A mini-modular manufacturing environmental chamber for processing and transporting semiconductor devices is disclosed. The cylindrical chamber is provided with a conveyer assembly that transports items within the chamber and divides the interior into two sections. Also included within the chamber are a power and control bus for process equipment located therein and a mounting assembly for securing the process equipment. Multiple environmental chambers can be connected by interconnect units and the chambers can be arranged in rows and columns to produce an array of manufacturing chambers useful for various semiconductor and microelectronic machine manufacture (MEMS) processing steps.