Binh T Tran

US Patent:

7768959, Aug 3, 2010

Filed:

Apr 21, 2004

Appl. No.:

10/829131

Inventors:

James Chieh-Tsung Chen - Santa Clara CA, US
Chuong Vu - San Jose CA, US
Chor-Teck Law - Milpitas CA, US
Binh Quoc Tran - San Jose CA, US
Jiaqi Shen - Union City CA, US
Brian Bosso - San Jose CA, US

Assignee:

Marvell International Ltd. - Hamilton

International Classification:

H04Q 7/24

US Classification:

370328, 370310, 370338, 718 1

Abstract:

A method, apparatus, and computer-readable media for a wireless network device for communicating with a network comprises a memory to store an image comprising a plurality of virtual machines and only one multi-tasking operating system, wherein each of the virtual machines comprises a wireless network application to execute on the multi-tasking operating system; a processor to execute the virtual machines; and a port comprising a physical-layer device to communicate with the network, and a media access controller to communicate with the physical-layer device and the processor.

US Patent:

8018892, Sep 13, 2011

Filed:

Jul 28, 2010

Appl. No.:

12/845315

Inventors:

James Chieh-Tsung Chen - Santa Clara CA, US
Chuong Vu - San Jose CA, US
Chor-Teck Law - Milpitas CA, US
Binh Quoc Tran - San Jose CA, US
Jiaqi Shen - Union City CA, US
Brian Bosso - San Jose CA, US

Assignee:

Marvell International Ltd. - Hamilton

International Classification:

H04W 4/00

US Classification:

370328, 370310, 370338, 718 1

Abstract:

A method, apparatus, and computer-readable media for a wireless network device for communicating with a network comprises a memory to store an image comprising a plurality of virtual machines and only one multi-tasking operating system, wherein each of the virtual machines comprises a wireless network application to execute on the multi-tasking operating system; a processor to execute the virtual machines; and a port comprising a physical-layer device to communicate with the network, and a media access controller to communicate with the physical-layer device and the processor.

US Patent:

8582507, Nov 12, 2013

Filed:

Sep 12, 2011

Appl. No.:

13/230595

Inventors:

James Chieh-Tsung Chen - Santa Clara CA, US
Chuong Vu - San Jose CA, US
Chor-Teck Law - San Jose CA, US
Binh Quoc Tran - San Jose CA, US
Jiaqi Shen - Union City CA, US
Brian Bosso - Santa Clara CA, US

Assignee:

Marvell International Ltd. - Hamilton

International Classification:

H04W 4/00

US Classification:

370328, 370310, 370338, 718 1

Abstract:

A system to wirelessly communicate with a wireless network. The system includes a memory and a processor. The memory is configured to store a first queue, a second queue, and a processor queue. The processor is configured to: selectively execute a first virtual machine using the processor queue; while executing the first virtual machine, maintain the first queue as a copy of data in the processor queue; selectively execute a second virtual machine using the processor queue; and while executing the second virtual machine, maintain the second queue as a copy of data in the processor queue.

US Patent:

20020137312, Sep 26, 2002

Filed:

Mar 2, 2001

Appl. No.:

09/798424

Inventors:

Lee Luo - Fremont CA, US
Henry Ho - San Jose CA, US
Shulin Wang - Campbell CA, US
Binh Tran - San Jose CA, US
Alexander Tam - Union City CA, US
Errol Sanchez - Dublin CA, US
Xianzhi Tao - Palo Alto CA, US
Steven Chen - San Jose CA, US

Assignee:

Applied Materials, Inc.

International Classification:

H01L021/20
H01L021/36
C30B001/00

US Classification:

438/492000, 438/935000

Abstract:

Provided herein is an emissivity-change-free pumping plate kit used in a single wafer chamber. This kit comprises a top open pumping plate, and optionally a skirt and/or a second stage choking plate. The skirt may be installed around the wafer heater, underneath the wafer heater, or along the chamber body inside the chamber. The choking plate is installed downstream of the top open pumping plate along the purge gas flow. Also provided is a method of preventing emissivity change and further providing optimal film thickness uniformity during wafer processing by utilizing such kit in the chamber.

US Patent:

20050109276, May 26, 2005

Filed:

Aug 4, 2004

Appl. No.:

10/911208

Inventors:

R. Iyer - Santa Clara CA, US
Sean Seutter - San Jose CA, US
Jacob Smith - Santa Clara CA, US
Gregory Dibello - Mahopac NY, US
Alexander Tam - Union City CA, US
Binh Tran - San Jose CA, US
Sanjeev Tandon - Sunnyvale CA, US

International Classification:

C23C016/00

US Classification:

118715000, 427248100

Abstract:

A method and apparatus for a CVD chamber that provides uniform heat distribution, efficient precursor delivery, uniform distribution of process and inert chemicals, and thermal management of residues in the chamber and exhaust surfaces by changing the mechanical design of a single wafer thermal CVD chamber. The improvements include a processing chamber comprising a chamber body and a chamber lid defining a processing region, a substrate support disposed in the processing region, a gas delivery system mounted on the chamber lid, the gas delivery system comprising a lid, an adapter ring and two blocker plates that define a gas mixing region, and a face plate fastened to the adapter ring, a heating element positioned to heat the adapter ring to a desired temperature, and a temperature controlled exhaust system. The improvements also include a method for depositing a silicon nitride layer on a substrate, comprising vaporizing bis(tertiary-butylamino) silane, flowing the bis(tertiary-butylamino) silane into a processing chamber, flowing ammonia into a processing chamber, combining the two reactants in a mixer in the chamber lid, having an additional mixing region defined by an adapter ring and at least two blocker plates, heating the adapter ring, flowing the bis(tertiary-butylamino) silane through a gas distribution plate into a processing region above a substrate. The improvements reduce defects across the surface of the substrate and improve product yield.

US Patent:

20060102076, May 18, 2006

Filed:

Oct 7, 2005

Appl. No.:

11/245758

Inventors:

Jacob Smith - Santa Clara CA, US
Sean Seutter - San Jose CA, US
R. Iyer - St. Paul MN, US
Binh Tran - San Jose CA, US
Alexander Tam - Union City CA, US
James Wilson - New Fairfield CT, US

International Classification:

C23C 16/00

US Classification:

118715000, 427248100

Abstract:

A method and apparatus for a chemical vapor deposition (CVD) chamber provides uniform heat distribution, uniform distribution of process chemicals in the CVD chamber, and minimization of by-product and condensate residue in the chamber. The improvements include a processing chamber comprising a chamber body, a base, and a chamber lid defining a processing region, a substrate support disposed in the processing region, a gas delivery system mounted on a chamber lid, the gas delivery system comprising an adapter ring and two blocker plates that define a gas mixing region, and a face plate fastened to the adapter ring, an exhaust system mounted at the base, a heating element positioned to heat the adapter ring; and a heating element positioned to heat a portion of the exhaust system.

US Patent:

20060281310, Dec 14, 2006

Filed:

Jun 8, 2005

Appl. No.:

11/147938

Inventors:

Jacob Smith - Santa Clara CA, US
Alexander Tam - Union City CA, US
R. Iyer - Santa Clara CA, US
Sean Seutter - San Jose CA, US
Binh Tran - San Jose CA, US
Nir Merry - Mountain View CA, US
Adam Brailove - Gloucester MA, US
Robert Shydo - Andover MA, US
Robert Andrews - East Kingston NH, US
Frank Roberts - North Reading MA, US
Theodore Smick - Essex MA, US
Geoffrey Ryding - Manchester MA, US

International Classification:

H01L 21/44
C23C 16/00

US Classification:

438680000, 118719000

Abstract:

A method and apparatus for processing a substrate utilizing a rotating substrate support are disclosed herein. In one embodiment, an apparatus for processing a substrate includes a chamber having a substrate support assembly disposed within the chamber. The substrate support assembly includes a substrate support having a support surface and a heater disposed beneath the support surface. A shaft is coupled to the substrate support and a motor is coupled to the shaft through a rotor to provide rotary movement to the substrate support. A seal block is disposed around the rotor and forms a seal therewith. The seal block has at least one seal and at least one channel disposed along the interface between the seal block and the shaft. A port is coupled to each channel for connecting to a pump. A lift mechanism is coupled to the shaft for raising and lowering the substrate support.

US Patent:

20070125762, Jun 7, 2007

Filed:

Dec 1, 2005

Appl. No.:

11/293626

Inventors:

Anqing Cui - Sunnyvale CA, US
Binh Tran - San Jose CA, US
Alexander Tam - Union City CA, US
Jacob Smith - Santa Clara CA, US
R. Iyer - Santa Clara MN, US
Joseph Yudovsky - Campbell CA, US
Sean Seutter - San Jose CA, US

International Classification:

H05B 3/68

US Classification:

219444100

Abstract:

Apparatus, reactors, and methods for heating substrates are disclosed. The apparatus comprises a stage comprising a body and a surface having an area to support a substrate, a shaft coupled to the stage, a first heating element disposed within a central region of the body of the stage, and at least second and third heating elements disposed within the body of the stage, the at least second and third heating elements each partially surrounding the first heating element and wherein the at least second and third heating elements are circumferentially adjacent to each other.