Daniel Brett Morris

US Patent:

6452406, Sep 17, 2002

Filed:

Mar 11, 1999

Appl. No.:

09/254798

Inventors:

Brian Samuel Beaman - Apex NC
Keith Edward Fogel - Mohegan Lake NY
Paul Alfred Lauro - Nanuet NY
Yun-Hsin Liao - Tempe AZ
Daniel Peter Morris - Purchase NY
Da-Yuan Shih - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3102

US Classification:

324754, 324761

Abstract:

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

US Patent:

7172431, Feb 6, 2007

Filed:

Aug 27, 2004

Appl. No.:

10/928473

Inventors:

Brian S. Beaman - Apex NC, US
George Liang-Tai Chiu - Croos River NY, US
Keith Fogel - Nanuet NY, US
Paul A. Lauro - Browster NY, US
Daniel P. Morris - Purchase NY, US
Da-Juan Shih - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 12/00

US Classification:

439 66, 439 71

Abstract:

A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which projects away from the electrical contact location and through an aperture in a sheet of material. The sheet is disposed to be spaced apart from the surface of the substrate. At the second end of the elongated electrical conductor there is a tip structure, which is larger than the aperture in the sheet of material. The tip structure has a pointed portion thereof. The tip structure is disposed against contact locations of a contact surface. The electronic structure is moved towards the contact surface permitting the tip structure to penetrate into the surface of the electrical contact location thereon and to move, wipe, or vibrate across the surface thereof as the shaped elongated electrical conductor flexes as a result of being compressed by the movement of the electronic structure toward the contact surface.

US Patent:

7368924, May 6, 2008

Filed:

Jul 23, 2002

Appl. No.:

10/202069

Inventors:

Brian Samuel Beaman - Apex NC, US
Keith Edward Fogel - Mohegan Lake NY, US
Paul Alfred Lauro - Nanuet NY, US
Yun-Hsin Liao - Tempe AZ, US
Daniel Peter Morris - Purchase NY, US
Da-Yuan Shih - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/02

US Classification:

324754, 324761

Abstract:

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

US Patent:

8486250, Jul 16, 2013

Filed:

Feb 1, 2002

Appl. No.:

10/066171

Inventors:

Brian Samuel Beaman - Apex NC, US
Keith Edward Fogel - Mohegan Lake NY, US
Paul Alfred Lauro - Nanuet NY, US
Yun-Hsin Liao - Tempe AZ, US
Daniel Peter Morris - Purchase NY, US
Da-Yuan Shih - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C25D 5/02
C25D 9/02
C25D 13/06
G01R 1/073

US Classification:

205122, 204489, 205149, 205317, 32475502

Abstract:

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

US Patent:

8491772, Jul 23, 2013

Filed:

Aug 21, 2009

Appl. No.:

12/545537

Inventors:

Brian Samuel Beaman - Apex NC, US
Keith Edward Fogel - Mohegan Lake NY, US
Paul Alfred Lauro - Nanuet NY, US
Yun-Hsin Liao - Tempe AZ, US
Daniel Peter Morris - Purchase NY, US
Da-Yuan Shih - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 5/12
C23C 18/28
C23C 18/40
C23C 28/02
C25D 7/00
G01R 1/073

US Classification:

205 85, 205122, 205149, 205164, 205167, 32475502, 427118, 427304, 427306

Abstract:

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

US Patent:

20080164896, Jul 10, 2008

Filed:

Mar 21, 2008

Appl. No.:

12/052823

Inventors:

Brian Samuel Beaman - Apex NC, US
Keith Edward Fogel - Mohegan Lake NY, US
Paul Alfred Lauro - Nanuet NY, US
Yun-Hsin Liao - Tempe AZ, US
Daniel Peter Morris - Purchase NY, US
Da-Yuan Shih - Poughkeepsie NY, US

International Classification:

G01R 1/073

US Classification:

324754

Abstract:

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Author:

Daniel C. Morris

ISBN #:

0070431981

Author:

Daniel R. Morris

ISBN #:

0820406910

Author:

Daniel Luzon Morris

ISBN #:

0132212595

Author:

Daniel Morris

ISBN #:

0070431787

Author:

Daniel Morris

ISBN #:

0070431841

Author:

Daniel Morris

ISBN #:

0070431795

Author:

Daniel Morris

ISBN #:

0805980237

Author:

Daniel Morris

ISBN #:

0826210023