Daniel J Gramarossa

US Patent:

6524463, Feb 25, 2003

Filed:

Jul 16, 2001

Appl. No.:

09/907258

Inventors:

Daniel J. Gramarossa - Moorpark CA
Gary C. Downes - Moorpark CA

Assignee:

Technic, Inc. - Cranston RI

International Classification:

C25D 500

US Classification:

205137, 205145, 4274301

Abstract:

A method of processing wafers or other articles within a processing cell, entailing transporting a carrier supporting a vertically-oriented wafer horizontally through an inlet opening of a process cell, processing the vertically-oriented wafer within the process cell, and then transporting the carrier out of the process cell horizontally through an outlet opening of the process cell. In one exemplary implementation, the process performed within the cell is a pre-or post- treatment where the wafer is subjected to an acid solution treatment and/or a rinsing with de-ionized water treatment. In another exemplary implementation, the process performed within the process cell is an electroplating of the plating surface of the wafer. Additionally, a method of processing an empty carrier entailing transporting the carrier horizontally through an inlet opening of a process cell, processing the carrier within the process cell, and transporting the carrier out of the process cell horizontally through an outlet opening.

US Patent:

6558750, May 6, 2003

Filed:

Jul 16, 2001

Appl. No.:

09/907253

Inventors:

Daniel J. Gramarossa - Moorpark CA
Gary C. Downes - Moorpark CA

Assignee:

Technic Inc. - Cranston RI

International Classification:

B05D 118

US Classification:

4274301, 427421

Abstract:

A method of processing a wafer or other articles by horizontally transporting vertically oriented wafers into one or more process cells. A carrier is rotated from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.

US Patent:

20030010449, Jan 16, 2003

Filed:

Jul 16, 2001

Appl. No.:

09/905733

Inventors:

Daniel Gramarossa - Moorpark CA, US
Gary Downes - Moorpark CA, US

International Classification:

C23C016/00
C23F001/02

US Classification:

156/345310, 118/719000

Abstract:

A wafer processing system for performing horizontal transport of vertically-oriented wafers into one or more process cells to perform vertical processing on the wafers. The wafer processing system includes a loading station for loading wafers onto respective carriers in a horizontal fashion and for rotating the carriers to orient the wafers in a vertical orientation for transport and processing, one or more process cells for processing the wafers in a vertical orientation respectively therein, and an unloading station for rotating the carriers to orient the wafers from a vertical orientation to a horizontal orientation and for unloading the wafer off the carriers in a horizontal fashion. Additionally, the wafer processing system includes a carrier transport system for transporting carriers horizontally from the loading station, to one or more process cells, then to the unloading station, and additionally to a carrier process section for processing of empty carriers.

US Patent:

20030010625, Jan 16, 2003

Filed:

Jul 16, 2001

Appl. No.:

09/906746

Inventors:

Daniel Gramarossa - Moorpark CA, US
Gary Downes - Moorpark CA, US

International Classification:

C25B009/00
C25D017/00

US Classification:

204/198000, 204/275100

Abstract:

A process cell for processing wafers and other planar articles, including a horizontally-transportable carrier for supporting a wafer in a substantially vertical orientation and an enclosure for housing the carrier and performing one or more processes to the wafer. The enclosure including a carrier inlet to allow the horizontal passage of a carrier into the process cell and a carrier outlet to allow the horizontal passage of a carrier to outside of the process cell. One embodiment of a process cell is configured to perform a pre- or post-treatment of a wafer, such as treating the wafer with acid solution and/or with de-ionized water. Another embodiment of the process cell is configured to perform electroplating of the wafer. Another process cell is configured to the process empty carriers, including the striping of undesired plating deposition on cathode contacts.

US Patent:

20030010626, Jan 16, 2003

Filed:

Jul 16, 2001

Appl. No.:

09/907332

Inventors:

Daniel Gramarossa - Moorpark CA, US
Gary Downes - Moorpark CA, US

International Classification:

C25D017/00
C25C007/00
C25B009/00
C25F007/00
B23H011/00
B23H007/26
C25D017/04
C25D017/06
C25D017/16

US Classification:

204/202000, 204/297060, 204/198000, 204/297080, 204/242000, 204/275100

Abstract:

A wafer plating system horizontally transporting vertically oriented wafers into one or more process cells. The wafer processing system includes a carrier rotatable from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.

US Patent:

20030013285, Jan 16, 2003

Filed:

Jul 16, 2001

Appl. No.:

09/907251

Inventors:

Daniel Gramarossa - Moorpark CA, US
Gary Downes - Moorpark CA, US

International Classification:

H01L021/20

US Classification:

438/584000, 438/907000

Abstract:

A wafer process methodology characterized by horizontal transport of vertically-oriented wafers into one or more process cells for performing vertical processing on the wafers. The process methodology also includes simultaneous processing of a plurality of vertically-oriented wafers at indexed positions along the horizontal transportation route. Additionally, the process methodology further includes loading of wafers onto carriers in a horizontal fashion and then rotating the carriers to orient the wafers vertically for transport and processing.

US Patent:

20060219562, Oct 5, 2006

Filed:

Apr 1, 2005

Appl. No.:

11/096366

Inventors:

Daniel Gramarossa - Las Vegas NV, US

International Classification:

C25D 5/00
C25D 17/00

US Classification:

205080000, 204198000

Abstract:

A processing system, electroplating cell, transport system, cathode contact subsystem and method of providing a cathode contact to the articles being transported within an electroplating cell. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, and an anode electrode. In one embodiment, the cathode contact system provides a cathode contact to the articles by way of the transport system's electrically-conductive, conveyor structure. In another embodiment, the cathode contact system comprises an electrically-conductive moving conveyor structure adapted to make cathode contact to said articles and move substantially in synchronous with the articles. In yet another embodiment, the transport system comprises a plurality of multi-article carriers supported by a conveyor structure, and adapted to provide a cathode contact to the articles.

US Patent:

20060219563, Oct 5, 2006

Filed:

Apr 1, 2005

Appl. No.:

11/097787

Inventors:

William Sepp - Mission Viejo CA, US
Jeffrey Ramirez - Yorba Linda CA, US
Fred Hayward - Seal Beach CA, US
Daniel Gramarossa - Las Vegas NV, US

International Classification:

C25D 5/00
C23F 13/00
C23C 28/00

US Classification:

205080000, 204196080, 205198000

Abstract:

A processing system, electroplating cell, and method of reducing the ration (i.e., demarcation line) that often forms on articles undergoing a partial plating process. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, an anode electrode, a support structure, which may be part of the transport system, to support the articles such that only a portion thereof is immersed in the plating fluid bath and an air flow system adapted to cause air flow proximate the interface of the articles to the plating fluid bath. The air flow near the articles prevents or reduces plating fluid vapors from impinging the articles, thereby reducing the discoloration that would otherwise form on the articles.