Carl A Auer

US Patent:

6367635, Apr 9, 2002

Filed:

Sep 30, 1999

Appl. No.:

09/409941

Inventors:

Carl Auer - Fountain Hills AZ

Assignee:

Auer Precision Company, Inc. - Mesa AZ

International Classification:

A47G 1908

US Classification:

211 4118, 438401, 269296

Abstract:

An ultra precision stamped process carrier frame for use in the manufacture of microelectronic devices comprises a frame into which a plurality of precision-stamped apertures are made. Each of the coupon carrying apertures in the frame has a serrated side wall comprising a plurality of fingers extending into the aperture. The ends of the fingers are precision punched to define the aperture that registers the semiconductor coupon simultaneously with the punching of the reference fiducials. Since only the ends of the fingers are punched in the final process operation, the coupon-registering apertures can be held to a tighter tolerance relative to the fidicuals and relative to each other than is possible when the entire side wall of the aperture is punched.

US Patent:

6400569, Jun 4, 2002

Filed:

Jul 18, 1997

Appl. No.:

08/896861

Inventors:

Carl Auer - Mesa AZ

Assignee:

Composidie, Inc. - Apollo PA

International Classification:

H05K 720

US Classification:

361704, 361707, 361719, 361723, 361762, 257666, 257678, 257713, 174 163, 29827

Abstract:

A lead frame apparatus that includes: an arrangement for dissipating heat generated at the lead frame, wherein the heat dissipating arrangement is uninterruptedly connected to the lead frame. Also contemplated herein are a lead frame heat dissipating apparatus having at least one element for dissipating heat generated at a lead frame and having an arrangement for directly and uninterruptedly connecting with a lead frame, as well as lead frame apparatus comprising an arrangement for directly and uninterruptedly accommodating at least one external element for dissipating heat generated at the lead frame. A method of making a lead frame apparatus involves the provision of a lead frame, the provision of an arrangement for dissipating heat generated at the lead frame, and the uninterrupted connection of the heat dissipating arrangement to the lead frame. A lead frame apparatus is also contemplated in which an arrangement for mechanically connecting a lead frame with a heat dissipating arrangement consists essentially of constituent portions of the lead frame and the heat dissipating apparatus.

US Patent:

20020092660, Jul 18, 2002

Filed:

Sep 25, 2001

Appl. No.:

09/963825

Inventors:

Carl Auer - Fountain Hills AZ, US

Assignee:

Auer Precision Company, Inc.

International Classification:

H05K007/20
H01L023/26

US Classification:

174/016300

Abstract:

Heat sink suitable for use, for example, as semiconductor heat sinks are formed from a unitary precision stamping consisting of at least one rail to which are attached a plurality of heat sink elements. Each of the heat sink elements is attached to the rail by a bridge region of reduced thickness. The heat sinks, supported by the rail member, may be subjected to the anodizing treatment or other surface coating treatment while still attached to the rail. The thickness of the area of reduced thickness is chosen to correspond to the design thickness of the anodized coating. Since the anodized coating penetrates the surface of the part being anodized, by selecting the appropriate thickness for the region of the reduced thickness, the anodized coating can be made to fully penetrate the bridge region such that when the heat sink is separated from the rail member, the anodic film completely covers the heat sink, without the presence of bare spots typical of prior art rack-anodized heat sinks.

US Patent:

6338196, Jan 15, 2002

Filed:

Dec 15, 1999

Appl. No.:

09/464224

Inventors:

Carl Auer - Fountain Hills AZ

Assignee:

Auer Precision Company, Inc - Mesa AZ

International Classification:

B23P 1526

US Classification:

2989003, 29557

Abstract:

Heat sinks suitable for use, for example, as semiconductor heat sinks are formed from a unitary precision stamping consisting of at least one rail to which are attached a plurality of heat sink elements. Each of the heat sink elements is attached to the rail by a bridge region of reduced thickness. The heat sinks, supported by the rail member, may be subjected to the anodizing treatment or other surface coating treatment while still attached to the rail. The thickness of the area of reduced thickness is chosen to correspond to the design thickness of the anodized coating. Since the anodized coating penetrates the surface of the part being anodized, by selecting the appropriate thickness for the region of reduced thickness, the anodized coating can be made to fully penetrate the bridge region such that when the heat sink is separated from the rail member, the anodic film completely covers the heat sink, without the presence of bare spots typical of prior art rack-anodized heat sinks.