Carlos A Mejia

US Patent:

6916183, Jul 12, 2005

Filed:

Mar 4, 2003

Appl. No.:

10/379844

Inventors:

William O. Alger - Portland OR, US
Gary B. Long - Aloha OR, US
Gary A. Brist - Yamhill OR, US
Carlos Mejia - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R012/00

US Classification:

439 69

Abstract:

An apparatus for receiving a microchip and having a conductor buses therein. A top surface of the apparatus receives the microchip while the bottom surface is to mount to a circuit board. A plurality of pin receptacles pass through the top surface to receive a corresponding plurality of microchip pins of the microchip. The conductor bus resides at least in part between the top surface and the bottom surface and is electrically coupled to a first plurality of the plurality of the pin receptacles.

US Patent:

6992899, Jan 31, 2006

Filed:

Mar 21, 2003

Appl. No.:

10/394841

Inventors:

William Alger - Portland OR, US
Gary Long - Aloha OR, US
Gary Brist - Yamhill OR, US
Carlos Mejia - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/06

US Classification:

361767, 361768, 361783, 174260, 174261, 174262, 257691

Abstract:

An apparatus and system, as well as fabrication methods therefor, may include a conductor attached to a carrier to bridge a contact field defined by a circuit that can be mounted to a circuit board.

US Patent:

7043706, May 9, 2006

Filed:

Mar 11, 2003

Appl. No.:

10/387291

Inventors:

Gary A. Brist - Yamhill OR, US
Gary B. Long - Aloha OR, US
William O. Alger - Portland OR, US
Carlos Mejia - Portland OR, US
Bryce Horine - Beaverton OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 17/50

US Classification:

716 6, 716 15

Abstract:

A method and apparatus for reducing timing skew between conductor traces. A dielectric medium made of a resin reinforced with a fabric is provided. The fabric includes a first plurality of yarns running parallel to a first axis and a second plurality of yarns running parallel to a second axis. The first plurality of yarns are separated by a first weave pitch and the second plurality of yarns separated by a second weave pitch. At least two conductor traces are formed on the dielectric medium. The conductor traces are positioned on the dielectric medium such that the conductor traces each have substantially similar effective dielectric constants.

US Patent:

7343576, Mar 11, 2008

Filed:

Dec 14, 2005

Appl. No.:

11/304267

Inventors:

Gary A. Brist - Yamhill OR, US
Gary B. Long - Aloha OR, US
William O. Alger - Portland OR, US
Carlos Mejia - Portland OR, US
Bryce Horine - Beaverton OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 17/50

US Classification:

716 5, 716 6

Abstract:

A method and apparatus for reducing timing skew between conductor traces. A dielectric medium made of a resin reinforced with a fabric is provided. The fabric includes a first plurality of yarns running parallel to a first axis and a second plurality of yarns running parallel to a second axis. The first plurality of yarns are separated by a first weave pitch and the second plurality of yarns separated by a second weave pitch. At least two conductor traces are formed on the dielectric medium. The conductor traces are positioned on the dielectric medium such that the conductor traces each have substantially similar effective dielectric constants.

US Patent:

20030059151, Mar 27, 2003

Filed:

Sep 27, 2001

Appl. No.:

09/963637

Inventors:

Gary Brist - Yamhill OR, US
Carlos Mejia - Portland OR, US
William Alger - Portland OR, US
Gary Long - Aloha OR, US

International Classification:

G02B006/12
C03C017/06

US Classification:

385/014000, 427/123000, 427/163200

Abstract:

A method is provided for forming a waveguide in a printed circuit board. This may include forming a trench in a printed circuit board substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.