Bruce C Bosley

US Patent:

46808930, Jul 21, 1987

Filed:

Sep 23, 1985

Appl. No.:

6/779339

Inventors:

Paul W. Cronkhite - Scottsdale AZ
Bruce C. Bosley - Mesa AZ
James H. Jones - Phoenix AZ
Asit G. Patel - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B24B 704

US Classification:

51 5R

Abstract:

An apparatus for polishing semiconductor material is described in which a movable polishing arm is mounted to a cabinet. Connected to the polishing arm is a workpiece holder or sometimes referred to as a wafer chuck. Adjacent to the polishing arm is a load station which positions the wafer for pick-up by the polishing arm and attached wafer chuck. Mounted to the cabinet, next to a brush station, is a primary polish station which is used to remove the majority of the material. Alongside of the primary polish station is a final polish station used to provide a finished surface to the wafer. The polishing arm discharges the polished wafer into an unload station which is located next to the final polish station.

US Patent:

46532315, Mar 31, 1987

Filed:

Nov 1, 1985

Appl. No.:

6/793818

Inventors:

Paul W. Cronkhite - Scottsdale AZ
Bruce C. Bosley - Mesa AZ
James H. Jones - Phoenix AZ
Asit G. Patel - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B24B 700

US Classification:

51 5R

Abstract:

An automatic polishing system for polishing semiconductor material is described. A robot and Bernoulli pickup are used to retrieve polished wafers from an underwater unload station which is located on a wafer polisher. The polished wafer is then deposited into a cassette which is located underwater.