Bong Hwan Cho from 16979 NW Oak Creek Dr, Beaverton, OR 97006, age 57

Bong Cho Phones & Addresses

Name / Title

Company / Classification

Phones & Addresses

Bong Cho
Principal

Federal Way Central Presb
Business Services at Non-Commercial Site

37512 27 Pl S, Auburn, WA 98003

Bong Cho
Religious Leader

Federal Way Presbyterian Chr
Religious Organization

37505 28 Ave S, Federal Way, WA 98003
253 835-0830

Bong Cho
Pastor

Federal Way Central Presbyterian Church
Religious Organization

37505 28 Ave S, Auburn, WA 98003

Laser Systems And Methods Using Triangular-Shaped Tailored Laser Pulses For Selected Target Classes
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US Patent:

8476552, Jul 2, 2013
Filed:

Apr 2, 2010
Appl. No.:

12/753659
Inventors:

Bong H. Cho - Beaverton OR, US
Brian L. Pugh - Beaverton OR, US
Andrew Hooper - Beaverton OR, US
Assignee:

Electro Scientific Industries, Inc. - Portland OR
International Classification:

B23K 26/00
US Classification:

21912167, 21912172
Abstract:

Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. At least one of the predefined temporal pulse profiles may be triangular. The target class may include, for example unpassivated electrically conductive links or other bare metal structures. Based on the target class associated with the selected target, a laser pulse is generated having a triangular temporal pulse profile. The generated laser pulse is used to process the selected structure.

Method And Apparatus For Improved Wafer Singulation
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US Patent:

20110287607, Nov 24, 2011
Filed:

Mar 30, 2011
Appl. No.:

13/076238
Inventors:

Yasu Osako - Lake Oswego OR, US
Bong Cho - Beaverton OR, US
Daragh Finn - Beaverton OR, US
Andrew Hooper - Portland OR, US
James O'Brien - Bend OR, US
Assignee:

ELECTRO SCIENTIFIC INDUSTRIES, INC. - Portland OR
International Classification:

H01L 21/78
B23K 26/00
US Classification:

438462, 21912172, 257E21599
Abstract:

Laser singulation of electronic devices from semiconductor substrates including wafers is performed using up to 3 lasers from 2 wavelength ranges. Using up to 3 lasers from 2 wavelength ranges permits laser singulation of wafers held by die attach film while avoiding problems caused by single-wavelength dicing. In particular, using up to 3 lasers from 2 wavelength ranges permits efficient dicing of semiconductor wafers while avoiding debris and thermal problems associated with laser processing die attach tape.