Billie J Enciu

US Patent:

20080044634, Feb 21, 2008

Filed:

Aug 7, 2007

Appl. No.:

11/834775

Inventors:

Billie Jo Enciu - Richmond KY, US
Ann P. Holloway - Lexington KY, US
Paul Sacoto - Lexington KY, US
Jean Marie Saldanha Singh - Lexington KY, US

Assignee:

LEXMARK INTERNATIONAL, INC. - Lexington KY

International Classification:

B05D 5/00
B32B 3/00
H01B 1/00

US Classification:

428209, 252500, 427212

Abstract:

Printed circuits having conductive traces applied adjacent to a substrate, such as one where the traces have a resistivity of from about 1 to about 0.1 ohms/square, and methods for forming a fluid composition receiving layer adjacent to a substrate. One such method includes depositing a primary treatment fluid having a particle dispersion and a binder in a carrier fluid adjacent to at least a portion of a substrate to provide a treated substrate having a fluid composition receiving layer. The primary treatment fluid is deposited in a pattern using a: micro-fluid ejection head. After deposition, the carrier fluid content of the fluid composition receiving layer is reduced.

US Patent:

20080236444, Oct 2, 2008

Filed:

Mar 30, 2007

Appl. No.:

11/693964

Inventors:

Billie Jo Enciu - Lexington KY, US
Elaine Yeap Money - Lexington KY, US

International Classification:

C09D 11/00

US Classification:

106 3113

Abstract:

The present invention provides an aqueous ink containing ≧3% silver particles having much improved adhesion. It has been found that the adhesion can be improved by adding an aqueous cationic dispersion of a styrene/acrylate copolymer, PEI (polyethyleneimine), or arabinogalactan as an additive to the ink. The advantage of using one of these materials to improve the adhesion of the silver ink is the stability of the ink is maintained and the resistivity goal is met when printed onto the specified media. In other words, this invention provides a silver ink with great adhesion properties while still able to meet the