59901
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Phone:406 260-5082
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VIN:3GCPKSE75CG249453
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Make:CHEVROLET
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Model:SILVERADO 1500
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Year:2012
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David Surdock
view source -
Address:1468 Memory Ln, Kalispell, MT 59901
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VIN:4YDT2202X7H850392
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Make:BMW
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Model:X5-Series AWD 4dr 4.8i
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Year:2007
Get Report for David P Surdock from Kalispell, MT, age ~53