Dana L Patelzick

age ~73

from West Linn, OR

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Dana Patelzick Phones & Addresses

23096 Bland Cir, West Linn, OR 97068 • 503 657-9687 • 503 723-7054
23096 S Bland Cir #SW, West Linn, OR 97068 • 503 657-9687
4205 Imperial Dr, West Linn, OR 97068 • 503 657-9687
17270 SW Bryant Rd, Lake Oswego, OR 97035 • 503 657-9687
Oregon City, OR
9130 SW Apache Dr, Tualatin, OR 97062 • 503 657-9687
Portland, OR
23096 S Bland Cir, West Linn, OR 97068 • 503 998-4521

Work

Company:

Garmin ksa
Nov 2012
Position:

Senior mechanical engineer

Education

School / High School:

Oregon Graduate Center
Specialities:

Materials Science

Skills

Engineering • Solidworks • Electronics • Manufacturing • Mechanical Engineering • Design For Manufacturing • Semiconductors • Product Development • R&D • Engineering Management • Labview • Testing • Sensors • Metrology • Pcb Design • Finite Element Analysis • Optics • Product Design • Manufacturing Engineering • Failure Analysis • Semiconductor Industry • Lean Manufacturing • Continuous Improvement • Root Cause Analysis • Electrical Engineering • Test Equipment • Injection Molding • Embedded Systems • Thermal Analysis • Electronics Packaging • Design of Experiments • Materials • Simulations • Automation • Systems Engineering • Sheet Metal • Machining • Matlab • Tolerance Analysis • Electro Mechanical • Spc • Characterization • Design For Assembly • Six Sigma • Pro Engineer • Thermal • Fmea

Emails

d***[email protected]

Industries

Electrical/Electronic Manufacturing

Resumes

Senior Mechanical Engineer

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Location:

Portland, OR

Industry:

Electrical/Electronic Manufacturing

Work:

Garmin Ksa
Senior Mechanical Engineer
Cyberoptics Mar 2005 - Sep 2012
Mechanical Engineer
Network Elements Mar 2000 - Nov 2004
Senior Mechanical Engineer
Flir Systems Dec 1998 - Mar 2000
Senior Mech Engineer
Tektronix Aug 1984 - Dec 1998
Mechanical Engineer

Education:

Oregon Graduate Center
Uc Santa Barbara
Bachelor of Science In Mechanical Engineering, Bachelors, Mechanical Engineering

Skills:

Engineering
Solidworks
Electronics
Manufacturing
Mechanical Engineering
Design For Manufacturing
Semiconductors
Product Development
R&D
Engineering Management
Labview
Testing
Sensors
Metrology
Pcb Design
Finite Element Analysis
Optics
Product Design
Manufacturing Engineering
Failure Analysis
Semiconductor Industry
Lean Manufacturing
Continuous Improvement
Root Cause Analysis
Electrical Engineering
Test Equipment
Injection Molding
Embedded Systems
Thermal Analysis
Electronics Packaging
Design of Experiments
Materials
Simulations
Automation
Systems Engineering
Sheet Metal
Machining
Matlab
Tolerance Analysis
Electro Mechanical
Spc
Characterization
Design For Assembly
Six Sigma
Pro Engineer
Thermal
Fmea

Us Patents

Capacitive Distance Sensing In Semiconductor Processing Tools
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US Patent:

7804306, Sep 28, 2010
Filed:

Feb 20, 2007
Appl. No.:

11/708653
Inventors:

DelRae H. Gardner - Tualatin OR, US
Craig C. Ramsey - West Linn OR, US
Dana L Patelzick - West Linn OR, US
Assignee:

CyterOptics Semiconductor, Inc. - Wilsonviller OR
International Classification:

G01R 27/26
US Classification:

324662, 324686
Abstract:

A wireless sensor includes at least one capacitive plate for sensing a distance relative to an object of interest within a semiconductor-processing environment. The sensor includes an internal power source and wireless communication such that distance and/or parallelism measurements effected using the capacitive plate(s) can be provided wirelessly to an external device.

Method And Apparatus For Maintaining Alignment Of A Laser Diode With An Optical Fiber
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US Patent:

RE41840, Oct 19, 2010
Filed:

Jan 12, 2006
Appl. No.:

11/332804
Inventors:

Ernest Charles Gilman - Beaverton OR, US
Dana L. Patelzick - West Linn OR, US
Edward L. Hershberg - Portland OR, US
Richard A. Booman - Lake Oswego OR, US
International Classification:

G02B 6/36
US Classification:

385 90, 385 88, 385 89, 385 91, 385 92, 385 93, 385 94, 385147, 372 36, 372 4501
Abstract:

A method and apparatus for maintaining an alignment of a laser diode with an optical fiber is disclosed. A mounting plate is made of a first material, and mounted on the mounting plate is a first substrate made of a second material. A semiconductor laser, with a light emitting side, is mounted on the first substrate. Separated from the first substrate by a predetermined distance is a second substrate made of a third material, and mounted on the second substrate is an optical fiber. The optical fiber is mounted, such that, the optical fiber is adjacent to and aligned with the light emitting side of the semiconductor laser. The first, second, and third materials making up the mounting plate, the first substrate, and the second substrate respectively, facilitate maintenance of the alignment between the optical fiber and the light emitting side of the semiconductor laser.

System For Maintaining A Printed Circuit Board In An Enclosure
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US Patent:

7891981, Feb 22, 2011
Filed:

Jul 2, 2007
Appl. No.:

11/824706
Inventors:

Dana L. Patelzick - West Linn OR, US
Assignee:

CyberOptics Semiconductor, Inc. - Beaverton OR
International Classification:

H01R 12/00
US Classification:

439 66, 361742, 174138 G
Abstract:

A system for maintaining a printed circuit board in an enclosure includes at least one interposer. The circuit board and housing are coupled to one or more interposers. The interposer(s) fixedly couples to both the circuit board and the enclosure, and allows the circuit board and enclosure to maintain alignment during thermal heat expansion along a desired axis, such as between the center of the board and housing.

Method And Apparatus For Maintaining Alignment Of A Laser Diode With An Optical Fiber
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US Patent:

6679636, Jan 20, 2004
Filed:

Jun 29, 2001
Appl. No.:

09/896128
Inventors:

Ernest Charles Gilman - Portland OR
Dana L. Patelzick - West Linn OR
Richard A. Booman - Lake Oswego OR
Edward L. Hershberg - Portland OR
Assignee:

Network Elements, Inc. - Beaverton OR
International Classification:

G02B 636
US Classification:

385 90, 385 88, 385 89, 385 91, 385 92, 385 93, 385 94, 385147, 372 36, 372 45
Abstract:

A method and apparatus for maintaining an alignment of a laser diode with an optical fiber is disclosed. A mounting plate is made of a first material, and mounted on the mounting plate is a first substrate made of a second material. A semiconductor laser, with a light emitting side, is mounted on the first substrate. Separated from the first substrate by a predetermined distance is a second substrate made of a third material, and mounted on the second substrate is an optical fiber. The optical fiber is mounted, such that, the optical fiber is adjacent to and aligned with the light emitting side of the semiconductor laser. The first, second, and third materials making up the mounting plate, the first substrate, and the second substrate respectively, facilitate maintenance of the alignment between the optical fiber and the light emitting side of the semiconductor laser.