Christoph B Luechinger

US Patent:

7443018, Oct 28, 2008

Filed:

Nov 9, 2005

Appl. No.:

11/164087

Inventors:

You Yang Ong - Singapore, SG
Kwang Yong Chung - Selongor, MY
Mohd Helmy Bin Ahmad - Johor Bahru, MY
Garrett L. Wong - Orange CA, US
Christoph B. Luechinger - Irvine CA, US

Assignee:

Stats Chippac Ltd. - Singapore
Orthodyne Electronics Corporation - Irvine CA

International Classification:

H01L 23/04
H01L 23/48
H01L 23/52
H01L 29/40

US Classification:

257692, 257688, 257698, 257784, 257786

Abstract:

An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.

US Patent:

7745253, Jun 29, 2010

Filed:

Feb 15, 2007

Appl. No.:

11/675534

Inventors:

Christoph B. Luechinger - Irvine CA, US

Assignee:

Orthodyne Electronics Corporation - Irvine CA

International Classification:

H01L 21/44

US Classification:

438106, 438612, 257E21499

Abstract:

A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

US Patent:

7838101, Nov 23, 2010

Filed:

Aug 5, 2009

Appl. No.:

12/535928

Inventors:

Mark Arnold Delsman - Irvine CA, US
Christoph Benno Luechinger - Irvine CA, US

Assignee:

Orthodyne Electronics, Inc. - Irvine CA

International Classification:

B32B 3/00
H01L 23/48

US Classification:

428172, 428212, 428213, 257784, 228 45

Abstract:

An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

US Patent:

7909228, Mar 22, 2011

Filed:

Apr 15, 2008

Appl. No.:

12/103226

Inventors:

Mark Arnold Delsman - Irvine CA, US
Christoph Benno Luechinger - Irvine CA, US

Assignee:

Orthodyne Electronics Corporation - Irvine CA

International Classification:

B23K 20/10

US Classification:

2281101, 2281805, 228 45

Abstract:

An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

US Patent:

7934633, May 3, 2011

Filed:

Apr 15, 2008

Appl. No.:

12/103284

Inventors:

Mark Arnold Delsman - Irvine CA, US
Christoph Benno Luechinger - Irvine CA, US

Assignee:

Orthodyne Electronics Corporation - Irvine CA

International Classification:

B23K 20/10
B29C 65/08

US Classification:

2281101, 228 45, 2281805, 156 731

Abstract:

An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

US Patent:

8196798, Jun 12, 2012

Filed:

Oct 10, 2011

Appl. No.:

13/269796

Inventors:

Christoph Benno Luechinger - Irvine CA, US
Orlando Luis Valentin - Rancho Santa Margarita CA, US

Assignee:

Kulicke and Soffa Industries, Inc. - Fort Washington PA

International Classification:

B23K 1/06
B23K 37/04

US Classification:

228 11, 228 45, 228 62, 228 491, 228 492, 228 495

Abstract:

An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.

US Patent:

8231044, Jul 31, 2012

Filed:

Oct 3, 2011

Appl. No.:

13/251741

Inventors:

Christoph Benno Luechinger - Irvine CA, US
Orlando Luis Valentin - Rancho Santa Margarita CA, US

Assignee:

Orthodyne Electronics Corporation - Irvine CA

International Classification:

B23K 37/04

US Classification:

228 45, 228 62, 228 495

Abstract:

An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.

US Patent:

8251274, Aug 28, 2012

Filed:

Apr 19, 2012

Appl. No.:

13/450637

Inventors:

Christoph Benno Luechinger - Irvine CA, US
Orlando Luis Valentin - Rancho Santa Margarita CA, US

Assignee:

Orthodyne Electronics Corporation - Irvine CA

International Classification:

B23K 1/06

US Classification:

2281101, 2281805

Abstract:

An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.