Owens & Minor - Greater San Diego Area since Dec 2012
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FTI Consulting Jan 2008 - Dec 2012
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Northwestern Memorial Hospital 2003 - 2005
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Product Definition Management Technician at Vestas
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Brighton, Colorado
Industry:
Renewables & Environment
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Vestas since Jan 2010
Product Definition Management Technician
Advanced Energy Inc Feb 2004 - Jun 2009
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XILINX Inc Aug 2002 - Feb 2004
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Exabyte Corporation Jan 1995 - Jan 2002
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StorageTek Corporation Jan 1989 - Jan 1995
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During a calculation technique, contributions to reflected light from multiple discrete cells in a model of a multilayer stack in a reflective photo-mask may be determined based on angles of incidence of light in a light pattern to the multilayer stack, a polarization of the light in the light pattern, and a varying intensity of the light in the light pattern through the multilayer stack. Then, phase values of the contributions to the reflected light from the multiple discrete cells are adjusted, thereby specifying optical path differences between the multiple discrete cells in the multilayer stack that are associated with the defect. Moreover, the contributions to the reflected light from multiple discrete cells are combined to determine the reflected light from the multilayer stack. Next, k-space representations of the contributions to the reflected light from the multiple discrete cells are selectively shifted based on the angles of incidence.
Methods For Optical Proximity Correction In The Design And Fabrication Of Integrated Circuits
- Grand Cayman, KY Christopher Heinz Clifford - San Francisco CA, US Tamer Coskun - San Jose CA, US
Assignee:
GLOBALFOUNDRIES, INC. - Grand Cayman
International Classification:
G06F 17/50 H01L 21/02
US Classification:
438758, 716 53
Abstract:
A method of manufacturing an optical lithography mask includes providing a patterned layout design comprising a plurality of polygons, correcting the patterned layout design using optical proximity correction (OPC) by adjusting widths and lengths of one or more of the plurality of polygons, to generate a corrected patterned layout design, converting the corrected patterned layout design into a mask writer-compatible format, to generate a mask writer-compatible layout design comprising the plurality of polygons, and biasing each polygon in the plurality of polygons with a bias that accounts for large-scale density values of the patterned layout design, to generate a biased, mask writer-compatible layout design.