Dr. Chun graduated from the Boston University School of Medicine in 1995. He works in Torrance, CA and 1 other location and specializes in Internal Medicine. Dr. Chun is affiliated with Hoag Memorial Hospital Presbyterian, Providence Little Company Of Mary Medical Center Torrance and Torrance Memorial Medical Center.
Dr. Chun graduated from the New York Medical College in 1996. He works in Costa Mesa, CA and specializes in Family Medicine. Dr. Chun is affiliated with Orange Coast Memorial Medical Center.
Citrus Pathology Medical GrpCitrus Pathology Medical Group 210 W San Bernardino Rd FL 1, Covina, CA 91723 626 915-6252 (phone), 626 915-6269 (fax)
Education:
Medical School University of Hawaii Burns School of Medicine Graduated: 1989
Languages:
English
Description:
Dr. Chun graduated from the University of Hawaii Burns School of Medicine in 1989. He works in Covina, CA and specializes in Anatomic Pathology & Clinical Pathology. Dr. Chun is affiliated with Citrus Valley Medical Center Intercommunity Campus, Glendale Memorial Hospital & Health Center, Kindred Hospital West Covina and San Dimas Community Hospital.
Dr. Chun graduated from the University of California, San Diego School of Medicine in 1998. He works in Mission Viejo, CA and 2 other locations and specializes in Pediatric Cardiology and Pediatrics. Dr. Chun is affiliated with CHOC Childrens Hospital, Hoag Memorial Hospital Presbyterian, Long Beach Memorial Medical Center, Orange Coast Memorial Medical Center and Orange County Global
Experian Healthcare - Western Region since Aug 2012
Regional Sales Director
Government Data Services Apr 2011 - Aug 2012
National Sales Executive
CareMedic Systems now a part of Ingenix (Optum) Jun 2009 - Apr 2011
Enterprise Executive
NCO Financial Systems May 2008 - Jun 2009
Senior Sales Executive
Mirrus Systems Apr 2007 - May 2008
Director of Business Development
Education:
California State University-Long Beach - College of Business Administration 1987 - 1993
Skills:
Hospitals Healthcare Management Accounts Receivable Revenue Cycle EHR Claim Sales Process Enterprise Software Sales Operations Revenue Cycle Management Strategic Partnerships Healthcare Information Technology Analytics
Tae Soo Kim - Seoul, KR Young Hyo Eun - Seoul, KR Jicheng Yang - Gilbert AZ, US Jong Wook Park - Seoul, KR David DoSung Chun - Tempe AZ, US Hee Yeoul Yoo - Seoul, KR
Assignee:
Amkor Technology, Inc. - Chandler AZ
International Classification:
H01L 23/29
US Classification:
257790, 257417, 257432, 257433, 257787
Abstract:
Disclosed is a semiconductor device and its manufacturing method. By way of example, the semiconductor device includes a semiconductor die for sensing an external physical quantity, an insulating gel covering the semiconductor die, and an encapsulant which covers the insulating gel while the insulating gel is partially exposed to the exterior. Also, another semiconductor device further includes a dummy plate which has a hole and is seated on the insulating gel. In the manufacturing method of a semiconductor device, a mold having a through hole is provided and the through hole include a structure consisting of a movable pin and a spring for absorbing the expansion of the insulating gel during an encapsulation process. Also, another manufacturing method of a semiconductor device includes performing the encapsulation while the dummy plate is seated on the insulating gel.
Transfer Mold Solution For Molded Multi-Media Card
A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A molded first body section is formed on the leadframe subsequent to the electrical connection of a semiconductor die thereto such that portions of the leadframe other than for the contacts thereof are covered by the first body section. After the tie bars and dambar have been removed from the leadframe, a second body section is formed on the contacts of the leadframe such that portions of the contacts are exposed in a common exterior surface of the second body section. The second body section defines the leading edge of the memory card which has no metal of the leadframe exposed therein.