Ben M Karr

US Patent:

7181357, Feb 20, 2007

Filed:

Sep 8, 2005

Appl. No.:

11/220913

Inventors:

Efraim Rotem - Haifa, IL
Barnes Cooper - Tigard OR, US
Ben Karr - Sunnyvale CA, US
Ravi Rangarajan - Bangalore, IN

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G01K 15/00
G01K 1/00
G01K 3/00

US Classification:

702 99, 702130, 702132, 374110, 374166

Abstract:

Briefly, a processor and a method to calibrate a temperature reading of a digital thermometer. The calibration is done by using a first temperature value measured by an analog temperature sensor located at one point on the processor die and a second temperature value measured by a digital temperature sensor located at a second point of the processor die.

US Patent:

20070005152, Jan 4, 2007

Filed:

Jun 30, 2005

Appl. No.:

11/173993

Inventors:

Ben Karr - Sunnyvale CA, US
James Hermerding - San Jose CA, US
Efraim Rotem - Haifa, IL
Oren Lamdan - Kiryat Tivon, IL

International Classification:

G05B 11/01
G06F 1/00

US Classification:

700022000, 713323000

Abstract:

A method includes measuring a temperature of a device, determining a voltage applied to the device, determining a leakage power for the device in real time based on the measured temperature and determined voltage and estimating an active power for the device. The method also includes adding the determined leakage power and the estimated active power to estimate a total power value associated with the device, and controlling the device based on the total power value.

US Patent:

6657859, Dec 2, 2003

Filed:

Jun 30, 2000

Appl. No.:

09/608592

Inventors:

Ben Karr - San Jose CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361687, 361695, 361697, 16510421, 16510433, 454184

Abstract:

A computing device and a device bay heat exchanger. The device bay heat exchanger includes a first heat transfer element and a second heat transfer element. The first heat transfer element has a portion thermally coupled to an electronic component. The first and the second heat transfer element conformally engage each other yet are removable from each other.