Christopher Paul Steffani

US Patent:

7846317, Dec 7, 2010

Filed:

Feb 24, 2003

Appl. No.:

10/373350

Inventors:

Michael P. Meltzer - Oakland CA, US
Christopher P. Steffani - Livermore CA, US
Ray A. Gonfiotti - Livermore CA, US

Assignee:

Lawrence Livermore National Security, LLC - Livermore CA

International Classification:

C25D 5/10
B32B 3/00

US Classification:

205170, 205176, 205177, 205178, 205180, 205181, 205182, 205239, 205255, 428209, 174250, 174257

Abstract:

A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

US Patent:

20010050179, Dec 13, 2001

Filed:

Mar 16, 2001

Appl. No.:

09/810877

Inventors:

Michael Meltzer - Oakland CA, US
Christopher Steffani - Livermore CA, US
Ray Gonfiotti - Livermore CA, US

Assignee:

The Regents of the University of California

International Classification:

H05K003/00
C25D005/02
H05K001/00

US Classification:

174/250000, 205/125000, 205/271000, 205/291000

Abstract:

A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.