David D Chun

US Patent:

7145253, Dec 5, 2006

Filed:

Jun 9, 2004

Appl. No.:

10/865096

Inventors:

Tae Soo Kim - Seoul, KR
Young Hyo Eun - Seoul, KR
Jicheng Yang - Gilbert AZ, US
Jong Wook Park - Seoul, KR
David DoSung Chun - Tempe AZ, US
Hee Yeoul Yoo - Seoul, KR

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 23/29

US Classification:

257790, 257417, 257432, 257433, 257787

Abstract:

Disclosed is a semiconductor device and its manufacturing method. By way of example, the semiconductor device includes a semiconductor die for sensing an external physical quantity, an insulating gel covering the semiconductor die, and an encapsulant which covers the insulating gel while the insulating gel is partially exposed to the exterior. Also, another semiconductor device further includes a dummy plate which has a hole and is seated on the insulating gel. In the manufacturing method of a semiconductor device, a mold having a through hole is provided and the through hole include a structure consisting of a movable pin and a spring for absorbing the expansion of the insulating gel during an encapsulation process. Also, another manufacturing method of a semiconductor device includes performing the encapsulation while the dummy plate is seated on the insulating gel.

US Patent:

20080003722, Jan 3, 2008

Filed:

Apr 15, 2004

Appl. No.:

10/824999

Inventors:

David Chun - Tempe AZ, US

International Classification:

H01L 21/00

US Classification:

438123000

Abstract:

A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A molded first body section is formed on the leadframe subsequent to the electrical connection of a semiconductor die thereto such that portions of the leadframe other than for the contacts thereof are covered by the first body section. After the tie bars and dambar have been removed from the leadframe, a second body section is formed on the contacts of the leadframe such that portions of the contacts are exposed in a common exterior surface of the second body section. The second body section defines the leading edge of the memory card which has no metal of the leadframe exposed therein.