Cynthia M Berry

US Patent:

7030719, Apr 18, 2006

Filed:

Jan 16, 2004

Appl. No.:

10/758095

Inventors:

Michael A. Hageman - Millersville MD, US
Cynthia W. Berry - Pasadena MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01P 1/20

US Classification:

333202, 333209

Abstract:

A method of tuning the frequency response of filters embedded in or formed on a ceramic substrate, such as but not limited to a low temperature co-fired ceramic substrate (LTCC), by re-firing a previously fired LTCC substrate to a temperature which is greater by a predetermined, relatively small, amount than that of the temperature produced during the original firing profile of the substrate so as to change the dielectric constant of the substrate, and thus cause a desired shift in the filter's frequency response.

US Patent:

7127809, Oct 31, 2006

Filed:

Mar 18, 2004

Appl. No.:

10/802746

Inventors:

Cynthia W. Berry - Pasadena MD, US
Alex E. Bailey - Hampstead MD, US
Robert Fisher - Westminster MD, US
Tapan K. Gupta - Ellicott City MD, US
Daniel Brosey - Finksburg MD, US
Steve M. Smalley - Columbia MD, US
William A. Thomas - Randallstown MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H05K 3/30

US Classification:

29832, 29840, 29851, 156 8912, 174259, 361830

Abstract:

An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

US Patent:

7240424, Jul 10, 2007

Filed:

Aug 23, 2004

Appl. No.:

10/922850

Inventors:

Cynthia W. Berry - Pasadena MD, US
Alex E. Bailey - Hampstead MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H05K 3/36
B32B 37/02

US Classification:

29830, 156182, 156256, 156312

Abstract:

A method of forming an LTCC structure having at least one open cavity on each of first and second opposing sides is disclosed that includes the steps of forming a first LTCC structure including a first side having a plurality of cavities and a second side, subjecting the first LTCC structure to a first pressure, forming a second LTCC structure including a first side having a plurality of cavities and a second side, subjecting the second LTCC structure to a second pressure, arranging the first LTCC structure and the second LTCC structure such that the first LTCC structure second side faces the second LTCC structure second side, and subjecting the placed-together first and second LTCC structures to a third pressure to join the first LTCC structure to the second LTCC structure. A product formed by the subject method is also disclosed.

US Patent:

7244331, Jul 17, 2007

Filed:

Oct 7, 2004

Appl. No.:

10/959121

Inventors:

Cynthia W. Berry - Pasadena MD, US
Alex E. Bailey - Hampstead MD, US
Tapan K. Gupta - Ellicott City MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

B32B 37/10
B32B 38/00

US Classification:

156289, 156 8911, 156 8912

Abstract:

A method of producing an LTCC substrate having improved cavity bondability is disclosed that involves providing a stack of green ceramic tape sheets having a cavity, placing a template having an opening corresponding to the cavity over the stack, placing a stretchable sheet of material coated with graphite or zinc stearate over the template, isostatically laminating the stack to produce an LTCC substrate having a cavity, and removing the template and sheet of stretchable material from the stack.

US Patent:

7632451, Dec 15, 2009

Filed:

Oct 8, 2004

Appl. No.:

10/960108

Inventors:

Marissa A. O'Donnell - Columbia MD, US
Cynthia W. Berry - Pasadena MD, US
Rena Y. Jacobson - Ellicott City MD, US
Wayne A. Smythe - Pasadena MD, US
Glenn A. Cooke - Clarksville MD, US
Shane H. Dennison - Frederick MD, US
Robert H. Fisher - Westminster MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

C04B 33/34

US Classification:

264619, 101129

Abstract:

The print head and screen assembly of a Semi-Automatic Screen Printer is raised above its normal printing height and selective attachment of several different fixtures on the nest plate for holding the substrate in a desired position during a screen printing operation for printing gold on LTCC substrates.

US Patent:

7728771, Jun 1, 2010

Filed:

Jul 3, 2007

Appl. No.:

11/773105

Inventors:

Michael J. Lee - Ellicott City MD, US
Eric V. Miller - Phoenix MD, US
Joseph A. Faulkner - Ellicott City MD, US
Cynthia W. Berry - Pasadena MD, US
Gene A. Digennaro - Dundalk MD, US
Kerron R. Duncan - Randallstown MD, US
Ronald G. Freitag - Catonsville MD, US
Tapan K. Gupta - Ellicott City MD, US
Vincent G. Karasack - Ellicott City MD, US
Dave M. Krafcsik - Crownsville MD, US
Brian T. McMonagle - Ellicott City MD, US
Robert B. Middleton - Laurel MD, US
Benjamin R. Myers - Columbia MD, US
Mike L. Salib - Millersville MD, US
John P. Vitamvas - Columbia MD, US
Thomas M. Walsh - Bowie MD, US
Eric D. Zirofsky - Washington DC, US
John W. Gipprich - Millersville MD, US

Assignee:

Northrop Grumman Systems Corporation - Los Angeles CA

International Classification:

H01Q 3/36

US Classification:

342368

Abstract:

A multi-channel, dual-band, radio frequency (RF) transmit/receive (T/R) module, for an active electronically scanned array, is provided. The module includes a compact, RF manifold connector and at least four T/R channels. Each of the T/R channels includes a notch radiator, a diplexer coupled to the notch radiator, a power amplifier, including at least one dual-band gain stage, coupled to the notch radiator, a low noise amplifier, including at least one lower-band gain stage and at least one upper-band gain stage, coupled to the diplexer, and a T/R cell, including a phase shifter, a signal attenuator and at least one dual-band gain stage, coupled to the power amplifier, the low noise amplifier and the manifold connector.

US Patent:

7820490, Oct 26, 2010

Filed:

Jun 12, 2006

Appl. No.:

11/450417

Inventors:

Cynthia W. Berry - Pasadena MD, US
Alex E. Bailey - Hampstead MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01L 29/74

US Classification:

438125, 257E2316

Abstract:

An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.

US Patent:

20050189630, Sep 1, 2005

Filed:

Feb 26, 2004

Appl. No.:

10/786125

Inventors:

Cynthia Berry - Pasadena MD, US
Alex Bailey - Hampstead MD, US

International Classification:

H01L023/02

US Classification:

257678000

Abstract:

An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.