Brent F Teasley

US Patent:

6514423, Feb 4, 2003

Filed:

Feb 22, 2000

Appl. No.:

09/507811

Inventors:

Brent Teasley - Silex MO

Assignee:

MEMC Electronic Materials, Inc. - St. Peters MO

International Classification:

B29B 2902

US Classification:

216 38, 216 53, 216 89, 216 99

Abstract:

A method for processing a semiconductor wafer to reduce surface roughness. The wafer has two flat, opposite faces with a peripheral edge extending around a circumference of the wafer between the faces. The method includes, in the following order, the steps of burnishing the edge, and etching the edge. The step of burnishing is defined by a relative rubbing motion between the edge and an abrasive appliance to remove damage from the edge, the rubbing motion occurring free from any polishing solution or chemical slurry. The step of etching includes exposing the wafer to a liquid chemical etchant for a period of time to remove additional damage from the edge. The method may also include, before the other steps, a step of lapping at least one face of the wafer to remove semiconductor matter through a relative rubbing motion between the face and an abrasive lapping plate in the presence of an abrasive liquid slurry.

US Patent:

6613591, Sep 2, 2003

Filed:

Mar 7, 2002

Appl. No.:

10/092479

Inventors:

Milind S. Bhagavat - St. Louis MO
Yun-Biao Xin - Glastonbury CT
Gary L. Anderson - St. Ann MO
Brent F. Teasley - Silex MO

Assignee:

MEMC Electronic Materials, Inc. - St. Peters MO

International Classification:

H01L 2100

US Classification:

438 14, 438 68, 438113, 438460

Abstract:

A method for estimating the likely waviness of a wafer after polishing based upon an accurate measurement of the waviness of the wafer in an as-cut condition, before polishing. The method measures the thickness profile of an upper and lower wafer surface to construct a median profile of the wafer in the direction of wiresaw cutting. The median surface is then passed through an appropriate Gaussian filter, such that the warp of the resulting profile estimates whether the wafer will exhibit unacceptable waviness in a post-polished stage.

US Patent:

6398631, Jun 4, 2002

Filed:

Feb 2, 2001

Appl. No.:

09/681160

Inventors:

Gary L. Anderson - St. Ann MO
Judy Schmidt - St. John MO
Brent Teasley - Silex MO
Dennis Buese - OFallon MO
James Callahan - Bethalto IL
Randy Gene Loeschen - OFallon IL

Assignee:

MEMC Electronic Materials, Inc. - St. Peters MO

International Classification:

B24B 4702

US Classification:

451339, 451388, 451398, 438692

Abstract:

A system for facilitating transfer of a semiconductor wafer into or out of a wafer carrier of a polishing or lapping machine without contacting a face of the wafer. The system includes a wafer transport suitable for placement above the carrier, the transport having at least one open cavity with a size and shape suitable for registering alignment with an opening of the carrier. The cavity and opening together form a compartment adapted to receive and hold the wafer. A liquid delivery conduit having an outlet located above an abrading member of the machine is arranged to deliver a liquid to a position generally beneath the transport. A method for transferring the wafer to or from the machine includes delivering liquid beneath the wafer. The wafer thereby moves between a first position resting on the abrading member and a second position spaced above the abrading member where a tool may engage the edge of the wafer for holding the wafer without contacting the face of the wafer.

Address:

274 Wilson Rd, Silex, MO 63377

VIN:

1FTFW1EV9AKB99039

Make:

FORD

Model:

F-150

Year:

2010