Daniel V Rowland

Author:

Daniel Rowland

ISBN #:

0520086384

Author:

Daniel Rowland

ISBN #:

0801441064

Author:

Daniel Rowland

ISBN #:

0801488281

US Patent:

6635501, Oct 21, 2003

Filed:

Jun 25, 1998

Appl. No.:

09/104409

Inventors:

Daniel Vincent Rowland - Morgan Hill CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

G01R 3126

US Classification:

438 14, 438 17, 438 18

Abstract:

A method for monitoring temperature in a thermal processing system includes the steps of depositing ( ) a cobalt film ( ) on a semiconductor substrate ( ) and performing thermal processing ( ) on the substrate ( ) to generate a cobalt silicide film ( ). The method further includes measuring ( ) a resistance characteristic of the cobalt silicide ( ) and determining a temperature of the thermal processing using the resistance characteristic ( ).

US Patent:

60339225, Mar 7, 2000

Filed:

Jul 28, 1999

Appl. No.:

9/362357

Inventors:

Daniel V. Rowland - Morgan Hill CA
Robert A. Huertas - Hollister CA
Norein (Narendra) Patel - San Jose CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 2166

US Classification:

438 14

Abstract:

A method for monitoring the temperature of a product wafer during thermal processing of the product wafer in an emissivity independent thermal processing system includes processing a test wafer in the emissivity independent thermal processing system that thermally processes the product wafer. The test wafer is pretreated before being thus placed in the thermal processing system. The test wafer is thermally processed following a substantially same thermal processing recipe as that used for thermal processing of the product wafers. After the thermal processing of the test wafer, a sheet resistance of the test wafer is measured. This sheet resistance is correlated to a wafer temperature at the test wafer that was achieved during the thermal processing of the test wafer. Because the product wafer and the test wafer are thermally processed within an emissivity independent thermal processing system, the test wafer temperature is correlated to a product wafer temperature at the product wafer that was achieved during the thermal processing of the product wafer. With such monitoring of the product wafer temperature during actual thermal processing of the product wafer, thermal processing may be more tightly controlled to ensure that a thermal processing recipe is accurately followed.

US Patent:

59703130, Oct 19, 1999

Filed:

Dec 19, 1997

Appl. No.:

8/994221

Inventors:

Daniel V. Rowland - Morgan Hill CA
Robert A. Huertas - Hollister CA
Norein Narendra Patel - San Jose CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

G01R 3126
H01L 2166

US Classification:

438 17

Abstract:

A method for monitoring the temperature of a product wafer during thermal processing of the product wafer in an emissivity independent thermal processing system includes processing a test wafer in the emissivity independent thermal processing system that thermally processes the product wafer. The test wafer is pretreated before being thus placed in the thermal processing system. The test wafer is thermally processed following a substantially same thermal processing recipe as that used for thermal processing of the product wafers. After the thermal processing of the test wafer, a sheet resistance of the test wafer is measured. This sheet resistance is correlated to a wafer temperature at the test wafer that was achieved during the thermal processing of the test wafer. Because the product wafer and the test wafer are thermally processed within an emissivity independent thermal processing system, the test wafer temperature is correlated to a product wafer temperature at the product wafer that was achieved during the thermal processing of the product wafer. With such monitoring of the product wafer temperature during actual thermal processing of the product wafer, thermal processing may be more tightly controlled to ensure that a thermal processing recipe is accurately followed.